General Purpose Plastic Rectifier

FEATURES • Low forward voltage drop • Low leakage current, IR less than 0.1 μA • High forward surge capability • Solder dip 275 °C max. 10 s, per JESD 22-B106 • Material categorization: For definitions of compliance please see www.vishay.com/doc?99912 TYPICAL APPLICATIONS For use in gene

PLASTIC SILICON RECTIFIER

VOLTAGE RANGE: 50 --- 1000 V CURRENT: 3.0 A FEATURES ◇ Low cost ◇ Low leakage ◇ Low forward voltage drop ◇ High current capability ◇ Diffused junction ◇ Easily cleaned witn Freon,Alcohol,lsopropanol and similar solvents ◇ The plastic material carries U/L recognition 94

GENERAL PURPOSE PLASTIC RECTIFIER

Reverse Voltage - 50 to 1000 Volts Forward Current - 3.0 Amperes FEATURES ♦ Plastic package has Underwriters Laboratory Flammability Classification 94V-0 ♦ High surge current capability ♦ Typical IR less than 0.1µA ♦ Construction utilizes void-free molded plastic technique

General Purpose Plastic Rectifier

FEATURES • Low forward voltage drop • Low leakage current, IR less than 0.1 μA • High forward surge capability • Solder dip 275 °C max. 10 s, per JESD 22-B106 • Material categorization: For definitions of compliance please see www.vishay.com/doc?99912 TYPICAL APPLICATIONS  

PLASTIC SILICON RECTIFIERS

VOLTAGE RANGE: 50 --- 1000 V CURRENT: 3.0 A FEATURES ◇ Low cost ◇ Low leakage ◇ Low forward voltage drop ◇ High current capability ◇ Diffused junction ◇ Easily cleaned witn Freon,Alcohol,lsopropanol and similar solvents ◇ The plastic material carries U/L recognition 94

GENERAL PURPOSE PLASTIC RECTIFIER

FEATURES ♦ Plastic package has Underwriters Laboratory Flammability Classification 94V-0 ♦ High surge current capability ♦ Typical IR less than 0.1µA ♦ Construction utilizes void-free molded plastic technique ♦ High current operation of 3.0 Amperes at TA=95°C with no thermal r

General Purpose Plastic Rectifier

文件：74.04 Kbytes Page：4 Pages

General Purpose Plastic Rectifier

General Purpose Plastic Rectifier

FEATURES • Low forward voltage drop • Low leakage current, IR less than 0.1 μA • High forward surge capability • Solder dip 275 °C max. 10 s, per JESD 22-B106 • Material categorization: For definitions of compliance please see www.vishay.com/doc?99912 TYPICAL APPLICATIONS For use in gene

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