HIGH EFFICIENCY GLASS PASSIVATED RECTIFIER

FEATURES • Glass passivated chip junction • Low power loss, high efficiency • Low leakage • High speed switching • High surge capacity • High temperature soldering guaranteed 260℃/10 seconds,0.375″(9.5mm) lead length

Plastic High-Efficiency Rectifiers Reverse Voltage 50 to 1000V Forward Current 2.5A

Reverse Voltage 50 to 1000V Forward Current 2.5A Features • Glass passivated chip • Low reverse leakage • High forward surge capability • High temperature soldering guaranteed: 260℃/10 seconds, 0.375 (9.5mm) lead length, 5 lbs. (2.3kg) tension • Lead and body according with RoHS standard

Plastic High-Efficiency Rectifiers

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PGA ZIF Test & Burn-in Socket for Any Footprint on Std 8x8 to 21x21 Grid

FEATURES • Strong Metal Cam Activates Normally-closed Contacts, Preventing Dependency on Plastic for Contact Force • Handle mounted on Right- or Left-hand Side • Any Footprint Accepted on Standard 13x13 to 21x21 Grid GENERAL SPECIFICATIONS • SOCKET BODY: black UL 94V-0 Polyphenylene Sulfid

32-bit ARM7TDMI RISC static CMOS CPU core

OVERVIEW The HMS30C7202 is a highly integrated low power microprocessor for personal digital assistants, and other applications described below. The device incorporates an ARM720T CPU and system interface logic to interface with various types of devices. HMS30C7202 is a highly modular design base

3M??Scotch짰 Printable Flatback Paper Tape 256

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MAGNETIC-LATCHING DPDT HALF-SIZE CRYSTAL CAN MILITARY RELAY

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256b/257b Transcoding for 100 Gb/s Backplane and Copper Cable

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