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GP2500价格
参考价格：￥700.2011
型号：GP2500-0.040-02-0816 品牌：Bergquist 备注：这里有GP2500多少钱，2025年最近7天走势，今日出价，今日竞价，GP2500批发/采购报价，GP2500行情走势销售排行榜，GP2500报价。| 型号 | 功能描述 | 生产厂家 企业 | LOGO | 操作 |
|---|---|---|---|---|
GP2500 | Thermally Conductive, Un-Reinforced Gap Filling Material Features and Benefits • Thermal conductivity: 2.7 W/m-K • High thermal performance, cost-effective solution • Un-reinforced construction for additional compliancy • Medium compliancy and conformability Typical Applications Include: • Multiple heat-generating components to a common heat s | BERGQUIST |   | |
Thermally Conductive, Un-Reinforced Gap Filling Material Features and Benefits • Thermal conductivity: 2.7 W/m-K • High thermal performance, cost-effective solution • Un-reinforced construction for additional compliancy • Medium compliancy and conformability Typical Applications Include: • Multiple heat-generating components to a common heat s | BERGQUIST | | ||
Highly Conformable,Thermally Conductive, Reinforced “S-Class” Gap Filling Material Features and Benefits • Thermal conductivity: 2.4 W/m-K • Low “S-Class” thermal resistance at ultra-low pressures • Ultra conformable,“gel-like” modulus • Designed for low-stress applications • Fiberglass reinforced for puncture, shear and tear resistance | HENKEL 汉高 | | ||
Highly Conformable,Thermally Conductive, Reinforced “S-Class” Gap Filling Material Features and Benefits • Thermal conductivity: 2.4 W/m-K • Low “S-Class” thermal resistance at ultra-low pressures • Ultra conformable,“gel-like” modulus • Designed for low-stress applications • Fiberglass reinforced for puncture, shear and tear resistance | HENKEL 汉高 | | ||
Highly Conformable,Thermally Conductive, Reinforced “S-Class” Gap Filling Material Features and Benefits • Thermal conductivity: 2.4 W/m-K • Low “S-Class” thermal resistance at ultra-low pressures • Ultra conformable,“gel-like” modulus • Designed for low-stress applications • Fiberglass reinforced for puncture, shear and tear resistance | HENKEL 汉高 | | ||
Highly Conformable,Thermally Conductive, Reinforced “S-Class” Gap Filling Material Features and Benefits • Thermal conductivity: 2.4 W/m-K • Low “S-Class” thermal resistance at ultra-low pressures • Ultra conformable,“gel-like” modulus • Designed for low-stress applications • Fiberglass reinforced for puncture, shear and tear resistance | HENKEL 汉高 | | ||
Highly Conformable,Thermally Conductive, Reinforced “S-Class” Gap Filling Material Features and Benefits • Thermal conductivity: 2.4 W/m-K • Low “S-Class” thermal resistance at ultra-low pressures • Ultra conformable,“gel-like” modulus • Designed for low-stress applications • Fiberglass reinforced for puncture, shear and tear resistance | HENKEL 汉高 | | ||
Highly Conformable,Thermally Conductive, Reinforced “S-Class” Gap Filling Material Features and Benefits • Thermal conductivity: 2.4 W/m-K • Low “S-Class” thermal resistance at ultra-low pressures • Ultra conformable,“gel-like” modulus • Designed for low-stress applications • Fiberglass reinforced for puncture, shear and tear resistance | HENKEL 汉高 | | ||
Highly Conformable,Thermally Conductive, Reinforced “S-Class” Gap Filling Material Features and Benefits • Thermal conductivity: 2.4 W/m-K • Low “S-Class” thermal resistance at ultra-low pressures • Ultra conformable,“gel-like” modulus • Designed for low-stress applications • Fiberglass reinforced for puncture, shear and tear resistance | HENKEL 汉高 | | ||
Highly Conformable,Thermally Conductive, Reinforced “S-Class” Gap Filling Material Features and Benefits • Thermal conductivity: 2.4 W/m-K • Low “S-Class” thermal resistance at ultra-low pressures • Ultra conformable,“gel-like” modulus • Designed for low-stress applications • Fiberglass reinforced for puncture, shear and tear resistance | HENKEL 汉高 | | ||
Highly Conformable,Thermally Conductive, Reinforced “S-Class” Gap Filling Material Features and Benefits • Thermal conductivity: 2.4 W/m-K • Low “S-Class” thermal resistance at ultra-low pressures • Ultra conformable,“gel-like” modulus • Designed for low-stress applications • Fiberglass reinforced for puncture, shear and tear resistance | HENKEL 汉高 | | ||
Highly Conformable,Thermally Conductive, Reinforced “S-Class” Gap Filling Material Features and Benefits • Thermal conductivity: 2.4 W/m-K • Low “S-Class” thermal resistance at ultra-low pressures • Ultra conformable,“gel-like” modulus • Designed for low-stress applications • Fiberglass reinforced for puncture, shear and tear resistance | HENKEL 汉高 | | ||
Highly Conformable,Thermally Conductive, Reinforced “S-Class” Gap Filling Material Features and Benefits • Thermal conductivity: 2.4 W/m-K • Low “S-Class” thermal resistance at ultra-low pressures • Ultra conformable,“gel-like” modulus • Designed for low-stress applications • Fiberglass reinforced for puncture, shear and tear resistance | HENKEL 汉高 | | ||
Highly Conformable,Thermally Conductive, Reinforced “S-Class” Gap Filling Material Features and Benefits • Thermal conductivity: 2.4 W/m-K • Low “S-Class” thermal resistance at ultra-low pressures • Ultra conformable,“gel-like” modulus • Designed for low-stress applications • Fiberglass reinforced for puncture, shear and tear resistance | HENKEL 汉高 | | ||
Highly Conformable,Thermally Conductive, Reinforced “S-Class” Gap Filling Material Features and Benefits • Thermal conductivity: 2.4 W/m-K • Low “S-Class” thermal resistance at ultra-low pressures • Ultra conformable,“gel-like” modulus • Designed for low-stress applications • Fiberglass reinforced for puncture, shear and tear resistance | HENKEL 汉高 | | ||
Highly Conformable,Thermally Conductive, Reinforced “S-Class” Gap Filling Material Features and Benefits • Thermal conductivity: 2.4 W/m-K • Low “S-Class” thermal resistance at ultra-low pressures • Ultra conformable,“gel-like” modulus • Designed for low-stress applications • Fiberglass reinforced for puncture, shear and tear resistance | HENKEL 汉高 | | ||
Highly Conformable,Thermally Conductive, Reinforced “S-Class” Gap Filling Material Features and Benefits • Thermal conductivity: 2.4 W/m-K • Low “S-Class” thermal resistance at ultra-low pressures • Ultra conformable,“gel-like” modulus • Designed for low-stress applications • Fiberglass reinforced for puncture, shear and tear resistance | HENKEL 汉高 | | ||
Highly Conformable,Thermally Conductive, Reinforced “S-Class” Gap Filling Material Features and Benefits • Thermal conductivity: 2.4 W/m-K • Low “S-Class” thermal resistance at ultra-low pressures • Ultra conformable,“gel-like” modulus • Designed for low-stress applications • Fiberglass reinforced for puncture, shear and tear resistance | HENKEL 汉高 | | ||
Highly Conformable,Thermally Conductive, Reinforced “S-Class” Gap Filling Material Features and Benefits • Thermal conductivity: 2.4 W/m-K • Low “S-Class” thermal resistance at ultra-low pressures • Ultra conformable,“gel-like” modulus • Designed for low-stress applications • Fiberglass reinforced for puncture, shear and tear resistance | HENKEL 汉高 | | ||
Highly Conformable,Thermally Conductive, Reinforced “S-Class” Gap Filling Material Features and Benefits • Thermal conductivity: 2.4 W/m-K • Low “S-Class” thermal resistance at ultra-low pressures • Ultra conformable,“gel-like” modulus • Designed for low-stress applications • Fiberglass reinforced for puncture, shear and tear resistance | HENKEL 汉高 | | ||
Highly Conformable,Thermally Conductive, Reinforced “S-Class” Gap Filling Material Features and Benefits • Thermal conductivity: 2.4 W/m-K • Low “S-Class” thermal resistance at ultra-low pressures • Ultra conformable,“gel-like” modulus • Designed for low-stress applications • Fiberglass reinforced for puncture, shear and tear resistance | HENKEL 汉高 | | ||
Highly Conformable,Thermally Conductive, Reinforced “S-Class” Gap Filling Material Features and Benefits • Thermal conductivity: 2.4 W/m-K • Low “S-Class” thermal resistance at ultra-low pressures • Ultra conformable,“gel-like” modulus • Designed for low-stress applications • Fiberglass reinforced for puncture, shear and tear resistance | HENKEL 汉高 | | ||
Highly Conformable,Thermally Conductive, Reinforced “S-Class” Gap Filling Material Features and Benefits • Thermal conductivity: 2.4 W/m-K • Low “S-Class” thermal resistance at ultra-low pressures • Ultra conformable,“gel-like” modulus • Designed for low-stress applications • Fiberglass reinforced for puncture, shear and tear resistance | HENKEL 汉高 | | ||
Highly Conformable,Thermally Conductive, Reinforced “S-Class” Gap Filling Material Features and Benefits • Thermal conductivity: 2.4 W/m-K • Low “S-Class” thermal resistance at ultra-low pressures • Ultra conformable,“gel-like” modulus • Designed for low-stress applications • Fiberglass reinforced for puncture, shear and tear resistance | HENKEL 汉高 | | ||
包装：袋 描述：SHAFT, 0.2500 DIA. X 18IN LG 五金件，紧固件，配件 结构，运动五金件 | ETC 知名厂家 | ETC | | |
包装：袋 描述：SHAFT, 0.2500 DIA. X 2IN LG 五金件，紧固件，配件 结构，运动五金件 | ETC 知名厂家 | ETC | | |
3M??Four-Wall Header 文件：1.4165 Mbytes Page：6 Pages | 3M | | ||
CAPTIVE PANEL SCREWS 文件：395.93 Kbytes Page：1 Pages | ETCList of Unclassifed Manufacturers 未分类制造商 | | ||
LONG FRAME (1/4) TWIN ROW JACK PANELS 文件：56.68 Kbytes Page：1 Pages | SWITCH | | ||
Low Value Metal Film Resistors 文件：87.03 Kbytes Page：1 Pages | WELWYN | | ||
Thermal Grease 文件：721.83 Kbytes Page：2 Pages | LSTD 莱尔德 | |
GP2500产品属性
- 类型
描述
- 型号
GP2500
- 制造商
The Bergquist Company
- 功能描述
GAP PAD 2500 .040 4X4 SHEET
- 制造商
The Bergquist Company
- 功能描述
GAP PAD 2500 .040, 4X4 SHEET
- 制造商
The Bergquist Company
- 功能描述
GAP PAD, 2500 S80, .04", 100X100MM; Insulator Body
- Material
Polymer; Thermal
- Conductivity
2.7W/m.K; Breakdown Voltage
- Vbr
6kV;
- Thickness
1.016mm; Volume
- Resistivity
10ohm-m; Thermal
- Impedance
0.74C/W; Operating Temperature
- Max
200C
| IC供应商 | 芯片型号 | 品牌 | 批号 | 封装 | 库存 | 备注 | 价格 |
|---|---|---|---|---|---|---|---|
固派电子 |
16+ |
自恢复保险丝 |
1730 |
一级代理,专注军工、汽车、医疗、工业、新能源、电力 |
|||
JST/日压 |
22+ |
连接器 |
728922 |
代理-优势-原装-正品-现货*期货 |
|||
捷捷微 |
23+ |
TO-220F-2L |
30000 |
原厂授权一级代理,专业海外优势订货,价格优势、品种 |
|||
捷捷微 |
24+ |
TO-263 |
50000 |
只做原装，欢迎询价，量大价优 |
|||
固派电子 |
04+ |
681 |
优势货源原装正品 |
||||
JJW/捷捷微 |
24+ |
T0-220FP-2L |
50000 |
全新原装,一手货源,全场热卖! |
|||
VISHAY |
23+ |
标准封装 |
5000 |
原厂授权一级代理 IGBT模块 可控硅 晶闸管 熔断器质保 |
|||
固派电子 |
24+ |
8000 |
原装现货,特价销售 |
||||
23+ |
自恢复保险丝 |
50000 |
全新原装正品现货,支持订货 |
||||
固派电子 |
16+ |
NA |
8800 |
原装现货,货真价优 |
GP2500规格书下载地址
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2021-1-26
DdatasheetPDF页码索引
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