型号 功能描述 生产厂家 企业 LOGO 操作
LM04

Low Profile Miniature Single Phase Surface Mount Bridge Rectifiers

Features • Glass passivated standard bridge rectifiers • Ideal for automated placement • Low forward voltage drop • Low leakage current • Moisture sensitivity: level 1, per J-STD-020 • Solder dip 260 °C, 10 s • Low profile, Max Height 1.30mm Typical Applications For use of general pur

Good-Ark

固锝电子

CRI 75 White LED

Introduction B05 series is a high power, multi-chip device with very low thermal resistance as a result of the PCB substrate. The series is a surface-mount high-power device featuring high brightness that is suitable for all kinds of lighting applications such as general illumination, spot, signa

Everlight

台湾亿光

CRI 75 White LED

Introduction B05 series is a high power, multi-chip device with very low thermal resistance as a result of the PCB substrate. The series is a surface-mount high-power device featuring high brightness that is suitable for all kinds of lighting applications such as general illumination, spot, signa

Everlight

台湾亿光

CRI 75 White LED

Introduction B05 series is a high power, multi-chip device with very low thermal resistance as a result of the PCB substrate. The series is a surface-mount high-power device featuring high brightness that is suitable for all kinds of lighting applications such as general illumination, spot, signa

Everlight

台湾亿光

CRI 75 White LED

Introduction B05 series is a high power, multi-chip device with very low thermal resistance as a result of the PCB substrate. The series is a surface-mount high-power device featuring high brightness that is suitable for all kinds of lighting applications such as general illumination, spot, signa

Everlight

台湾亿光

CRI 75 White LED

Introduction B05 series is a high power, multi-chip device with very low thermal resistance as a result of the PCB substrate. The series is a surface-mount high-power device featuring high brightness that is suitable for all kinds of lighting applications such as general illumination, spot, signa

Everlight

台湾亿光

This specification applies to Wire Wound Ceramic Chip Inductors

文件:2.40801 Mbytes Page:6 Pages

LEIDITECH

雷卯电子

This specification applies to Wire Wound Ceramic Chip Inductors

文件:2.40801 Mbytes Page:6 Pages

LEIDITECH

雷卯电子

This specification applies to Wire Wound Ceramic Chip Inductors

文件:2.40801 Mbytes Page:6 Pages

LEIDITECH

雷卯电子

This specification applies to Wire Wound Ceramic Chip Inductors

文件:2.40801 Mbytes Page:6 Pages

LEIDITECH

雷卯电子

This specification applies to Wire Wound Ceramic Chip Inductors

文件:2.40801 Mbytes Page:6 Pages

LEIDITECH

雷卯电子

This specification applies to Wire Wound Ceramic Chip Inductors

文件:2.40801 Mbytes Page:6 Pages

LEIDITECH

雷卯电子

This specification applies to Wire Wound Ceramic Chip Inductors

文件:2.40801 Mbytes Page:6 Pages

LEIDITECH

雷卯电子

This specification applies to Wire Wound Ceramic Chip Inductors

文件:2.40801 Mbytes Page:6 Pages

LEIDITECH

雷卯电子

This specification applies to Wire Wound Ceramic Chip Inductors

文件:2.40801 Mbytes Page:6 Pages

LEIDITECH

雷卯电子

This specification applies to Wire Wound Ceramic Chip Inductors

文件:2.40801 Mbytes Page:6 Pages

LEIDITECH

雷卯电子

This specification applies to Wire Wound Ceramic Chip Inductors

文件:2.40801 Mbytes Page:6 Pages

LEIDITECH

雷卯电子

This specification applies to Wire Wound Ceramic Chip Inductors

文件:2.40801 Mbytes Page:6 Pages

LEIDITECH

雷卯电子

This specification applies to Wire Wound Ceramic Chip Inductors

文件:2.40801 Mbytes Page:6 Pages

LEIDITECH

雷卯电子

This specification applies to Wire Wound Ceramic Chip Inductors

文件:2.40801 Mbytes Page:6 Pages

LEIDITECH

雷卯电子

This specification applies to Wire Wound Ceramic Chip Inductors

文件:2.40801 Mbytes Page:6 Pages

LEIDITECH

雷卯电子

This specification applies to Wire Wound Ceramic Chip Inductors

文件:2.40801 Mbytes Page:6 Pages

LEIDITECH

雷卯电子

This specification applies to Wire Wound Ceramic Chip Inductors

文件:2.40801 Mbytes Page:6 Pages

LEIDITECH

雷卯电子

This specification applies to Wire Wound Ceramic Chip Inductors

文件:2.40801 Mbytes Page:6 Pages

LEIDITECH

雷卯电子

This specification applies to Wire Wound Ceramic Chip Inductors

文件:2.40801 Mbytes Page:6 Pages

LEIDITECH

雷卯电子

This specification applies to Wire Wound Ceramic Chip Inductors

文件:2.40801 Mbytes Page:6 Pages

LEIDITECH

雷卯电子

This specification applies to Wire Wound Ceramic Chip Inductors

文件:2.40801 Mbytes Page:6 Pages

LEIDITECH

雷卯电子

This specification applies to Wire Wound Ceramic Chip Inductors

文件:2.40801 Mbytes Page:6 Pages

LEIDITECH

雷卯电子

This specification applies to Wire Wound Ceramic Chip Inductors

文件:2.40801 Mbytes Page:6 Pages

LEIDITECH

雷卯电子

This specification applies to Wire Wound Ceramic Chip Inductors

文件:2.40801 Mbytes Page:6 Pages

LEIDITECH

雷卯电子

This specification applies to Wire Wound Ceramic Chip Inductors

文件:2.40801 Mbytes Page:6 Pages

LEIDITECH

雷卯电子

This specification applies to Wire Wound Ceramic Chip Inductors

文件:2.40801 Mbytes Page:6 Pages

LEIDITECH

雷卯电子

This specification applies to Wire Wound Ceramic Chip Inductors

文件:2.40801 Mbytes Page:6 Pages

LEIDITECH

雷卯电子

This specification applies to Wire Wound Ceramic Chip Inductors

文件:2.40801 Mbytes Page:6 Pages

LEIDITECH

雷卯电子

This specification applies to Wire Wound Ceramic Chip Inductors

文件:2.40801 Mbytes Page:6 Pages

LEIDITECH

雷卯电子

This specification applies to Wire Wound Ceramic Chip Inductors

文件:2.40801 Mbytes Page:6 Pages

LEIDITECH

雷卯电子

This specification applies to Wire Wound Ceramic Chip Inductors

文件:2.40801 Mbytes Page:6 Pages

LEIDITECH

雷卯电子

This specification applies to Wire Wound Ceramic Chip Inductors

文件:2.40801 Mbytes Page:6 Pages

LEIDITECH

雷卯电子

This specification applies to Wire Wound Ceramic Chip Inductors

文件:2.40801 Mbytes Page:6 Pages

LEIDITECH

雷卯电子

This specification applies to Wire Wound Ceramic Chip Inductors

文件:2.40801 Mbytes Page:6 Pages

LEIDITECH

雷卯电子

This specification applies to Wire Wound Ceramic Chip Inductors

文件:2.40801 Mbytes Page:6 Pages

LEIDITECH

雷卯电子

This specification applies to Wire Wound Ceramic Chip Inductors

文件:2.40801 Mbytes Page:6 Pages

LEIDITECH

雷卯电子

This specification applies to Wire Wound Ceramic Chip Inductors

文件:2.40801 Mbytes Page:6 Pages

LEIDITECH

雷卯电子

This specification applies to Wire Wound Ceramic Chip Inductors

文件:2.40801 Mbytes Page:6 Pages

LEIDITECH

雷卯电子

This specification applies to Wire Wound Ceramic Chip Inductors

文件:2.40801 Mbytes Page:6 Pages

LEIDITECH

雷卯电子

This specification applies to Wire Wound Ceramic Chip Inductors

文件:2.40801 Mbytes Page:6 Pages

LEIDITECH

雷卯电子

This specification applies to Wire Wound Ceramic Chip Inductors

文件:2.40801 Mbytes Page:6 Pages

LEIDITECH

雷卯电子

This specification applies to Wire Wound Ceramic Chip Inductors

文件:2.40801 Mbytes Page:6 Pages

LEIDITECH

雷卯电子

This specification applies to Wire Wound Ceramic Chip Inductors

文件:2.40801 Mbytes Page:6 Pages

LEIDITECH

雷卯电子

This specification applies to Wire Wound Ceramic Chip Inductors

文件:2.40801 Mbytes Page:6 Pages

LEIDITECH

雷卯电子

This specification applies to Wire Wound Ceramic Chip Inductors

文件:2.40801 Mbytes Page:6 Pages

LEIDITECH

雷卯电子

This specification applies to Wire Wound Ceramic Chip Inductors

文件:2.40801 Mbytes Page:6 Pages

LEIDITECH

雷卯电子

This specification applies to Wire Wound Ceramic Chip Inductors

文件:2.40801 Mbytes Page:6 Pages

LEIDITECH

雷卯电子

This specification applies to Wire Wound Ceramic Chip Inductors

文件:2.40801 Mbytes Page:6 Pages

LEIDITECH

雷卯电子

This specification applies to Wire Wound Ceramic Chip Inductors

文件:2.40801 Mbytes Page:6 Pages

LEIDITECH

雷卯电子

This specification applies to Wire Wound Ceramic Chip Inductors

文件:2.40801 Mbytes Page:6 Pages

LEIDITECH

雷卯电子

This specification applies to Wire Wound Ceramic Chip Inductors

文件:2.40801 Mbytes Page:6 Pages

LEIDITECH

雷卯电子

This specification applies to Wire Wound Ceramic Chip Inductors

文件:2.40801 Mbytes Page:6 Pages

LEIDITECH

雷卯电子

This specification applies to Wire Wound Ceramic Chip Inductors

文件:2.40801 Mbytes Page:6 Pages

LEIDITECH

雷卯电子

This specification applies to Wire Wound Ceramic Chip Inductors

文件:2.40801 Mbytes Page:6 Pages

LEIDITECH

雷卯电子

LM04产品属性

  • 类型

    描述

  • 型号

    LM04

  • 制造商

    HITACHI DISPLAY LTD

  • 功能描述

    LCD DISPLAY

更新时间:2025-12-24 10:53:00
IC供应商 芯片型号 品牌 批号 封装 库存 备注 价格
HITACHI
25+23+
New
30643
绝对原装正品现货,全新深圳原装进口现货
ICECOMPONENTS
24+
5.7x5.2x2.8mm
12500
专业电感电容电阻一站式配套齐可售样品
大东
2025+
DIP
32000
原装正品现货供应商原厂渠道物美价优
DAITO/大东
2022+
4000
原厂代理 终端免费提供样品
ROHM
24+
DIP
4290
NK/南科功率
2025+
SOT-223-3
986966
国产
TI/德州仪器
24+
NA/
3000
优势代理渠道,原装正品,可全系列订货开增值税票
TI/德州仪器
23+
BGA
50000
全新原装正品现货,支持订货
ICECOMPONENTS
23+
5.7x5.2x2.8mm
13000
原厂授权一级代理,专业海外优势订货,价格优势、品种
TI
三年内
1983
只做原装正品

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