型号 功能描述 生产厂家&企业 LOGO 操作
IRF530NL

HEXFET Power MOSFET

Description Advanced HEXFET® Power MOSFETs from International Rectifier utilize advanced processing techniques to achieve extremely low on resistance per silicon area. This benefit, combined with the fast switching speed and ruggedized device design that HEXFET power MOSFETs are well known for,

IRF

IRF530NL

Ultra Low On-Resistance

Description The D2Pak is a surface mount power package capable of accommodating die sizes up to HEX-4. It provides the highest power capability and the lowest possible on-resistance in any existing surface mount package. The D2Pak is suitable for high current applications because of its low inter

KERSEMI

IRF530NL

Isc N-Channel MOSFET Transistor

• FEATURES • With To-262 package • Low input capacitance and gate charge • Low gate input resistance • 100 avalanche tested • Minimum Lot-to-Lot variations for robust device performance and reliable operation • APPLICATIONS • Switching applications

ISC

无锡固电

HEXFET Power MOSFET

Description Advanced HEXFET® Power MOSFETs from International Rectifier utilize advanced processing techniques to achieve extremely low on resistance per silicon area. This benefit, combined with the fast switching speed and ruggedized device design that HEXFET power MOSFETs are well known for, p

IRF

Advanced Process Technology

Description Advanced HEXFET® Power MOSFETs from International Rectifier utilize advanced processing techniques to achieve extremely low on resistance per silicon area. This benefit, combined with the fast switching speed and ruggedized device design that HEXFET power MOSFETs are well known for, p

IRF

Advanced Process Technology

文件:284.9 Kbytes Page:11 Pages

IRF

Pentium 4 Processors Supporting Hyper-Threading Technology

Introduction The Intel® Pentium® 4 processor on 90 nm process in the 775-land package is a follow on to the Pentium 4 processor in the 478-pin package with enhancements to the Intel NetBurst® microarchitecture. The Pentium 4 processor on 90 nm process in the 775-land package uses FlipChip Land Gr

Intel

英特尔

PISTON SEALS

DESCRIPTION The BECA 530 profile is a double acting composite piston seal composed of a pre-tightened rubber square ring and a specific polyurethane friction ring. APPLICATIONS Agriculture Light and medium-sized industry Machine tools Material handling/Lifting

FRANCEJOINT

PISTON SEALS

DESCRIPTION The BECA 530 profile is a double acting composite piston seal composed of a pre-tightened rubber square ring and a specific polyurethane friction ring. APPLICATIONS Agriculture Light and medium-sized industry Machine tools Material handling/Lifting

FRANCEJOINT

PISTON SEALS

DESCRIPTION The BECA 530 profile is a double acting composite piston seal composed of a pre-tightened rubber square ring and a specific polyurethane friction ring. APPLICATIONS Agriculture Light and medium-sized industry Machine tools Material handling/Lifting

FRANCEJOINT

Intel짰 Solid-State Drive 530 Series (2.5-inch)

文件:481.68 Kbytes Page:27 Pages

Intel

英特尔

IRF530NL产品属性

  • 类型

    描述

  • 型号

    IRF530NL

  • 功能描述

    MOSFET N-CH 100V 17A TO-262

  • RoHS

  • 类别

    分离式半导体产品 >> FET - 单

  • 系列

    HEXFET®

  • 标准包装

    1,000

  • 系列

    MESH OVERLAY™ FET

  • MOSFET N 通道,金属氧化物 FET

  • 特点

    逻辑电平门

  • 漏极至源极电压(Vdss)

    200V 电流 - 连续漏极(Id) @ 25°

  • C

    18A 开态Rds(最大)@ Id, Vgs @ 25°

  • C

    180 毫欧 @ 9A,10V Id 时的

  • Vgs(th)(最大)

    4V @ 250µA 闸电荷(Qg) @

  • Vgs

    72nC @ 10V 输入电容(Ciss) @

  • Vds

    1560pF @ 25V 功率 -

  • 最大

    40W

  • 安装类型

    通孔

  • 封装/外壳

    TO-220-3 整包

  • 供应商设备封装

    TO-220FP

  • 包装

    管件

更新时间:2025-8-12 18:49:00
IC供应商 芯片型号 品牌 批号 封装 库存 备注 价格
IR
23+
原厂原封□□□
339
原厂授权代理分销现货只做原装正迈科技样品支持现货
IR
24+/25+
1250
原装正品现货库存价优
IR
2015+
TO-220
19889
一级代理原装现货,特价热卖!
IR
2016+
TO-262
6528
房间原装进口现货假一赔十
IR
24+
12
原装现货,可开13%税票
IR
23+
TO-220
18689
IR
24+
TO-262
8866
IR
TO-220
3200
原装长期供货!
IR
23+
TO-220
5000
原装正品,假一罚十
Infineon Technologies
22+
TO2623 Long Leads I2Pak TO262A
9000
原厂渠道,现货配单

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