General Purpose Plastic Rectifier

FEATURES • Low forward voltage drop • Low leakage current, IR less than 0.1 μA • High forward surge capability • Solder dip 275 °C max. 10 s, per JESD 22-B106 • Material categorization: For definitions of compliance please see www.vishay.com/doc?99912 TYPICAL APPLICATIONS For use in gene

3.5 Embedded SBC with LGA1151 Socket for 7th/6th Gen Intel® Core™ i7/i5/i3 Processor, LVDS, VGA, HDMI, 2 GbE LANs and Audio

Features ● LGA1151 socket 7th/6th gen Intel® Core™ i7/i5/i3 processor (Kaby Lake/Skylake) ● Intel® H110 chipset (Q170 optional) ● 1 DDR4 SO-DIMM for up to 16GB of memory ● 3 USB 2.0 and 3 USB 3.0 ● Intel® AMT 11 supported (optional) ● Dual view for H110 chipset; triple view for Q170 chipset

COM Express Type 6 Basic Module with Intel® Xeon® and 6th Gen Intel® Core™ i7/i5/i3 Processor, Intel® CM236/QM170/HM170

Features ● 6th gen Intel® Xeon® and Core™ i7/i5/i3 processors (Skylake-H) ● Intel® CM236/QM170/HM170 chipset ● 2 DDR4-2133 SO-DIMM, up to 32GB ECC or non-ECC ● 1 x PCIe x16 and 8 x PCIe x1 Gen. 3 ● 4 SATA-600 with RAID 0/1/5/10 ● 4 USB 3.0 and 8 USB 2.0 ● Intel® AMT 11.0 and TPM 1.2 support

CAN Over Powerline Transceiver

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7 Segment Display

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