封装/外壳：66-TSSOP（szerokość 0，400"，10，16mm） 包装：卷带（TR） 描述：IC DRAM 256MBIT PAR 66TSOP II 集成电路（IC） 存储器

8Mx32, 16Mx16, 32Mx8 256Mb DDR SDRAM

FEATURES • VDD and VDDQ: 2.5V ± 0.2V • SSTL_2 compatible I/O • Double-data rate architecture; two data transfers per clock cycle • Bidirectional, data strobe (DQS) is transmitted/ received with data, to be used in capturing data at the receiver • DQS is edge-aligned with data for READs and

8Mx32, 16Mx16, 32Mx8 256Mb DDR SDRAM

FEATURES • VDD and VDDQ: 2.5V ± 0.2V • SSTL_2 compatible I/O • Double-data rate architecture; two data transfers per clock cycle • Bidirectional, data strobe (DQS) is transmitted/ received with data, to be used in capturing data at the receiver • DQS is edge-aligned with data for READs and

8Mx32, 16Mx16, 32Mx8 256Mb DDR SDRAM

FEATURES • VDD and VDDQ: 2.5V ± 0.2V • SSTL_2 compatible I/O • Double-data rate architecture; two data transfers per clock cycle • Bidirectional, data strobe (DQS) is transmitted/ received with data, to be used in capturing data at the receiver • DQS is edge-aligned with data for READs and

8Mx32, 16Mx16, 32Mx8 256Mb DDR SDRAM

FEATURES • VDD and VDDQ: 2.5V ± 0.2V • SSTL_2 compatible I/O • Double-data rate architecture; two data transfers per clock cycle • Bidirectional, data strobe (DQS) is transmitted/ received with data, to be used in capturing data at the receiver • DQS is edge-aligned with data for READs and

8Mx32, 16Mx16, 32Mx8 256Mb DDR SDRAM

FEATURES • VDD and VDDQ: 2.5V ± 0.2V • SSTL_2 compatible I/O • Double-data rate architecture; two data transfers per clock cycle • Bidirectional, data strobe (DQS) is transmitted/ received with data, to be used in capturing data at the receiver • DQS is edge-aligned with data for READs and