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GT10D

Thermal Pad

Features • Smooth surface & low contact resistance • Low thermal resistance • High stabality • Great reliability Applications Electronic components - Electric Vehicles, 5G, Autopilot System, Mobile Phone, AIOT, HPC (High Performance Computing), Server, IC, CPU, MOS, LED, Mother Board,Pow

TGLOBAL

Thermal Pad

Features • Smooth surface & low contact resistance • Low thermal resistance • High stabality • Great reliability Applications Electronic components - Electric Vehicles, 5G, Autopilot System, Mobile Phone, AIOT, HPC (High Performance Computing), Server, IC, CPU, MOS, LED, Mother Board,Pow

TGLOBAL

Thermal Pad

Features • Smooth surface & low contact resistance • Low thermal resistance • High stabality • Great reliability Applications Electronic components - Electric Vehicles, 5G, Autopilot System, Mobile Phone, AIOT, HPC (High Performance Computing), Server, IC, CPU, MOS, LED, Mother Board,Pow

TGLOBAL

Thermal Pad

Features • Smooth surface & low contact resistance • Low thermal resistance • High stabality • Great reliability Applications Electronic components - Electric Vehicles, 5G, Autopilot System, Mobile Phone, AIOT, HPC (High Performance Computing), Server, IC, CPU, MOS, LED, Mother Board,Pow

TGLOBAL

Thermal Pad

Features • Smooth surface & low contact resistance • Low thermal resistance • High stabality • Great reliability Applications Electronic components - Electric Vehicles, 5G, Autopilot System, Mobile Phone, AIOT, HPC (High Performance Computing), Server, IC, CPU, MOS, LED, Mother Board,Pow

TGLOBAL

Thermal Pad

Features • Smooth surface & low contact resistance • Low thermal resistance • High stabality • Great reliability Applications Electronic components - Electric Vehicles, 5G, Autopilot System, Mobile Phone, AIOT, HPC (High Performance Computing), Server, IC, CPU, MOS, LED, Mother Board,Pow

TGLOBAL

Thermal Pad

Features • Smooth surface & low contact resistance • Low thermal resistance • High stabality • Great reliability Applications Electronic components - Electric Vehicles, 5G, Autopilot System, Mobile Phone, AIOT, HPC (High Performance Computing), Server, IC, CPU, MOS, LED, Mother Board,Pow

TGLOBAL

Thermal Pad

Features • Smooth surface & low contact resistance • Low thermal resistance • High stabality • Great reliability Applications Electronic components - Electric Vehicles, 5G, Autopilot System, Mobile Phone, AIOT, HPC (High Performance Computing), Server, IC, CPU, MOS, LED, Mother Board,Pow

TGLOBAL

Thermal Pad

Features • Smooth surface & low contact resistance • Low thermal resistance • High stabality • Great reliability Applications Electronic components - Electric Vehicles, 5G, Autopilot System, Mobile Phone, AIOT, HPC (High Performance Computing), Server, IC, CPU, MOS, LED, Mother Board,Pow

TGLOBAL

Thermal Pad

Features • Smooth surface & low contact resistance • Low thermal resistance • High stabality • Great reliability Applications Electronic components - Electric Vehicles, 5G, Autopilot System, Mobile Phone, AIOT, HPC (High Performance Computing), Server, IC, CPU, MOS, LED, Mother Board,Pow

TGLOBAL

Thermal Pad

Features • Smooth surface & low contact resistance • Low thermal resistance • High stabality • Great reliability Applications Electronic components - Electric Vehicles, 5G, Autopilot System, Mobile Phone, AIOT, HPC (High Performance Computing), Server, IC, CPU, MOS, LED, Mother Board,Pow

TGLOBAL

Thermal Pad

Features • Smooth surface & low contact resistance • Low thermal resistance • High stabality • Great reliability Applications Electronic components - Electric Vehicles, 5G, Autopilot System, Mobile Phone, AIOT, HPC (High Performance Computing), Server, IC, CPU, MOS, LED, Mother Board,Pow

TGLOBAL

Thermal Pad

Features • Smooth surface & low contact resistance • Low thermal resistance • High stabality • Great reliability Applications Electronic components - Electric Vehicles, 5G, Autopilot System, Mobile Phone, AIOT, HPC (High Performance Computing), Server, IC, CPU, MOS, LED, Mother Board,Pow

TGLOBAL

Thermal Pad

Features • Smooth surface & low contact resistance • Low thermal resistance • High stabality • Great reliability Applications Electronic components - Electric Vehicles, 5G, Autopilot System, Mobile Phone, AIOT, HPC (High Performance Computing), Server, IC, CPU, MOS, LED, Mother Board,Pow

TGLOBAL

Thermal Pad

Features • Smooth surface & low contact resistance • Low thermal resistance • High stabality • Great reliability Applications Electronic components - Electric Vehicles, 5G, Autopilot System, Mobile Phone, AIOT, HPC (High Performance Computing), Server, IC, CPU, MOS, LED, Mother Board,Pow

TGLOBAL

Thermal Pad

Features • Smooth surface & low contact resistance • Low thermal resistance • High stabality • Great reliability Applications Electronic components - Electric Vehicles, 5G, Autopilot System, Mobile Phone, AIOT, HPC (High Performance Computing), Server, IC, CPU, MOS, LED, Mother Board,Pow

TGLOBAL

Thermal Pad

Features • Smooth surface & low contact resistance • Low thermal resistance • High stabality • Great reliability Applications Electronic components - Electric Vehicles, 5G, Autopilot System, Mobile Phone, AIOT, HPC (High Performance Computing), Server, IC, CPU, MOS, LED, Mother Board,Pow

TGLOBAL

更新时间:2025-10-6 14:01:00
IC供应商 芯片型号 品牌 批号 封装 库存 备注 价格
TOS
NEW
SOP-8
9526
代理全系列销售,全新原装正品,价格优势,长期供应,量大可订
TOSHIBA/东芝
24+
SOP
60000
全新原装现货
SILVERMICRO
23+
标准封装
5000
原厂授权一级代理 IGBT模块 可控硅 晶闸管 熔断器质保
TOSHIBA/东芝
2511
SOP-8
360000
电子元器件采购降本 30%!盈慧通原厂直采,砍掉中间差价
TOSHIBA/东芝
23+
SOP-8
330000
原厂授权一级代理,专业海外优势订货,价格优势、品种
TOSHIBA/东芝
2447
SMD8
100500
一级代理专营品牌!原装正品,优势现货,长期排单到货
TOS
23+
SMD8
7300
专注配单,只做原装进口现货
银茂微
23+
MODULE
4500
专营国产功率器件
TOSHIBA/东芝
23+
SOP
50000
全新原装正品现货,支持订货
Toshiba Semiconductor and Stor
22+
8SOP (5.5x6.0)
9000
原厂渠道,现货配单

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