| 型号 | 功能描述 | 生产厂家 企业 | LOGO | 操作 |
|---|---|---|---|---|
丝印代码：GH306；8-BIT LVTTL-TO-GTLP BUS TRANSCEIVER FEATURES · TI-OPC™ Circuitry Limits Ringing on Unevenly Loaded Backplanes · OEC™ Circuitry Improves Signal Integrity and Reduces Electromagnetic Interference · Bidirectional Interface Between GTLP Signal Levels and LVTTL Logic Levels · LVTTL Interfaces Are 5-V Tolerant · Medium-Drive GTLP | TI 德州仪器 |   | ||
丝印代码：GH306；8-BIT LVTTL-TO-GTLP BUS TRANSCEIVER FEATURES · TI-OPC™ Circuitry Limits Ringing on Unevenly Loaded Backplanes · OEC™ Circuitry Improves Signal Integrity and Reduces Electromagnetic Interference · Bidirectional Interface Between GTLP Signal Levels and LVTTL Logic Levels · LVTTL Interfaces Are 5-V Tolerant · Medium-Drive GTLP | TI 德州仪器 | | ||
丝印代码：GH306；8-BIT LVTTL-TO-GTLP BUS TRANSCEIVER FEATURES · TI-OPC™ Circuitry Limits Ringing on Unevenly Loaded Backplanes · OEC™ Circuitry Improves Signal Integrity and Reduces Electromagnetic Interference · Bidirectional Interface Between GTLP Signal Levels and LVTTL Logic Levels · LVTTL Interfaces Are 5-V Tolerant · Medium-Drive GTLP | TI 德州仪器 | | ||
丝印代码：GH306；8-BIT LVTTL-TO-GTLP BUS TRANSCEIVER FEATURES · TI-OPC™ Circuitry Limits Ringing on Unevenly Loaded Backplanes · OEC™ Circuitry Improves Signal Integrity and Reduces Electromagnetic Interference · Bidirectional Interface Between GTLP Signal Levels and LVTTL Logic Levels · LVTTL Interfaces Are 5-V Tolerant · Medium-Drive GTLP | TI 德州仪器 | | ||
丝印代码：GH306；8-BIT LVTTL-TO-GTLP BUS TRANSCEIVER FEATURES · TI-OPC™ Circuitry Limits Ringing on Unevenly Loaded Backplanes · OEC™ Circuitry Improves Signal Integrity and Reduces Electromagnetic Interference · Bidirectional Interface Between GTLP Signal Levels and LVTTL Logic Levels · LVTTL Interfaces Are 5-V Tolerant · Medium-Drive GTLP | TI 德州仪器 | | ||
丝印代码：GH306；8-BIT LVTTL-TO-GTLP BUS TRANSCEIVER FEATURES · TI-OPC™ Circuitry Limits Ringing on Unevenly Loaded Backplanes · OEC™ Circuitry Improves Signal Integrity and Reduces Electromagnetic Interference · Bidirectional Interface Between GTLP Signal Levels and LVTTL Logic Levels · LVTTL Interfaces Are 5-V Tolerant · Medium-Drive GTLP | TI 德州仪器 | | ||
丝印代码：GH306；8-BIT LVTTL-TO-GTLP BUS TRANSCEIVER FEATURES · TI-OPC™ Circuitry Limits Ringing on Unevenly Loaded Backplanes · OEC™ Circuitry Improves Signal Integrity and Reduces Electromagnetic Interference · Bidirectional Interface Between GTLP Signal Levels and LVTTL Logic Levels · LVTTL Interfaces Are 5-V Tolerant · Medium-Drive GTLP | TI 德州仪器 | | ||
丝印代码：GH306；8-BIT LVTTL-TO-GTLP BUS TRANSCEIVER FEATURES · TI-OPC™ Circuitry Limits Ringing on Unevenly Loaded Backplanes · OEC™ Circuitry Improves Signal Integrity and Reduces Electromagnetic Interference · Bidirectional Interface Between GTLP Signal Levels and LVTTL Logic Levels · LVTTL Interfaces Are 5-V Tolerant · Medium-Drive GTLP | TI 德州仪器 | | ||
丝印代码：GH306；8-BIT LVTTL-TO-GTLP BUS TRANSCEIVER FEATURES · TI-OPC™ Circuitry Limits Ringing on Unevenly Loaded Backplanes · OEC™ Circuitry Improves Signal Integrity and Reduces Electromagnetic Interference · Bidirectional Interface Between GTLP Signal Levels and LVTTL Logic Levels · LVTTL Interfaces Are 5-V Tolerant · Medium-Drive GTLP | TI 德州仪器 | | ||
丝印代码：GH306；8-BIT LVTTL-TO-GTLP BUS TRANSCEIVER FEATURES · TI-OPC™ Circuitry Limits Ringing on Unevenly Loaded Backplanes · OEC™ Circuitry Improves Signal Integrity and Reduces Electromagnetic Interference · Bidirectional Interface Between GTLP Signal Levels and LVTTL Logic Levels · LVTTL Interfaces Are 5-V Tolerant · Medium-Drive GTLP | TI 德州仪器 | | ||
丝印代码：GH306；8-BIT LVTTL-TO-GTLP BUS TRANSCEIVER FEATURES · TI-OPC™ Circuitry Limits Ringing on Unevenly Loaded Backplanes · OEC™ Circuitry Improves Signal Integrity and Reduces Electromagnetic Interference · Bidirectional Interface Between GTLP Signal Levels and LVTTL Logic Levels · LVTTL Interfaces Are 5-V Tolerant · Medium-Drive GTLP | TI 德州仪器 | | ||
丝印代码：GH306；8-BIT LVTTL-TO-GTLP BUS TRANSCEIVER FEATURES · TI-OPC™ Circuitry Limits Ringing on Unevenly Loaded Backplanes · OEC™ Circuitry Improves Signal Integrity and Reduces Electromagnetic Interference · Bidirectional Interface Between GTLP Signal Levels and LVTTL Logic Levels · LVTTL Interfaces Are 5-V Tolerant · Medium-Drive GTLP | TI 德州仪器 | | ||
丝印代码：GH306；8-BIT LVTTL-TO-GTLP BUS TRANSCEIVER FEATURES · TI-OPC™ Circuitry Limits Ringing on Unevenly Loaded Backplanes · OEC™ Circuitry Improves Signal Integrity and Reduces Electromagnetic Interference · Bidirectional Interface Between GTLP Signal Levels and LVTTL Logic Levels · LVTTL Interfaces Are 5-V Tolerant · Medium-Drive GTLP | TI 德州仪器 | | ||
丝印代码：GH306；8-BIT LVTTL-TO-GTLP BUS TRANSCEIVER FEATURES · TI-OPC™ Circuitry Limits Ringing on Unevenly Loaded Backplanes · OEC™ Circuitry Improves Signal Integrity and Reduces Electromagnetic Interference · Bidirectional Interface Between GTLP Signal Levels and LVTTL Logic Levels · LVTTL Interfaces Are 5-V Tolerant · Medium-Drive GTLP | TI 德州仪器 | | ||
丝印代码：GH306；8-BIT LVTTL-TO-GTLP BUS TRANSCEIVER FEATURES · TI-OPC™ Circuitry Limits Ringing on Unevenly Loaded Backplanes · OEC™ Circuitry Improves Signal Integrity and Reduces Electromagnetic Interference · Bidirectional Interface Between GTLP Signal Levels and LVTTL Logic Levels · LVTTL Interfaces Are 5-V Tolerant · Medium-Drive GTLP | TI 德州仪器 | | ||
SINGLE-PHASE SILICON BRIDGE-P.C. MTG 2A, HEAT-SINK MTG 3A(VOLTAGE - 50 to 1000 Volts CURRENT - 3.0 Amperes) VOLTAGE - 50 to 1000 Volts CURRENT - 3.0 Amperes FEATURES • Surge overload rating—50 Amperes peak • Low forward voltage drop and reverse leakage • Small size, simple installation • Plastic package has Underwriter Laboratory Flammability Classification 94V-O • Reliable low | PANJIT 強茂 | | ||
HIGH EFFICIENCY RECTIFIERS(3.0A,600-1000V)
| MOSPEC 统懋 | | ||
SCHOTTKY BARRIER RECTIFIERS(3.0A,20-60V)
| MOSPEC 统懋 | | ||
ULTRAFAST SWITCHING RECTIFIER(VOLTAGE - 50 to 1000 Volts CURRENT - 3.0 Amperes) VOLTAGE - 50 to 1000 Volts CURRENT - 3.0 Amperes FEATURES • Plastic package has Underwriters Laboratory Flammability Classification 94V-O utilizing Flame Retardant Epoxy Molding Compound • Exceeds environmental standards of MIL-S-19500/228. • Ultra Fast switching for high efficien | PANJIT 強茂 | | ||
Voltage Comparator 文件：97.42 Kbytes Page：6 Pages | NSC 国半 | |
| IC供应商 | 芯片型号 | 品牌 | 批号 | 封装 | 库存 | 备注 | 价格 |
|---|---|---|---|---|---|---|---|
TI |
25+ |
N/A |
20948 |
样件支持,可原厂排单订货! |
|||
TI |
25+ |
N/A |
21000 |
正规渠道,免费送样。支持账期,BOM一站式配齐 |
|||
TI/德州仪器 |
2450+ |
DSBGA |
9850 |
只做原厂原装正品现货或订货假一赔十! |
|||
Texas Instruments |
24+25+ |
16500 |
全新原厂原装现货!受权代理!可送样可提供技术支持! |
||||
TI/德州仪器 |
2402+ |
QFN |
8324 |
原装正品!实单价优! |
|||
TI |
23+ |
BGA |
3200 |
正规渠道,只有原装! |
|||
西门子 |
24+ |
TO92 |
6600 |
||||
TI |
23+ |
BGA |
5000 |
全新原装,支持实单,非诚勿扰 |
|||
TI |
23+ |
BGA |
3200 |
公司只做原装，可来电咨询 |
|||
TI |
三年内 |
1983 |
只做原装正品 |
GH306芯片相关品牌
GH306规格书下载地址
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2019-9-6
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