PASSIVE DEVICES - Spiral Bias Elements

DESCRIPTION The GC9000 series of spiral bias element chips are photolithographically fabricated planar spiral conductorssupported on a high quality fused quartz substrate. These devices are designed to meet hybrid microwave circuit requirements for DC power injection through Ku (or J) band. The

Silicon Passive Devices

封装/外壳：模具 功能：偏置网络 包装：卷带（TR） 描述：QUARTZ INDUCTOR NON HERMETIC CHI RF/IF，射频/中频和 RFID RF 其它 IC 和模块

Miniature SIP Relays

Miniature Molded SIP Reed Relays The 9012 package dimensions are 47 smaller than standard 9000 SIPs, yet the relay retains the 10W switch ratings of its larger counterparts. The 9011 package dimensions is 65 smaller than the standard 9000 SIPs and incorporates the RI-70 switch rated at 3W.

Piezoelectric force sensors Piezoelectric ring force transducers for tensile and compression forces from 7.5 kN to 1 200 kN

9011, 9012 9117 Miniature SIP Relays

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Miniature SIP Relays

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Customer Specification

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