型号 功能描述 生产厂家 企业 LOGO 操作

连接器外壳

GLENAIR

THYRISTOR/ DIODE and THYRISTOR/ THYRISTOR

Mechanical Description The Generation V of Add-A-pak module combine the excellent thermal performance obtained by the usage of Direct Bonded Copper substrate with superior mechanical ruggedness, thanks to the insertion of a solid Copper baseplate at the bottom side of the device. The Cu basepla

IRF

THYRISTOR/ DIODE and THYRISTOR/ THYRISTOR

Mechanical Description The Generation V of Add-A-pak module combine the excellent thermal performance obtained by the usage of Direct Bonded Copper substrate with superior mechanical ruggedness, thanks to the insertion of a solid Copper baseplate at the bottom side of the device. The Cu basepla

IRF

THYRISTOR/ DIODE and THYRISTOR/ THYRISTOR

Mechanical Description The Generation V of Add-A-pak module combine the excellent thermal performance obtained by the usage of Direct Bonded Copper substrate with superior mechanical ruggedness, thanks to the insertion of a solid Copper baseplate at the bottom side of the device. The Cu basepla

IRF

OCXO Specification

文件:167.02 Kbytes Page:5 Pages

IQD

Power Module 80 Amp

文件:192.39 Kbytes Page:1 Pages

TEL

更新时间:2026-1-1 15:01:00
IC供应商 芯片型号 品牌 批号 封装 库存 备注 价格
INFINEON/英飞凌
23+
H-37248C
8000
只做原装现货
INFINEON/英飞凌
23+
H-37248C
7000
WOLFSPEED
24+
N/A
34388
原装原装原装
23+
22755
##公司主营品牌长期供应100%原装现货可含税提供技术
INFINEON/英飞凌
24+
SMD
60000
SILVERMICRO
23+
标准封装
5000
原厂授权一级代理 IGBT模块 可控硅 晶闸管 熔断器质保
INFINEON/英飞凌
23+
10000
原厂授权一级代理,专业海外优势订货,价格优势、品种
YUGUANG
23+
NA
50000
全新原装正品现货,支持订货
Cree/Wolfspeed
100
GAON
MUDULE
53650
一级代理 原装正品假一罚十价格优势长期供货

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