Zener Diodes

FEATURES • Plastic package has underwriters laboratory flammability classification UL 94 V-0 • For surface mounted applications • Glass passivated chip junction • Low Zener impedance • Low regulation factor • High temperature soldering guaranteed:  250 °C/10 s at terminals • Material catego

SURFACE MOUNT GLASS PASSIVATED ZENER

FEATURES ♦ Plastic package has Underwriters Laboratory Flammability Classification 94V-0 ♦ For surface mounted applications ♦ Glass passivated chip junction ♦ Low zener impedance ♦ Low regulation factor ♦ High temperature soldering guaranteed: 250°C/10 seconds at terminals

Zener Diodes

Zener Diodes

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Zener Diodes

FEATURES • Plastic package has underwriters laboratory flammability classification UL 94 V-0 • For surface mounted applications • Glass passivated chip junction • Low Zener impedance • Low regulation factor • High temperature soldering guaranteed:  250 °C/10 s at terminals • Material catego

SURFACE MOUNT SILICON ZENER DIODES

VOLTAGE RANGE: 3.3 - 100V POWER: 1.0Watts Features ● Low leakage current ● High reliability ● High peak reverse power dissipation ● Complete voltage range 3.3 to 100 Volts

1W 24V Zener diode

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封装/外壳：DO-213AB，MELF 包装：卷带（TR） 描述：DIODE ZENER 24V 1W MELF 分立半导体产品 二极管 - 齐纳 - 单

封装/外壳：DO-213AB，MELF 包装：卷带（TR） 描述：DIODE ZENER 24V 1W MELF 分立半导体产品 二极管 - 齐纳 - 单

2500 WATTS (AC) DC/D CSINGLE OUTPUT

Features • Single Output • 6U x 28TE x 306mm • Weight 9.0kg

ZENER DIODE CHIPS

• ZENER DIODE CHIPS • ALL JUNCTIONS COMPLETELY PROTECTED WITH SILICON DIOXIDE • ELECTRICALLY EQUIVALENT TO 1N4728A THRU 1N4764A • 1 WATT CAPABILITY WITH PROPER HEAT SINKING • COMPATIBLE WITH ALL WIRE BONDING AND DIE ATTACH TECHNIQUES, WITH THE EXCEPTION OF SOLDER REFLOW

1 WATT ZENER DIODES

• 1 WATT ZENER DIODES • LEADLESS PACKAGE FOR SURFACE MOUNT • DOUBLE PLUG CONSTRUCTION • METALLURGICALLY BONDED

RoHS Device

文件：374.95 Kbytes Page：6 Pages

Silicon Z–Diodes

文件：84.8 Kbytes Page：4 Pages