位置：首页 > IC中文资料第11861页 > H-1335
| 型号 | 功能描述 | 生产厂家 企业 | LOGO | 操作 |
|---|---|---|---|---|
Memory Micromodules General Information for D1, D2 and C Packaging DESCRIPTION Memory Cards consist of two main parts: the plastic card, and the embedded Micromodule (which, in turn, carries the silicon chip). ■ Micromodules were developed specifically for embedding in Smartcards and Memory Cards ■ The Micromodule provides: – Support for the chi | STMICROELECTRONICS 意法半导体 |   | ||
5-Contact Memory Card IC 272-bit EEPROM with Advanced Security Mechanisms DESCRIPTION The members of the ST1335/1336/1355 family are principally designed for use in prepaid Phonecard applications. Each is a 272-bit EEPROM device, with associated security logic and special fuses to control memory access. The memory is arranged as a matrix of 34 x 8 cells, accessed in | STMICROELECTRONICS 意法半导体 | | ||
RS232/EIA562/RS485 Transceivers 文件：454.5 Kbytes Page：20 Pages | LINER 凌力尔特 | | ||
RS232/EIA562/RS485 Transceivers 文件：454.5 Kbytes Page：20 Pages | LINER 凌力尔特 | | ||
Universal Serial Bus USB Audio Playback Recording Peripheral APRP 文件：254.95 Kbytes Page：44 Pages | PHILIPS 飞利浦 | |
H-1335产品属性
- 类型
描述
- 型号
H-1335
- 功能描述
环形MIL规格后盖
- RoHS
否
- 制造商
Amphenol PCD MIL
- 类型
MIL-DTL-38999 III, IV
- 系列
AS85049
- 产品类型
Environmental EMI/RFI Backshells
- 外壳类型
Straight
- 外壳大小
18
- 外壳材质
Aluminum Alloy
| IC供应商 | 芯片型号 | 品牌 | 批号 | 封装 | 库存 | 备注 | 价格 |
|---|---|---|---|---|---|---|---|
NXGD |
20+ |
标准 |
52000 |
原装优势主营型号-可开原型号增税票 |
|||
XG |
2026+ |
DIP-3 |
65428 |
百分百原装现货 实单必成 |
|||
LONEON |
2021+ |
DIP-4 |
25635 |
一级代理,专注军工、汽车、医疗、工业、新能源、电力 |
|||
LONEON |
24+ |
DIP-4 |
880000 |
明嘉莱只做原装正品现货 |
|||
SITRONI |
23+ |
QFN |
3000 |
一级代理原厂VIP渠道,专注军工、汽车、医疗、工业、 |
|||
ST |
26+ |
NA |
60000 |
只有原装 可配单 |
|||
ST |
25+ |
SQFP144 |
3629 |
原装优势!房间现货!欢迎来电! |
|||
ST/意法 |
25+ |
DIP8 |
550 |
全新原装正品支持含税 |
|||
LONEON |
25+ |
DIP-4 |
30000 |
代理全新原装现货,价格优势 |
|||
LONEON |
25+23+ |
DIP-4 |
31649 |
绝对原装正品全新进口深圳现货 |
H-1335规格书下载地址
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2019-1-28
DdatasheetPDF页码索引
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