Features

• Highly robust 750V technology, 100% avalanche tested

• Best‑in‑class RDS(on) x Qfr

• Excellent RDS(on) x Qoss and RDS(on) x QG

• Unique combination of low Crss/Ciss and high VGS(th)

• Infineon proprietary die attach technology

• Cutting edge TSC package with material group I

• Driver source pin available

Benefits

• Enhanced robustness and reliability for bus voltages beyond 500 V

• Superior efficiency in hard switching

• Higher switching frequency in soft switching topologies

• Robustness against parasitic turn on for unipolar gate driving

• Best‑in‑class thermal dissipation

• Reduced switching losses through improved gate control