型号 功能描述 生产厂家 企业 LOGO 操作

Mini-Clamp Socket

• Designed to accommodate typical wiring specifications per Japanese and Asian suppliers • Latches available for Panel Mount applications • No special wire preparation • Integrated cable retention • Design accepts multiple wire size diameters • Easy, quick, and reliable IDC termination using

3M

Celeron M Processor on 90 nm Process

文件:879.41 Kbytes Page:68 Pages

Intel

英特尔

SUBMINIATURE FUSES

文件:78.05 Kbytes Page:2 Pages

Littelfuse

力特

High Performance Box Sealing Tape

文件:14.73 Kbytes Page:2 Pages

3M

Work horse clamp with increased performance and flexibility

文件:97.97 Kbytes Page:2 Pages

FLUKE

福禄克

更新时间:2025-12-25 10:39:01
IC供应商 芯片型号 品牌 批号 封装 库存 备注 价格
MEC
25+
DIP4
3629
原装优势!房间现货!欢迎来电!
ICS
25+
SOP
755
百分百原装正品 真实公司现货库存 本公司只做原装 可
N/A
2023+
QFN
50000
原装现货
MURATA/村田
2015+ROHS
SMD
91550
原装进口价格优势大量现货供应
ZILOG
00/01+
SMD28
425
全新原装100真实现货供应
ST
25+
BGA-24D
16900
原装,请咨询
TI
23+
MSOP8
5000
全新原装,支持实单,非诚勿扰
IDT
24+
SOP
54000
郑重承诺只做原装进口现货
IDT
24+
SOP
9600
原装现货,优势供应,支持实单!
ICS
22+
TSSOP16
8000
原装正品支持实单

K373GR数据表相关新闻

  • K4059G-SOT723R-B-TG_UTC代理商

    K4059G-SOT723R-B-TG_UTC代理商

    2023-2-8
  • K32L2B31VMP0A

    K32L2B31VMP0A

    2021-6-10
  • K3RG2G20BM-AGCH

    K3RG2G20BM-AGCH SAMSUNG/三星 2020 BGA KBY00N00HA-B448 TI/德州仪器 KBY00N00HA-A448 TI/德州仪器 2020 KAV00Q013M-A447 ALLWINNER/全志 16+ BGA441 APQ8055 QUALCOMM/高通 2020 BGA K4EBE304EB-EGCF RICHTEK/立锜 2018+ QFN K4EBE324EB-EGCG RICHTEK/立锜 2018+ QFN RC2512FK-073RL RICHTEK/立锜 2020 QFN PM

    2021-5-26
  • K3RG2G20BM-AGCH

    K3RG2G20BM-AGCH SAMSUNG/三星 2020 BGA KBY00N00HA-B448 TI/德州仪器 KBY00N00HA-A448 TI/德州仪器 2020 KAV00Q013M-A447 ALLWINNER/全志 16+ BGA441 APQ8055 QUALCOMM/高通 2020 BGA K4EBE304EB-EGCF RICHTEK/立锜 2018+ QFN K4EBE324EB-EGCG RICHTEK/立锜 2018+ QFN RC2512FK-073RL RICHTEK/立锜 2020 QFN PM

    2021-5-26
  • K24C02C-SIRGA

    K24C02C-SIRGA,当天发货0755-82732291全新原装现货或门市自取.

    2020-10-2
  • K2698

    K2698,全新原装当天发货或门市自取0755-82732291.

    2019-11-14