型号 功能描述 生产厂家 企业 LOGO 操作
HBS410

Glass Passivated Single-Phase 4.0Amp Surface Mount Bridge Rectifier

Features  Surface mount bridge, small package;  Ideal for printed circuit boards;  Glass passivated chip junction;  High surge current capability;  High heat dissipation capability;  Low profile package;  Low forward voltage drop;  Plastic package has Underwrites LaboratoryF

SMCDIODE

桑德斯微电子

HBS410

Glass Passivated Single-Phase 4.0Amp Surface Mount Bridge Rectifier

Features  Surface mount bridge, small package;  Ideal for printed circuit boards;  Glass passivated chip junction;  High surge current capability;  High heat dissipation capability;  Low profile package;  Low forward voltage drop;  Plastic package has Underwrites LaboratoryF

SMCDIODE

桑德斯微电子

HBS410

Glass Passivated Single-Phase 4.0Amp Surface Mount Bridge Rectifier

Features  Surface mount bridge, small package;  Ideal for printed circuit boards;  Glass passivated chip junction;  High surge current capability;  High heat dissipation capability;  Low profile package;  Low forward voltage drop;  Plastic package has Underwrites LaboratoryF

SMCDIODE

桑德斯微电子

HBS410

4.0A GLASS PASSIVATED BRIDGE RECTIFIER

文件:120.49 Kbytes Page:2 Pages

ZSELEC

淄博圣诺

HBS410

封装/外壳:4-SMD,鸥翼 包装:管件 描述:1000V,4APACKAGE HBS BRIDGE RECTI 分立半导体产品 二极管 - 桥式整流器

SMCDIODE

桑德斯微电子

HBS410

4.0A SURFACE MOUNT GLASS PASSIVATED BRIDGE RECTIFIER

DIODES

美台半导体

封装/外壳:4-SMD,鸥翼 包装:卷带(TR) 描述:MEDIUM/HIGH POWER BRIDGE HBS T\u0026R 分立半导体产品 二极管 - 桥式整流器

DIODES

美台半导体

Integrated Soldier Power and Data Management System (ISPDS) with USB.3.0 and 1G LAN Capabilities

FEATURES DESCRIPTION The advancement of technologies in the modern warfare has allowed the design of increasingly versatile tools in order to perform effectively and coherently in the battlefield. The modern infantry soldier, fully equipped with advanced weapon and communication systems, has

ENERCON

Replace “XX” with 01 through 12 for number of poles 11/16 (.688) pitch

文件:597.06 Kbytes Page:3 Pages

MARATHON

Celeron M Processor on 65 nm Process

文件:1.93023 Mbytes Page:71 Pages

Intel

英特尔

Detectable Buried Barricade Tapes 400 Series

文件:53.73 Kbytes Page:2 Pages

3M

Heavy-Duty Hydra-Lift Karriers

文件:1.04551 Mbytes Page:3 Pages

MORSE

Morse Mfg. Co., Inc.

更新时间:2025-12-27 23:00:00
IC供应商 芯片型号 品牌 批号 封装 库存 备注 价格
lelon(立隆)
24+
插件,10x12
7350
现货供应,当天可交货!免费送样,原厂技术支持!!!
N/A
23+
NA
10000
原厂授权一级代理,专业海外优势订货,价格优势、品种
WINRISE
25+
Sot-363
86720
全新原装进口现货价格优惠 本公司承诺原装正品假一赔
N/A
N/A
324
优势货源原装正品
CECPS
21+
NA
1062
只做原装正品,不止网上数量,欢迎电话微信查询!
N/A
24+
8000
原装现货,特价销售
DIODES/美台
24+
N/A
500000
美台原厂超低价支持
24+
N/A
58000
一级代理-主营优势-实惠价格-不悔选择
N/A
16+
NA
8800
原装现货,货真价优
JUXING(钜兴)
24+
con
35960
查现货到京北通宇商城

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