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IRKT71价格

参考价格：￥716.1178

型号：IRKT71-4 品牌：Int'L Rectifier 备注：这里有IRKT71多少钱，2025年最近7天走势，今日出价，今日竞价，IRKT71批发/采购报价，IRKT71行情走势销售排行榜，IRKT71报价。

型号	功能描述	生产厂家企业	LOGO
IRKT71	THYRISTOR/ DIODE and THYRISTOR/ THYRISTOR Mechanical Description The Generation V of Add-A-pak module combine the excellent thermal performance obtained by the usage of Direct Bonded Copper substrate with superior mechanical ruggedness, thanks to the insertion of a solid Copper baseplate at the bottom side of the device. The Cu basepla	IRF	IRF
IRKT71/04A	THYRISTOR/ DIODE and THYRISTOR/ THYRISTOR Mechanical Description The Generation V of Add-A-pak module combine the excellent thermal performance obtained by the usage of Direct Bonded Copper substrate with superior mechanical ruggedness, thanks to the insertion of a solid Copper baseplate at the bottom side of the device. The Cu basepla	IRF	IRF
IRKT71/04AS90	THYRISTOR/ DIODE and THYRISTOR/ THYRISTOR Mechanical Description The Generation V of Add-A-pak module combine the excellent thermal performance obtained by the usage of Direct Bonded Copper substrate with superior mechanical ruggedness, thanks to the insertion of a solid Copper baseplate at the bottom side of the device. The Cu basepla	IRF	IRF
IRKT71/06A	THYRISTOR/ DIODE and THYRISTOR/ THYRISTOR Mechanical Description The Generation V of Add-A-pak module combine the excellent thermal performance obtained by the usage of Direct Bonded Copper substrate with superior mechanical ruggedness, thanks to the insertion of a solid Copper baseplate at the bottom side of the device. The Cu basepla	IRF	IRF
IRKT71/06AS90	THYRISTOR/ DIODE and THYRISTOR/ THYRISTOR Mechanical Description The Generation V of Add-A-pak module combine the excellent thermal performance obtained by the usage of Direct Bonded Copper substrate with superior mechanical ruggedness, thanks to the insertion of a solid Copper baseplate at the bottom side of the device. The Cu basepla	IRF	IRF
IRKT71/08A	THYRISTOR/ DIODE and THYRISTOR/ THYRISTOR Mechanical Description The Generation V of Add-A-pak module combine the excellent thermal performance obtained by the usage of Direct Bonded Copper substrate with superior mechanical ruggedness, thanks to the insertion of a solid Copper baseplate at the bottom side of the device. The Cu basepla	IRF	IRF
IRKT71/08AS90	THYRISTOR/ DIODE and THYRISTOR/ THYRISTOR Mechanical Description The Generation V of Add-A-pak module combine the excellent thermal performance obtained by the usage of Direct Bonded Copper substrate with superior mechanical ruggedness, thanks to the insertion of a solid Copper baseplate at the bottom side of the device. The Cu basepla	IRF	IRF
IRKT71/10A	THYRISTOR/ DIODE and THYRISTOR/ THYRISTOR Mechanical Description The Generation V of Add-A-pak module combine the excellent thermal performance obtained by the usage of Direct Bonded Copper substrate with superior mechanical ruggedness, thanks to the insertion of a solid Copper baseplate at the bottom side of the device. The Cu basepla	IRF	IRF
IRKT71/10AS90	THYRISTOR/ DIODE and THYRISTOR/ THYRISTOR Mechanical Description The Generation V of Add-A-pak module combine the excellent thermal performance obtained by the usage of Direct Bonded Copper substrate with superior mechanical ruggedness, thanks to the insertion of a solid Copper baseplate at the bottom side of the device. The Cu basepla	IRF	IRF
IRKT71/12A	THYRISTOR/ DIODE and THYRISTOR/ THYRISTOR Mechanical Description The Generation V of Add-A-pak module combine the excellent thermal performance obtained by the usage of Direct Bonded Copper substrate with superior mechanical ruggedness, thanks to the insertion of a solid Copper baseplate at the bottom side of the device. The Cu basepla	IRF	IRF
IRKT71/12AS90	THYRISTOR/ DIODE and THYRISTOR/ THYRISTOR Mechanical Description The Generation V of Add-A-pak module combine the excellent thermal performance obtained by the usage of Direct Bonded Copper substrate with superior mechanical ruggedness, thanks to the insertion of a solid Copper baseplate at the bottom side of the device. The Cu basepla	IRF	IRF
IRKT71/14A	THYRISTOR/ DIODE and THYRISTOR/ THYRISTOR Mechanical Description The Generation V of Add-A-pak module combine the excellent thermal performance obtained by the usage of Direct Bonded Copper substrate with superior mechanical ruggedness, thanks to the insertion of a solid Copper baseplate at the bottom side of the device. The Cu basepla	IRF	IRF
IRKT71/14AS90	THYRISTOR/ DIODE and THYRISTOR/ THYRISTOR Mechanical Description The Generation V of Add-A-pak module combine the excellent thermal performance obtained by the usage of Direct Bonded Copper substrate with superior mechanical ruggedness, thanks to the insertion of a solid Copper baseplate at the bottom side of the device. The Cu basepla	IRF	IRF
IRKT71/16A	THYRISTOR/ DIODE and THYRISTOR/ THYRISTOR Mechanical Description The Generation V of Add-A-pak module combine the excellent thermal performance obtained by the usage of Direct Bonded Copper substrate with superior mechanical ruggedness, thanks to the insertion of a solid Copper baseplate at the bottom side of the device. The Cu basepla	IRF	IRF
IRKT71/16AS90	THYRISTOR/ DIODE and THYRISTOR/ THYRISTOR Mechanical Description The Generation V of Add-A-pak module combine the excellent thermal performance obtained by the usage of Direct Bonded Copper substrate with superior mechanical ruggedness, thanks to the insertion of a solid Copper baseplate at the bottom side of the device. The Cu basepla	IRF	IRF
IRKT71-04A	THYRISTOR/ DIODE and THYRISTOR/ THYRISTOR Mechanical Description The Generation V of Add-A-pak module combine the excellent thermal performance obtained by the usage of Direct Bonded Copper substrate with superior mechanical ruggedness, thanks to the insertion of a solid Copper baseplate at the bottom side of the device. The Cu basepla	IRF	IRF
IRKT71-04AS90	THYRISTOR/ DIODE and THYRISTOR/ THYRISTOR Mechanical Description The Generation V of Add-A-pak module combine the excellent thermal performance obtained by the usage of Direct Bonded Copper substrate with superior mechanical ruggedness, thanks to the insertion of a solid Copper baseplate at the bottom side of the device. The Cu basepla	IRF	IRF
IRKT71-06A	THYRISTOR/ DIODE and THYRISTOR/ THYRISTOR Mechanical Description The Generation V of Add-A-pak module combine the excellent thermal performance obtained by the usage of Direct Bonded Copper substrate with superior mechanical ruggedness, thanks to the insertion of a solid Copper baseplate at the bottom side of the device. The Cu basepla	IRF	IRF
IRKT71-06AS90	THYRISTOR/ DIODE and THYRISTOR/ THYRISTOR Mechanical Description The Generation V of Add-A-pak module combine the excellent thermal performance obtained by the usage of Direct Bonded Copper substrate with superior mechanical ruggedness, thanks to the insertion of a solid Copper baseplate at the bottom side of the device. The Cu basepla	IRF	IRF
IRKT71-08A	THYRISTOR/ DIODE and THYRISTOR/ THYRISTOR Mechanical Description The Generation V of Add-A-pak module combine the excellent thermal performance obtained by the usage of Direct Bonded Copper substrate with superior mechanical ruggedness, thanks to the insertion of a solid Copper baseplate at the bottom side of the device. The Cu basepla	IRF	IRF
IRKT71-08AS90	THYRISTOR/ DIODE and THYRISTOR/ THYRISTOR Mechanical Description The Generation V of Add-A-pak module combine the excellent thermal performance obtained by the usage of Direct Bonded Copper substrate with superior mechanical ruggedness, thanks to the insertion of a solid Copper baseplate at the bottom side of the device. The Cu basepla	IRF	IRF
IRKT71-10A	THYRISTOR/ DIODE and THYRISTOR/ THYRISTOR Mechanical Description The Generation V of Add-A-pak module combine the excellent thermal performance obtained by the usage of Direct Bonded Copper substrate with superior mechanical ruggedness, thanks to the insertion of a solid Copper baseplate at the bottom side of the device. The Cu basepla	IRF	IRF
IRKT71-10AS90	THYRISTOR/ DIODE and THYRISTOR/ THYRISTOR Mechanical Description The Generation V of Add-A-pak module combine the excellent thermal performance obtained by the usage of Direct Bonded Copper substrate with superior mechanical ruggedness, thanks to the insertion of a solid Copper baseplate at the bottom side of the device. The Cu basepla	IRF	IRF
IRKT71-12A	THYRISTOR/ DIODE and THYRISTOR/ THYRISTOR Mechanical Description The Generation V of Add-A-pak module combine the excellent thermal performance obtained by the usage of Direct Bonded Copper substrate with superior mechanical ruggedness, thanks to the insertion of a solid Copper baseplate at the bottom side of the device. The Cu basepla	IRF	IRF
IRKT71-12AS90	THYRISTOR/ DIODE and THYRISTOR/ THYRISTOR Mechanical Description The Generation V of Add-A-pak module combine the excellent thermal performance obtained by the usage of Direct Bonded Copper substrate with superior mechanical ruggedness, thanks to the insertion of a solid Copper baseplate at the bottom side of the device. The Cu basepla	IRF	IRF
IRKT71-14A	THYRISTOR/ DIODE and THYRISTOR/ THYRISTOR Mechanical Description The Generation V of Add-A-pak module combine the excellent thermal performance obtained by the usage of Direct Bonded Copper substrate with superior mechanical ruggedness, thanks to the insertion of a solid Copper baseplate at the bottom side of the device. The Cu basepla	IRF	IRF
IRKT71-14AS90	THYRISTOR/ DIODE and THYRISTOR/ THYRISTOR Mechanical Description The Generation V of Add-A-pak module combine the excellent thermal performance obtained by the usage of Direct Bonded Copper substrate with superior mechanical ruggedness, thanks to the insertion of a solid Copper baseplate at the bottom side of the device. The Cu basepla	IRF	IRF
IRKT71-16A	THYRISTOR/ DIODE and THYRISTOR/ THYRISTOR Mechanical Description The Generation V of Add-A-pak module combine the excellent thermal performance obtained by the usage of Direct Bonded Copper substrate with superior mechanical ruggedness, thanks to the insertion of a solid Copper baseplate at the bottom side of the device. The Cu basepla	IRF	IRF
IRKT71-16AS90	THYRISTOR/ DIODE and THYRISTOR/ THYRISTOR Mechanical Description The Generation V of Add-A-pak module combine the excellent thermal performance obtained by the usage of Direct Bonded Copper substrate with superior mechanical ruggedness, thanks to the insertion of a solid Copper baseplate at the bottom side of the device. The Cu basepla	IRF	IRF
IRKT71SLASH04A	THYRISTOR/ DIODE and THYRISTOR/ THYRISTOR Mechanical Description The Generation V of Add-A-pak module combine the excellent thermal performance obtained by the usage of Direct Bonded Copper substrate with superior mechanical ruggedness, thanks to the insertion of a solid Copper baseplate at the bottom side of the device. The Cu basepla	IRF	IRF
IRKT71SLASH04AS90	THYRISTOR/ DIODE and THYRISTOR/ THYRISTOR Mechanical Description The Generation V of Add-A-pak module combine the excellent thermal performance obtained by the usage of Direct Bonded Copper substrate with superior mechanical ruggedness, thanks to the insertion of a solid Copper baseplate at the bottom side of the device. The Cu basepla	IRF	IRF
IRKT71SLASH06A	THYRISTOR/ DIODE and THYRISTOR/ THYRISTOR Mechanical Description The Generation V of Add-A-pak module combine the excellent thermal performance obtained by the usage of Direct Bonded Copper substrate with superior mechanical ruggedness, thanks to the insertion of a solid Copper baseplate at the bottom side of the device. The Cu basepla	IRF	IRF
IRKT71SLASH06AS90	THYRISTOR/ DIODE and THYRISTOR/ THYRISTOR Mechanical Description The Generation V of Add-A-pak module combine the excellent thermal performance obtained by the usage of Direct Bonded Copper substrate with superior mechanical ruggedness, thanks to the insertion of a solid Copper baseplate at the bottom side of the device. The Cu basepla	IRF	IRF
IRKT71SLASH08A	THYRISTOR/ DIODE and THYRISTOR/ THYRISTOR Mechanical Description The Generation V of Add-A-pak module combine the excellent thermal performance obtained by the usage of Direct Bonded Copper substrate with superior mechanical ruggedness, thanks to the insertion of a solid Copper baseplate at the bottom side of the device. The Cu basepla	IRF	IRF
IRKT71SLASH08AS90	THYRISTOR/ DIODE and THYRISTOR/ THYRISTOR Mechanical Description The Generation V of Add-A-pak module combine the excellent thermal performance obtained by the usage of Direct Bonded Copper substrate with superior mechanical ruggedness, thanks to the insertion of a solid Copper baseplate at the bottom side of the device. The Cu basepla	IRF	IRF
IRKT71SLASH10A	THYRISTOR/ DIODE and THYRISTOR/ THYRISTOR Mechanical Description The Generation V of Add-A-pak module combine the excellent thermal performance obtained by the usage of Direct Bonded Copper substrate with superior mechanical ruggedness, thanks to the insertion of a solid Copper baseplate at the bottom side of the device. The Cu basepla	IRF	IRF
IRKT71SLASH10AS90	THYRISTOR/ DIODE and THYRISTOR/ THYRISTOR Mechanical Description The Generation V of Add-A-pak module combine the excellent thermal performance obtained by the usage of Direct Bonded Copper substrate with superior mechanical ruggedness, thanks to the insertion of a solid Copper baseplate at the bottom side of the device. The Cu basepla	IRF	IRF
IRKT71SLASH12A	THYRISTOR/ DIODE and THYRISTOR/ THYRISTOR Mechanical Description The Generation V of Add-A-pak module combine the excellent thermal performance obtained by the usage of Direct Bonded Copper substrate with superior mechanical ruggedness, thanks to the insertion of a solid Copper baseplate at the bottom side of the device. The Cu basepla	IRF	IRF
IRKT71SLASH12AS90	THYRISTOR/ DIODE and THYRISTOR/ THYRISTOR Mechanical Description The Generation V of Add-A-pak module combine the excellent thermal performance obtained by the usage of Direct Bonded Copper substrate with superior mechanical ruggedness, thanks to the insertion of a solid Copper baseplate at the bottom side of the device. The Cu basepla	IRF	IRF
IRKT71SLASH14A	THYRISTOR/ DIODE and THYRISTOR/ THYRISTOR Mechanical Description The Generation V of Add-A-pak module combine the excellent thermal performance obtained by the usage of Direct Bonded Copper substrate with superior mechanical ruggedness, thanks to the insertion of a solid Copper baseplate at the bottom side of the device. The Cu basepla	IRF	IRF
IRKT71SLASH14AS90	THYRISTOR/ DIODE and THYRISTOR/ THYRISTOR Mechanical Description The Generation V of Add-A-pak module combine the excellent thermal performance obtained by the usage of Direct Bonded Copper substrate with superior mechanical ruggedness, thanks to the insertion of a solid Copper baseplate at the bottom side of the device. The Cu basepla	IRF	IRF
IRKT71SLASH16A	THYRISTOR/ DIODE and THYRISTOR/ THYRISTOR Mechanical Description The Generation V of Add-A-pak module combine the excellent thermal performance obtained by the usage of Direct Bonded Copper substrate with superior mechanical ruggedness, thanks to the insertion of a solid Copper baseplate at the bottom side of the device. The Cu basepla	IRF	IRF
IRKT71SLASH16AS90	THYRISTOR/ DIODE and THYRISTOR/ THYRISTOR Mechanical Description The Generation V of Add-A-pak module combine the excellent thermal performance obtained by the usage of Direct Bonded Copper substrate with superior mechanical ruggedness, thanks to the insertion of a solid Copper baseplate at the bottom side of the device. The Cu basepla	IRF	IRF
IRKT71/04A	ADD-A-pak GEN V Power Modules THYRISTOR/ DIODE and THYRISTOR/ THYRISTOR 文件：237.43 Kbytes Page：10 Pages	IRF	IRF
IRKT71/04AS90	ADD-A-pak GEN V Power Modules THYRISTOR/ DIODE and THYRISTOR/ THYRISTOR 文件：237.43 Kbytes Page：10 Pages	IRF	IRF
IRKT71/06A	ADD-A-pak GEN V Power Modules THYRISTOR/ DIODE and THYRISTOR/ THYRISTOR 文件：237.43 Kbytes Page：10 Pages	IRF	IRF
IRKT71/06A	封装/外壳：ADD-A-PAK（3 + 4）包装：散装描述：SCR DBL 2SCR 600V 75A ADD-A-PAK 分立半导体产品晶闸管 - SCR - 模块	ETC 知名厂家	ETC
IRKT71/06A	SCR DBL 2SCR 600V 75A ADD-A-PAK	VishayVishay Siliconix 威世威世科技公司	Vishay
IRKT71/06AS90	ADD-A-pak GEN V Power Modules THYRISTOR/ DIODE and THYRISTOR/ THYRISTOR 文件：237.43 Kbytes Page：10 Pages	IRF	IRF
IRKT71/08A	ADD-A-pak GEN V Power Modules THYRISTOR/ DIODE and THYRISTOR/ THYRISTOR 文件：237.43 Kbytes Page：10 Pages	IRF	IRF
IRKT71/08A	封装/外壳：ADD-A-PAK（3 + 4）包装：散装描述：SCR DBL 2SCR 800V 75A ADD-A-PAK 分立半导体产品晶闸管 - SCR - 模块	ETC 知名厂家	ETC
IRKT71/08A	SCR DBL 2SCR 800V 75A ADD-A-PAK	VishayVishay Siliconix 威世威世科技公司	Vishay
IRKT71/08AS90	ADD-A-pak GEN V Power Modules THYRISTOR/ DIODE and THYRISTOR/ THYRISTOR 文件：237.43 Kbytes Page：10 Pages	IRF	IRF
IRKT71/10A	ADD-A-pak GEN V Power Modules THYRISTOR/ DIODE and THYRISTOR/ THYRISTOR 文件：237.43 Kbytes Page：10 Pages	IRF	IRF
IRKT71/10A	SCR DBL 2SCR 1000V 75A ADD-A-PAK	VishayVishay Siliconix 威世威世科技公司	Vishay
IRKT71/10AS90	ADD-A-pak GEN V Power Modules THYRISTOR/ DIODE and THYRISTOR/ THYRISTOR 文件：237.43 Kbytes Page：10 Pages	IRF	IRF
IRKT71/12A	ADD-A-pak GEN V Power Modules THYRISTOR/ DIODE and THYRISTOR/ THYRISTOR 文件：237.43 Kbytes Page：10 Pages	IRF	IRF
IRKT71/12AS90	ADD-A-pak GEN V Power Modules THYRISTOR/ DIODE and THYRISTOR/ THYRISTOR 文件：237.43 Kbytes Page：10 Pages	IRF	IRF
IRKT71/14A	ADD-A-pak GEN V Power Modules THYRISTOR/ DIODE and THYRISTOR/ THYRISTOR 文件：237.43 Kbytes Page：10 Pages	IRF	IRF
IRKT71/14AS90	ADD-A-pak GEN V Power Modules THYRISTOR/ DIODE and THYRISTOR/ THYRISTOR 文件：237.43 Kbytes Page：10 Pages	IRF	IRF

IRKT71产品属性

类型
描述
型号
IRKT71
制造商
IRF
制造商全称
International Rectifier
功能描述
THYRISTOR/ DIODE and THYRISTOR/ THYRISTOR

IRKT71供应商更多...

更新时间：2025-11-2 22:30:00

IC供应商	芯片型号	品牌	批号	封装	库存	备注	价格
深圳市纳艾斯科技有限公司	IRKT71/12	IR	24+	module	6000	全新原装正品现货假一赔佰	询价
深圳市昌和盛利电子有限公司	IRKT71/14	IR	NEW	模块	3562	代理全系列销售,全新原装正品,价格优势,长期供应,量大可订	询价
深圳市中联芯电子有限公司	IRKT71/12AS90	IR	2023+	MODULE	152	主打螺丝模块系列	询价
天津市博通航睿技术有限公司	IRKT71-16	IR	23+	MODULE	7000		询价
中天科工半导体（深圳）有限公司	IRKT71/04A	IR	专业模块	MODULE	8513	模块原装主营-可开原型号增税票	询价
深圳市赛尔通科技有限公司	IRKT71/12S90	可控硅	23+		650		询价
深圳市能元时代电子有限公司	IRKT71	FUJI	23+	模块	20763	##公司主营品牌长期供应100%原装现货可含税提供技术	询价
深圳市河锋鑫科技有限公司	IRKT71/16AS90	IR	22+		6000	终端可免费供样,支持BOM配单	询价
浙江永芯科技有限公司	IRKT71/12	IR	23+	标准封装	5000	原厂授权一级代理 IGBT模块可控硅晶闸管熔断器质保	询价
贸泽芯城（深圳）电子科技有限公司	IRKT71/06	IR	23+	MODULE	10000	原厂授权一级代理,专业海外优势订货,价格优势、品种	询价

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IRKT71价格

IRKT71产品属性

IRKT71供应商更多...

IRKT71芯片相关品牌

IRKT71规格书下载地址

IRKT71参数引脚图相关

IRKT71数据表相关新闻

IRGP4266D-EPBF

IRGB15B60KDPBF IR全新正品现货

IRKD7104，IRKD71-04，IRKD71-06，IRKD71-08，IRKD71-16，IRKD91-04

IRL2203NPBF 原装现货热卖！！！！

IRL1004STRRPBF公司大量原装正品现货/长期供应

IRL2203NPBF公司大量原装正品现货/长期供应

DdatasheetPDF页码索引