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Features ● Glass Passivated Die Construction ● Low Leakage ● Low Cost ● High Surge Current Capability ● Typical IR less than 200nA ● C-Band Terminal Construction

Pressfit Diodes

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2 Hardware Features This section describes the hardware features found on the XTR111EVM. 2.1 XTR111EVM The XTR111EVM is used for the basic functional evaluation of the XTR111. The EVM provides the following features: • Easy handling of the small DFN package. The DFN device is already soldered

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