FEATURES

• High-speed access times: 8, 10, 20 ns

• High-performance, low-power CMOS process

• Multiple center power and ground pins for

greater noise immunity

• Easy memory expansion with CE and OE options

• CE power-down

• Fully static operation: no clock or refresh

required

• TTL compatible inputs and outputs

• Packages available:

– 48-ball miniBGA (6mm x 8mm)

– 44-pin TSOP (Type II)

• Industrial and Automotive Temperature Support

• Lead-free available