FPGA和CPLD

封装/外壳：100-LFBGA，CSPBGA 包装：托盘 描述：IC FPGA 78 I/O 100CSBGA 集成电路（IC） FPGA（现场可编程门阵列）

封装/外壳：100-LFBGA，CSPBGA 包装：托盘 描述：IC FPGA 78 I/O 100CSBGA 集成电路（IC） FPGA（现场可编程门阵列）

PGA ZIF Test & Burn-in Socket for Any Footprint on Std 8x8 to 21x21 Grid

FEATURES • Strong Metal Cam Activates Normally-closed Contacts, Preventing Dependency on Plastic for Contact Force • Handle mounted on Right- or Left-hand Side • Any Footprint Accepted on Standard 13x13 to 21x21 Grid GENERAL SPECIFICATIONS • SOCKET BODY: black UL 94V-0 Polyphenylene Sulfid

32-bit ARM7TDMI RISC static CMOS CPU core

OVERVIEW The HMS30C7202 is a highly integrated low power microprocessor for personal digital assistants, and other applications described below. The device incorporates an ARM720T CPU and system interface logic to interface with various types of devices. HMS30C7202 is a highly modular design base

MAGNETIC-LATCHING DPDT HALF-SIZE CRYSTAL CAN MILITARY RELAY

文件：1.11117 Mbytes Page：3 Pages

3M??Scotch짰 Printable Flatback Paper Tape 256

文件：564.56 Kbytes Page：5 Pages

256b/257b Transcoding for 100 Gb/s Backplane and Copper Cable

文件：343.53 Kbytes Page：21 Pages