Single ASIC chip design with very few external components

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电子烟IC

Wi-Fi 模块

Single ASIC chip design with very few external components

文件：422.14 Kbytes Page：3 Pages

Single ASIC chip design with very few external components

文件：422.14 Kbytes Page：3 Pages

Single ASIC chip design with very few external components

文件：422.14 Kbytes Page：3 Pages

T1/CEPT Extended Temperature Range SMD Dual Line Interface Module

Units matched to leading transceiver ICs. Meet requirements for T1, E1, CEPT and PRI ISDN over extended temperature range –40 to +85˚C.

DIP Reed Relays

DIP REED RELAYS The 8000 Series is ideally suited to the needs of Automated Test Equipment, Instrumentation, Data Acquisition, and Process Control requirements. The specification tables allow you to select the appropriate relay for your particular application. If your requirements differ from the

Its a complete tool kit that fits in your palm.

文件：1.8415 Mbytes Page：16 Pages

System 8000 Fiber-Optic Interfacility Links

文件：387.48 Kbytes Page：19 Pages

true one-port, surface-acoustic-wave (SAW) resonator

文件：61.8 Kbytes Page：3 Pages