位置：首页 > IC中文资料 > KLMBG2JETD
| 型号 | 功能描述 | 生产厂家&企业 | LOGO | 操作 |
|---|---|---|---|---|
KLMBG2JETD | Samsung eMMC Product family eMMC 5.1 Specification compatibility 文件：424.96 Kbytes Page：28 Pages | Samsung 三星 |   | |
Samsung eMMC Product family eMMC 5.1 Specification compatibility 文件：424.96 Kbytes Page：28 Pages | Samsung 三星 | |
| IC供应商 | 芯片型号 | 品牌 | 批号 | 封装 | 库存 | 备注 | 价格 |
|---|---|---|---|---|---|---|---|
SAMSUNG |
19+ |
FBGA |
26806 |
||||
SAMSUNG |
24+ |
BGA153 |
10408 |
原厂可订货,技术支持,直接渠道。可签保供合同 |
|||
SAMSUNG(三星) |
24+ |
- |
37048 |
原厂可订货,技术支持,直接渠道。可签保供合同 |
|||
SAMSUNG(三星) |
25+ |
FBGA-153 |
3000 |
全新、原装 |
|||
SAMSUNG/三星 |
24+ |
BGA |
20000 |
原装正品支持实单 |
|||
SAMSUNG(三星半导体) |
24+ |
22400 |
支持样品,原装现货,提供技术支持! |
||||
SAMSUNG(三星半导体) |
2021+ |
FBGA-153 |
1563 |
||||
SAMSUNG/三星 |
22+ |
BGA |
20000 |
原装正品现货 |
|||
SAMSUNG |
24+ |
BGA153 |
14000 |
全网最低/原装现货 |
|||
SAMSUNG |
25+ |
FBGA153 |
4480 |
原厂原装,价格优势 |
KLMBG2JETD芯片相关品牌
KLMBG2JETD规格书下载地址
KLMBG2JETD参数引脚图相关
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- KLN500B1/8
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KLMBG2JETD数据表相关新闻
KLMBG2JETD-B041中文资料三星存储芯片现货供应中文资料PDF
KLMBG2JETD-B041 中文资料 三星存储芯片 现货供应 中文资料 PDF
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2022-10-27KLUCG4J1ZD-B0CP
KLUCG4J1ZD-B0CP RICHTEK/立锜 2020 QFN KLUCG4J1ED-B0C1 RICHTEK/立锜 2018+ QFN KLUCG4J1ZD-B0CQ RICHTEK/立锜 2020 QFN KLUCG4J1BB-B0B1 RICHTEK/立锜 2018+ QFN TYD0GH121661RA 内存芯片 MICRON/美光 2019+ BGA TYD0GH121661RA MICRON/美光 2019+ BGA LM317K MICRON/美光 2020 BGA MMZ0603D560CT000 MICRON/美光
2021-5-26KLMAG4FEJA-A001
KLMAG4FEJA-A001 KINGSTON 2020 BGA TPS659II0A2 KINGSTON 2018+ BGA A20 KINGSTON 2020 BGA pm8917 KINGSTON 2018+ BGA RT9376GQW 内存芯片 SPREADTR 2018+ QFN RT9376GQW SPREADTR 2020 QFN RT8020PQW 内存芯片 QUALCOMM/高通 2020 BGA RT8020GQW QUALCOMM/高通 2018+ BGA RT8020PQW QUALCOMM/高通 2018+ BGA MT
2021-5-26KM68U4000CLTGI-10L，KPT3216YDC4，KSA992FTA，L-59SRSGC-CC-14.6HB-TNR01，LBT676-K2E7510，LDC21897M19D-078，LGA67K-H2-2-0-R33，LGK380NRE7504
KM68U4000CLTGI-10L，KPT3216YDC4，KSA992FTA，L-59SRSGC-CC-14.6HB-TNR01，LB T676-K2 E7510，LDC21897M19D-078，LGA67K-H2-2-0-R33，LGK380NRE7504
2019-12-8
DdatasheetPDF页码索引
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