ATX Motherboard with LGA1200 Socket 11th/10th Gen Intel® Core™ i9/i7/i5/i3, Xeon® W Processor, Intel® W480E, ECC DDR4, USB 3.2 Gen1/Gen2, NVMe, Dual LAN, VGA, DisplayPort, DVI-D, and HDMI

Features ● LGA1200 socket 11th/10th gen Intel® Core™ i9/i7/i5/i3 or Xeon® W processor (Comet Lake) ● Four 288-pin DDR4-2933 ECC/non-ECC un-buffered Long-DIMM for up to 128GB of memory ● DisplayPort++, VGA, DVI-D and HDMI with triple-view supported ● Supports M.2 Key M 2280 ● 2 USB 3.2 Gen2 an

ATX Motherboard with LGA1200 Socket 11th/10th Gen Intel® Core™ i9/i7/i5/i3, Xeon® W Processor, Intel® W480E, ECC DDR4, USB 3.2 Gen1/Gen2, NVMe, Dual LAN, VGA, DisplayPort, DVI-D, and HDMI

Features ● LGA1200 socket 11th/10th gen Intel® Core™ i9/i7/i5/i3 or Xeon® W processor (Comet Lake) ● Four 288-pin DDR4-2933 ECC/non-ECC un-buffered Long-DIMM for up to 128GB of memory ● DisplayPort++, VGA, DVI-D and HDMI with triple-view supported ● Supports M.2 Key M 2280 ● 2 USB 3.2 Gen2 an

PISTON SEALS

DESCRIPTION The BECA 530 profile is a double acting composite piston seal composed of a pre-tightened rubber square ring and a specific polyurethane friction ring. APPLICATIONS Agriculture Light and medium-sized industry Machine tools Material handling/Lifting

PISTON SEALS

DESCRIPTION The BECA 530 profile is a double acting composite piston seal composed of a pre-tightened rubber square ring and a specific polyurethane friction ring. APPLICATIONS Agriculture Light and medium-sized industry Machine tools Material handling/Lifting

PISTON SEALS

DESCRIPTION The BECA 530 profile is a double acting composite piston seal composed of a pre-tightened rubber square ring and a specific polyurethane friction ring. APPLICATIONS Agriculture Light and medium-sized industry Machine tools Material handling/Lifting

Pentium 4 Processors Supporting Hyper-Threading Technology

Introduction The Intel® Pentium® 4 processor on 90 nm process in the 775-land package is a follow on to the Pentium 4 processor in the 478-pin package with enhancements to the Intel NetBurst® microarchitecture. The Pentium 4 processor on 90 nm process in the 775-land package uses FlipChip Land Gr

Intel짰 Solid-State Drive 530 Series (2.5-inch)

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