Switching & Attenuation Diodes

The high power PIN diode series is available in surface mount stud and insulated stud packages. These PIN diode chips utilize high resistivity material and an intrinsic float zone process technology thus ensuring low loss and low distortion characteristics through HF band. Due to a thick base width

CONTROL DEVICES High Power PIN Diodes

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封装/外壳：接线柱 包装：托盘 描述：SI PIN HERMETIC STUD 分立半导体产品 二极管 - 射频

封装/外壳：接线柱 包装：卷带（TR） 描述：SI PIN HERMETIC STUD 分立半导体产品 二极管 - 射频

5ohm, Quad, SPST, CMOS Analog Switches

General Description The MAX4604/MAX4605/MAX4606 quad analog switches feature 5Ω max on-resistance. On-resistance is matched between switches to 0.5Ω max and is flat (0.5Ω max) over the specified signal range. Each switch can handle Rail-to-Rail® analog signals. The off-leakage current is only 2.5

5ohm, Quad, SPST, CMOS Analog Switches

General Description The MAX4604/MAX4605/MAX4606 quad analog switches feature 5Ω max on-resistance. On-resistance is matched between switches to 0.5Ω max and is flat (0.5Ω max) over the specified signal range. Each switch can handle Rail-to-Rail® analog signals. The off-leakage current is only 2.5

5ohm, Quad, SPST, CMOS Analog Switches

General Description The MAX4604/MAX4605/MAX4606 quad analog switches feature 5Ω max on-resistance. On-resistance is matched between switches to 0.5Ω max and is flat (0.5Ω max) over the specified signal range. Each switch can handle Rail-to-Rail® analog signals. The off-leakage current is only 2.5

5ohm, Quad, SPST, CMOS Analog Switches

General Description The MAX4604/MAX4605/MAX4606 quad analog switches feature 5Ω max on-resistance. On-resistance is matched between switches to 0.5Ω max and is flat (0.5Ω max) over the specified signal range. Each switch can handle Rail-to-Rail® analog signals. The off-leakage current is only 2.5

Silicon NPN(PNP) epitaxial planer transistor

Silicon NPN epitaxial planar type (Tr1) Silicon PNP epitaxial planar type (Tr2) For amplification of low-frequency output ■ Features • Two elements incorporated into one package • Reduction of the mounting area and assembly cost by one half