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XC53M4中文资料
XC53M4数据手册规格书PDF详情
PRODUCT FEATURES
Small dimensions 5.0x3.2x0.7 with 4 solder pads.
Highly reliable seam sealed ceramic package.
Tight tolerances and stabilities over temperature range.
Automotive compliance to AEC-Q200 available.
RoHS compliant, LEAD-FREE and HALOGEN-FREE.
APPLICATIONS
Wireless LAN
Bluetooth
Mobil communication
Handheld equipment
更新时间：2025-8-9 11:06:00
| 供应商 | 型号 | 品牌 | 批号 | 封装 | 库存 | 备注 | 价格 |
|---|---|---|---|---|---|---|---|
24+ |
N/A |
79000 |
一级代理-主营优势-实惠价格-不悔选择 |
||||
HCI |
24+ |
con |
10000 |
查现货到京北通宇商城 |
|||
XILINX |
24+ |
QFP |
3500 |
原装现货,可开13%税票 |
|||
XILINX |
2023+ |
QFP |
50000 |
原装现货 |
|||
xilinx |
22+ |
QFP |
6800 |
||||
xilinx |
23+ |
QFP |
8000 |
全新原装 |
|||
XILINX/赛灵思 |
20+ |
PLCC68 |
2300 |
全新原装,价格超越代理。 |
|||
XILINX |
2021 |
BGA |
1000 |
全新、原装 |
|||
XILINX |
23+ |
6800 |
全新原装正品现货,支持订货 |
||||
XILINX |
2021+ |
6800 |
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