Audio Frequency Amplifier & High Frequency OSC.

Features • Audio Frequency Amplifier and High-Frequency OSC. • Complimentary to KSA733 • Collector-Base Voltage: VCBO = 60 V • High Current Gain Bandwidth Product: fT = 300 MHz (Tyical) • Suffix “-C” means Center Collector (1. Emitter 2. Collector 3. Base)

Audio Frequency Amplifier High Frequency OSC.

Features • Audio Frequency Amplifier and High-Frequency OSC. • Complimentary to KSA733 • Collector-Base Voltage: VCBO = 60 V • High Current Gain Bandwidth Product: fT = 300 MHz (Tyical) • Suffix “-C” means Center Collector (1. Emitter 2. Collector 3. Base)

Audio Frequency Amplifier & High Frequency OSC.

Features • Audio Frequency Amplifier and High-Frequency OSC. • Complimentary to KSA733 • Collector-Base Voltage: VCBO = 60 V • High Current Gain Bandwidth Product: fT = 300 MHz (Tyical) • Suffix “-C” means Center Collector (1. Emitter 2. Collector 3. Base)

封装/外壳：TO-226-3，TO-92-3 标准主体（!--TO-226AA） 包装：卷带（TR）剪切带（CT）Digi-Reel® 得捷定制卷带 描述：TRANS NPN 50V 0.15A TO92-3 分立半导体产品 晶体管 - 双极性晶体管（BJT）- 单个

封装/外壳：TO-226-3，TO-92-3（TO-226AA）成形引线 包装：卷带（TR）剪切带（CT）Digi-Reel® 得捷定制卷带 描述：TRANS NPN 50V 0.15A TO92-3 分立半导体产品 晶体管 - 双极性晶体管（BJT）- 单个

SB® 175 Connectors Up to 280 Amps

Wires sizes from 10 to 1/0 AWG (5.3 to 50 mm²) fit in the second to largest connector in the SB® series. The 3 pole SB® 175 adds an additional position for power or grounding. All Multipole wire connector housings are genderless and mate to themselves minimizing inventory and assembly complex

CONN PLUG USB3.0 MICRO USB B SLD

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Mobile Intel짰 945GME Express Chipset for Embedded Computing

文件：156.64 Kbytes Page：2 Pages

Mobile Intel짰 945GSE Express Chipset for Embedded Computing

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P-Channel MOSFET

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