MURATA Low ESL Ceramic Chip Capacitors

Features: • Low ESL: 80 to 120pH. Suitable for high speed (800MHz to 4GHz) IC decoupling. • Operating Temperature: X7R: -55°C to 125°C w/ a ±15 cap change over temperature range. X7S: -55°C to 125°C w/ a ±22 cap change over temperature range. Features: • Low ESL: 35 to 45pH. Suitable for hi

Chip Monolithic Ceramic Capacitors

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MURATA Low ESL Ceramic Chip Capacitors

Features: • Low ESL: 80 to 120pH. Suitable for high speed (800MHz to 4GHz) IC decoupling. • Operating Temperature: X7R: -55°C to 125°C w/ a ±15 cap change over temperature range. X7S: -55°C to 125°C w/ a ±22 cap change over temperature range. Features: • Low ESL: 35 to 45pH. Suitable for hi

MURATA Low ESL Ceramic Chip Capacitors

Features: • Low ESL: 80 to 120pH. Suitable for high speed (800MHz to 4GHz) IC decoupling. • Operating Temperature: X7R: -55°C to 125°C w/ a ±15 cap change over temperature range. X7S: -55°C to 125°C w/ a ±22 cap change over temperature range. Features: • Low ESL: 35 to 45pH. Suitable for hi

MURATA Low ESL Ceramic Chip Capacitors

Features: • Low ESL: 80 to 120pH. Suitable for high speed (800MHz to 4GHz) IC decoupling. • Operating Temperature: X7R: -55°C to 125°C w/ a ±15 cap change over temperature range. X7S: -55°C to 125°C w/ a ±22 cap change over temperature range. Features: • Low ESL: 35 to 45pH. Suitable for hi

MURATA Low ESL Ceramic Chip Capacitors

Features: • Low ESL: 80 to 120pH. Suitable for high speed (800MHz to 4GHz) IC decoupling. • Operating Temperature: X7R: -55°C to 125°C w/ a ±15 cap change over temperature range. X7S: -55°C to 125°C w/ a ±22 cap change over temperature range. Features: • Low ESL: 35 to 45pH. Suitable for hi

10 Terminals Low ESL Chip Multilayer Ceramic Capacitors for General Purpose

10 Terminals Low ESL Chip Multilayer Ceramic Capacitors for General Purpose

10 Terminals Low ESL Chip Multilayer Ceramic Capacitors for General Purpose

Card Edge Connectors 0.156” (3.96mm) Pitch

Features: • 0.156” (3.96mm) contact spacing x 0.140” (3.56mm) row spacing • Accepts 0.062” (1.57mm) nominal thickness P.C. board • Low profile insulator body, 0.470” (11.94mm) • Contact termination options include P.C. tail, wire hole, extender board bends • Dual row configuration • Large va

310, 315 All-Welded “Mini” Diaphragm Seal

FEATURES No gaskets or bolts Available with 1⁄8 NPT flushing connection Designed for use with transducers and 31/2˝ or smaller gauges

ROD SEALS

DESCRIPTION The BECA 315 profile is a single acting buffer rod seal composed of a profiled polyurethane triple lip seal and a POM back-up ring on the back. APPLICATIONS Agriculture Mobile machinery Injection presses Hydraulic cylinders

IEC60309 PIN & SLEEVE DEVICES • LIGHT & STAGE DEVICES

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IEC60309 PIN & SLEEVE DEVICES • LIGHT & STAGE DEVICES

文件：401.49 Kbytes Page：2 Pages