PASSIVE DEVICES - Spiral Bias Elements

DESCRIPTION The GC9000 series of spiral bias element chips are photolithographically fabricated planar spiral conductorssupported on a high quality fused quartz substrate. These devices are designed to meet hybrid microwave circuit requirements for DC power injection through Ku (or J) band. The

Silicon Passive Devices

封装/外壳：模具 功能：偏置网络 包装：卷带（TR） 描述：QUARTZ INDUCTOR NON HERMETIC CHI RF/IF，射频/中频和 RFID RF 其它 IC 和模块

BALUN 75/120 BNC F KRONE IDC

SPECIFICATIONS; MATERIALS; BODY: BRASS INNER CONTACT: PHOSPHORUS BRONZE INSULATOR: PTFE OUTER SLEEVE & BASE MOLDING: NORYL, BLACK IDC MOLDING: POLYESTER, WHITE FINISH; BODY: NICKEL PLATE CONTACT: GOLD PLATE IDC CONTACTS: SILVER PLATE ELECTRICAL; CHARACTERISTIC IMPEDANCE: 75 OH

4 x E1/T1 Fiber Mux/De-mux over One Fiber Optic Cable

DESCRIPTION The ACS406CS comprises a chip set of two highly integrated devices, the ACS9010 and ACS4060. The ACS9010 is an analog transceiver device and the ACS4060 is a mixed signal device. FEATURES • Two chip set supporting full duplex serial data transmission up to 8.448Mbps over one fiber

Heyco® Self-Closing Braided Sleeving

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900 MHz ISM Band Analog RF Front End

文件：481.84 Kbytes Page：28 Pages

900 MHz ISM Band Analog RF Front End

文件：400.02 Kbytes Page：29 Pages