具有可编程输出电压的32 Gbps、1:2解复用器

32 Gbps, 1:2 DEMUX WITH PROGRAMMABLE OUTPUT VOLTAGE

Features Supports Data Rates up to 32 Gbps 660 mW Power Consumption -3.3 V or +3.3 V Operation is Available Supports Single-Ended and Differential Operation 24 Lead Ceramic 4x4 mm SMT Package: 16 mm2 Invert Port Allows Scrambling for SERDES Application Typical Applications The HMC955LC4B

32 Gbps, 1:2 Demux w/ Programmable Output Voltage

文件：887.47 Kbytes Page：8 Pages

WITH PROGRAMMABLE OUTPUT VOLTAGE

文件：1.10524 Mbytes Page：8 Pages

WITH PROGRAMMABLE OUTPUT VOLTAGE

文件：1.10524 Mbytes Page：8 Pages

封装/外壳：24-TFCQFN 裸露焊盘 包装：管件 描述：IC DEMUX 1 X 1:2 24CQFN 集成电路（IC） 模拟开关 - 特殊用途

封装/外壳：24-TFCQFN 裸露焊盘 包装：管件 描述：IC DEMUX 1:2 32GBPS 24QFN 集成电路（IC） 模拟开关 - 特殊用途

SUBMINIATURE PC BOARD RELAY

FEATURES • Subminiature size for high density packaging • DIL pitch terminals • Epoxy sealed for automatic wave soldering • High sensitivity: 150 mW nominal with 84 mW pickup • Meets FCC Part 68.302 1500 V lightning surge • Meets FCC Part 68.304 1000 V dielectric • UL / CUR file E43203

SUBMINIATURE PC BOARD RELAY

[Zettler] FEATURES • Subminiature size for high density packaging • DIL pitch terminals • Epoxy sealed for automatic wave soldering • High sensitivity: 150 mW nominal with 84 mW pickup • Meets FCC Part 68.302 1500 V lightning surge • Meets FCC Part 68.304 1000 V dielectric • UL file E43203

SUBMINIATURE PC BOARD RELAY

FEATURES • Subminiature size for high density packaging • DIL pitch terminals • Epoxy sealed for automatic wave soldering • High sensitivity: 150 mW nominal with 84 mW pickup • Meets FCC Part 68.302 1500 V lightning surge • Meets FCC Part 68.304 1000 V dielectric • UL file E43203; CSA file

CONN PLUG USB3.0 MICRO USB B SLD

文件：152.96 Kbytes Page：1 Pages

CONN PLUG USB3.0 MICRO USB B SLD

文件：152.96 Kbytes Page：1 Pages