型号 功能描述 生产厂家 企业 LOGO 操作

512K x36 and 1024K x18 18Mb SYNCHRONOUS PIPELINED SINGLE CYCLE DESELECT STATIC RAM

FEATURES • Internal self-timed write cycle • Individual Byte Write Control and Global Write • Clock controlled, registered address, data and • control • Burst sequence control using MODE input • Three chip enable option for simple depth expansion and address pipelining • Common data inputs

ISSI

矽成半导体

512K x36 and 1024K x18 18Mb SYNCHRONOUS PIPELINED SINGLE CYCLE DESELECT STATIC RAM

FEATURES • Internal self-timed write cycle • Individual Byte Write Control and Global Write • Clock controlled, registered address, data and • control • Burst sequence control using MODE input • Three chip enable option for simple depth expansion and address pipelining • Common data inputs

ISSI

矽成半导体

512K x36 and 1024K x18 18Mb SYNCHRONOUS PIPELINED SINGLE CYCLE DESELECT STATIC RAM

FEATURES • Internal self-timed write cycle • Individual Byte Write Control and Global Write • Clock controlled, registered address, data and • control • Burst sequence control using MODE input • Three chip enable option for simple depth expansion and address pipelining • Common data inputs

ISSI

矽成半导体

512K x36 and 1024K x18 18Mb SYNCHRONOUS PIPELINED SINGLE CYCLE DESELECT STATIC RAM

FEATURES • Internal self-timed write cycle • Individual Byte Write Control and Global Write • Clock controlled, registered address, data and • control • Burst sequence control using MODE input • Three chip enable option for simple depth expansion and address pipelining • Common data inputs

ISSI

矽成半导体

512K x36 and 1024K x18 18Mb SYNCHRONOUS PIPELINED SINGLE CYCLE DESELECT STATIC RAM

FEATURES • Internal self-timed write cycle • Individual Byte Write Control and Global Write • Clock controlled, registered address, data and • control • Burst sequence control using MODE input • Three chip enable option for simple depth expansion and address pipelining • Common data inputs

ISSI

矽成半导体

512K x36 and 1024K x18 18Mb SYNCHRONOUS PIPELINED SINGLE CYCLE DESELECT STATIC RAM

FEATURES • Internal self-timed write cycle • Individual Byte Write Control and Global Write • Clock controlled, registered address, data and • control • Burst sequence control using MODE input • Three chip enable option for simple depth expansion and address pipelining • Common data inputs

ISSI

矽成半导体

512K x36 and 1024K x18 18Mb SYNCHRONOUS PIPELINED SINGLE CYCLE DESELECT STATIC RAM

FEATURES • Internal self-timed write cycle • Individual Byte Write Control and Global Write • Clock controlled, registered address, data and • control • Burst sequence control using MODE input • Three chip enable option for simple depth expansion and address pipelining • Common data inputs

ISSI

矽成半导体

512K x36 and 1024K x18 18Mb SYNCHRONOUS PIPELINED SINGLE CYCLE DESELECT STATIC RAM

FEATURES • Internal self-timed write cycle • Individual Byte Write Control and Global Write • Clock controlled, registered address, data and • control • Burst sequence control using MODE input • Three chip enable option for simple depth expansion and address pipelining • Common data inputs

ISSI

矽成半导体

512K x36 and 1024K x18 18Mb SYNCHRONOUS PIPELINED SINGLE CYCLE DESELECT STATIC RAM

FEATURES • Internal self-timed write cycle • Individual Byte Write Control and Global Write • Clock controlled, registered address, data and • control • Burst sequence control using MODE input • Three chip enable option for simple depth expansion and address pipelining • Common data inputs

ISSI

矽成半导体

512K x36 and 1024K x18 18Mb SYNCHRONOUS PIPELINED SINGLE CYCLE DESELECT STATIC RAM

FEATURES • Internal self-timed write cycle • Individual Byte Write Control and Global Write • Clock controlled, registered address, data and • control • Burst sequence control using MODE input • Three chip enable option for simple depth expansion and address pipelining • Common data inputs

ISSI

矽成半导体

封装/外壳:165-TBGA 包装:卷带(TR) 描述:IC SRAM 18MBIT PARALLEL 165TFBGA 集成电路(IC) 存储器

ETC

知名厂家

封装/外壳:165-TBGA 包装:卷带(TR) 描述:IC SRAM 18MBIT PARALLEL 165TFBGA 集成电路(IC) 存储器

ETC

知名厂家

更新时间:2025-12-10 23:01:00
IC供应商 芯片型号 品牌 批号 封装 库存 备注 价格
ISSI
24+
NA/
118
优势代理渠道,原装正品,可全系列订货开增值税票
ISSI(美国芯成)
24+
LQFP100(14x20)
7350
现货供应,当天可交货!免费送样,原厂技术支持!!!
ISSI
2016+
QFP
3500
本公司只做原装,假一罚十,可开17%增值税发票!
ISSI
14+
BGA
23
一级代理,专注军工、汽车、医疗、工业、新能源、电力
ISSI,
25+
25000
原厂原包 深圳现货 主打品牌 假一赔百 可开票!
ISSI Integrated Silicon Soluti
22+
100LQFP (14x20)
9000
原厂渠道,现货配单
ISSI(美国芯成)
2447
LQFP-100(14x20)
315000
72个/托盘一级代理专营品牌!原装正品,优势现货,长
ISSI, Integrated Silicon Solu
23+
100-LQFP14x20
7300
专注配单,只做原装进口现货
ISSI(美国芯成)
25+
封装
500000
源自原厂成本,高价回收工厂呆滞
ISSI
23+
QFP100
7000

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