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XC53G2中文资料
XC53G2数据手册规格书PDF详情
PRODUCT FEATURES
Dimensions 5.0x3.2x1.3 with 2 solder pads.Low cost ceramic glass seal package.Tight tolerances and stabilities over temperature range.RoHS compliant by exemption and HALOGEN-FREE.
APPLICATIONS
Motherboard
Computer peripherals
Handheld equipment
更新时间：2025-12-4 16:39:00
| 供应商 | 型号 | 品牌 | 批号 | 封装 | 库存 | 备注 | 价格 |
|---|---|---|---|---|---|---|---|
HCI |
23+ |
SMD5032-2P |
11200 |
原厂授权一级代理、全球订货优势渠道、可提供一站式BO |
|||
24+ |
N/A |
78000 |
一级代理-主营优势-实惠价格-不悔选择 |
||||
HCI |
24+ |
con |
10000 |
查现货到京北通宇商城 |
|||
SUZHOU HANGJING ELECTRONIC TEC |
2450+ |
NA |
9850 |
只做原厂原装正品现货或订货假一赔十! |
|||
XILINX |
24+ |
QFP |
3500 |
原装现货,可开13%税票 |
|||
XILINX |
2023+ |
QFP |
50000 |
原装现货 |
|||
xilinx |
22+ |
QFP |
6800 |
||||
xilinx |
25+ |
QFP |
6000 |
全新现货 |
|||
XILINX |
2021 |
BGA |
1000 |
全新、原装 |
|||
XILINX |
23+ |
6800 |
全新原装正品现货,支持订货 |
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