型号 功能描述 生产厂家 企业 LOGO 操作
LMG3410R070RWHT

LMG341xR070 600-V 70-mΩ GaN with Integrated Driver and Protection

1 Features 1• TI GaN Process Qualified Through Accelerated Reliability In-application Hard-switching Mission Profiles • Enables High Density Power Conversion Designs – Superior System Performance Over Cascode or Stand-alone GaN FETs – Low Inductance 8mm x 8mm QFN Package for Ease of Design

TI

德州仪器

LMG3410R070RWHT

LMG341xR070 600-V 70-mΩ GaN with Integrated Driver and Protection

1 Features 1• TI GaN Process Qualified Through Accelerated Reliability In-application Hard-switching Mission Profiles • Enables High Density Power Conversion Designs – Superior System Performance Over Cascode or Stand-alone GaN FETs – Low Inductance 8mm x 8mm QFN Package for Ease of Design

TI

德州仪器

LMG3410R070RWHT

600-V 70-m(ohm) GaN with Integrated Driver and Protection

文件:1.42382 Mbytes Page:33 Pages

TI

德州仪器

LMG3410R070RWHT

封装/外壳:32-VQFN 裸露焊盘 包装:管件 描述:PWR MGMT MOSFET/PWR DRIVER 集成电路(IC) 配电开关,负载驱动器

TI

德州仪器

LMG3410R070RWHT

600-V 70-m(ohm) GaN with Integrated Driver and Protection

文件:1.40304 Mbytes Page:32 Pages

TI

德州仪器

LMG341xR070 600-V 70-mΩ GaN with Integrated Driver and Protection

1 Features 1• TI GaN Process Qualified Through Accelerated Reliability In-application Hard-switching Mission Profiles • Enables High Density Power Conversion Designs – Superior System Performance Over Cascode or Stand-alone GaN FETs – Low Inductance 8mm x 8mm QFN Package for Ease of Design

TI

德州仪器

LMG341xR070 600-V 70-mΩ GaN with Integrated Driver and Protection

1 Features 1• TI GaN Process Qualified Through Accelerated Reliability In-application Hard-switching Mission Profiles • Enables High Density Power Conversion Designs – Superior System Performance Over Cascode or Stand-alone GaN FETs – Low Inductance 8mm x 8mm QFN Package for Ease of Design

TI

德州仪器

600-V 70-m(ohm) GaN with Integrated Driver and Protection

文件:1.42382 Mbytes Page:33 Pages

TI

德州仪器

600-V 70-m(ohm) GaN with Integrated Driver and Protection

文件:1.40304 Mbytes Page:32 Pages

TI

德州仪器

LMG341xR070 600-V 70-mΩ GaN with Integrated Driver and Protection

1 Features 1• TI GaN Process Qualified Through Accelerated Reliability In-application Hard-switching Mission Profiles • Enables High Density Power Conversion Designs – Superior System Performance Over Cascode or Stand-alone GaN FETs – Low Inductance 8mm x 8mm QFN Package for Ease of Design

TI

德州仪器

LMG341xR070 600-V 70-mΩ GaN with Integrated Driver and Protection

1 Features 1• TI GaN Process Qualified Through Accelerated Reliability In-application Hard-switching Mission Profiles • Enables High Density Power Conversion Designs – Superior System Performance Over Cascode or Stand-alone GaN FETs – Low Inductance 8mm x 8mm QFN Package for Ease of Design

TI

德州仪器

LMG341xR070 600-V 70-mΩ GaN with Integrated Driver and Protection

1 Features 1• TI GaN Process Qualified Through Accelerated Reliability In-application Hard-switching Mission Profiles • Enables High Density Power Conversion Designs – Superior System Performance Over Cascode or Stand-alone GaN FETs – Low Inductance 8mm x 8mm QFN Package for Ease of Design

TI

德州仪器

LMG341xR070 600-V 70-mΩ GaN with Integrated Driver and Protection

1 Features 1• TI GaN Process Qualified Through Accelerated Reliability In-application Hard-switching Mission Profiles • Enables High Density Power Conversion Designs – Superior System Performance Over Cascode or Stand-alone GaN FETs – Low Inductance 8mm x 8mm QFN Package for Ease of Design

TI

德州仪器

LMG341xR070 600-V 70-mΩ GaN with Integrated Driver and Protection

1 Features 1• TI GaN Process Qualified Through Accelerated Reliability In-application Hard-switching Mission Profiles • Enables High Density Power Conversion Designs – Superior System Performance Over Cascode or Stand-alone GaN FETs – Low Inductance 8mm x 8mm QFN Package for Ease of Design

TI

德州仪器

LMG341xR070 600-V 70-mΩ GaN with Integrated Driver and Protection

1 Features 1• TI GaN Process Qualified Through Accelerated Reliability In-application Hard-switching Mission Profiles • Enables High Density Power Conversion Designs – Superior System Performance Over Cascode or Stand-alone GaN FETs – Low Inductance 8mm x 8mm QFN Package for Ease of Design

TI

德州仪器

LMG341xR070 600-V 70-mΩ GaN with Integrated Driver and Protection

1 Features 1• TI GaN Process Qualified Through Accelerated Reliability In-application Hard-switching Mission Profiles • Enables High Density Power Conversion Designs – Superior System Performance Over Cascode or Stand-alone GaN FETs – Low Inductance 8mm x 8mm QFN Package for Ease of Design

TI

德州仪器

LMG341xR070 600-V 70-mΩ GaN with Integrated Driver and Protection

1 Features 1• TI GaN Process Qualified Through Accelerated Reliability In-application Hard-switching Mission Profiles • Enables High Density Power Conversion Designs – Superior System Performance Over Cascode or Stand-alone GaN FETs – Low Inductance 8mm x 8mm QFN Package for Ease of Design

TI

德州仪器

LMG341xR070 600-V 70-mΩ GaN with Integrated Driver and Protection

1 Features 1• TI GaN Process Qualified Through Accelerated Reliability In-application Hard-switching Mission Profiles • Enables High Density Power Conversion Designs – Superior System Performance Over Cascode or Stand-alone GaN FETs – Low Inductance 8mm x 8mm QFN Package for Ease of Design

TI

德州仪器

600-V 70-m(ohm) GaN with Integrated Driver and Protection

文件:1.40304 Mbytes Page:32 Pages

TI

德州仪器

更新时间:2026-2-17 11:18:00
IC供应商 芯片型号 品牌 批号 封装 库存 备注 价格
TI(德州仪器)
25+
N/A
6000
原装,请咨询
TI/德州仪器
23+
VQFN-32
13000
原厂授权一级代理,专业海外优势订货,价格优势、品种
TI/德州仪器
23+
32-VQFN
4256
原装正品代理渠道价格优势
TI(德州仪器)
23+
NA
20094
正纳10年以上分销经验原装进口正品做服务做口碑有支持
TI(德州仪器)
2021+
8000
原装现货,欢迎询价
TI/德州仪器
25+
SMD
860000
明嘉莱只做原装正品现货
TI(德州仪器)
26+
N/A
360000
只有原装 可配单
TI(德州仪器)
23+
N/A
6000
公司只做原装,可来电咨询
TI/德州仪器
2026+
32-VQFN
65248
百分百原装现货 实单必成
TI/德州仪器
2022+
VQFN-32
8000
只做原装,可提供样品

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