Chip Array Ferrite Beads

FEATURES • Combines four single 0603 chips into one package to reduce board space and placement time • Highly effective in high density applications • 0.031 [0.8 mm] terminal pitch makes it easy to apply EMI prevention in multiple-lines such as connectors and IC pins • Material and constru

Enhanced isoCink??Bridge Rectifiers

FEATURES • UL recognition file number E312394 • Thin single in-line package • Glass passivated chip junction • Available for BU-5S lead forming option (part number with “5S” suffix, e.g. BU12065S) • Superior thermal conductivity • Solder dip 275 °C max. 10 s, per JESD 22-B106 • Material ca

MAGNETIC BUZZER TRANSDUCER

FEATURES through hole 5 V rated externally driven

Surface Mount Common Mode Choke

FEATURES • Operating temperature: -40 °C to +85 °C • Excellent solderability and resistance to soldering heat • Suitable for flow and reflow soldering • High reliability and easy surface mount assembly • Material categorization: for definitions of compliance please see www.vishay.com/doc?99

Monolithic Chip Inductors

FEATURES • High reliability • Surface mountable • Magnetically self shielded • Nickel barrier plating virtuallly eliminates silver migration • Material categorization: for definitions of compliance please see www.vishay.com/doc?99912