Bridge Rectifiers

Features UL recognition, file #230084 Glass passivated chip junction “Thin single in-ine package High surge current capabilty Solder dip 275 °C max. 7 s, per JESD 22-106

Bridge Rectifiers

Features ● UL recognition, file #E230084 ● Thin single in-line package ● High surge current capability ● Solder dip 275 °C max. 7 s, per JESD 22-B106

ASEMI Bridge Rectifier

Features Plastic package has Underwriters Laboratory Flammability Classification 94V-0 High case dielectric strength of 1500VRMS Ideal for printed circuit boards High surge current capability This series is SGS listed under the Recognized Component Index, file number SZXEC1902259902

封装/外壳：4-SIP，GBJ 包装：管件 描述：RECT BRIDGE 1000V 50A 6KBJ 分立半导体产品 二极管 - 桥式整流器

SINGLE PHASE 50.0AMP GLASS PASSIVATED BRIDGE RECTIFIER

文件：4.16017 Mbytes Page：2 Pages

Bridge Rectifiers

文件：459.56 Kbytes Page：3 Pages

Glass Passivated Single-Phase Bridge Rectifier

文件：694.19 Kbytes Page：3 Pages

Glass Passivated Bridge Rectifiers

文件：443.65 Kbytes Page：3 Pages

Voltage 50V ~ 1000V 50.0 Amp Glass Passivited Bridge Rectifiers

文件：853.18 Kbytes Page：2 Pages

Bridge Rectifiers

文件：457.61 Kbytes Page：4 Pages

SILICON BRIDGE RECTIFIERS

文件：1.041369 Mbytes Page：2 Pages

50.0 AMPERE GLASS PASSIVATED FLAT BRIDGE RECTIFIERS

文件：443.62 Kbytes Page：2 Pages

GLASS PASSIVATED SINGLE-PHASE BRIDGE RECTIFIER

文件：629.94 Kbytes Page：2 Pages

50 Amp Glass Passivated Bridge Rectifier 50 to 1000 Volts

文件：344.16 Kbytes Page：3 Pages

50A GLASS PASSIVATED BRIDGE RECTIFIER

New Series Bridge Rectifier

SINGLE PHASE 50AMP GLASS PASSIVATED BRIDGE RECTIFIER

文件：4.94391 Mbytes Page：3 Pages

封装/外壳：4-SIP，GBJ 包装：卷带（TR）剪切带（CT）Digi-Reel® 得捷定制卷带 描述：BRIDGE RECT 1PHASE 1KV 50A GBJ 分立半导体产品 二极管 - 桥式整流器

50A GLASS PASSIVATED BRIDGE RECTIFIER Reverse

文件：595.53 Kbytes Page：3 Pages

桥式整流 GBU,GBJ 系列

Glass Passivated Single-Phase Bridge Rectifier

文件：597.75 Kbytes Page：3 Pages

TYPE N FEMALE TO SMA MALE ADAPTER

(THM)THRU HOLE MOUNT TEST POINTS-COLOR KEYED •Color keyed for visibility and quick identification •Economical choice for PC test point terminations •Snap-fit mounting provides positive retention for wave soldering •Wire form loop for safe, non-sliptesting •Space saving, ultra low

THM TEST POINTS

(THM)THRU HOLE MOUNT TEST POINTS-COLOR KEYED •Color keyed for visibility and quick identification •Economical choice for PC test point terminations •Snap-fit mounting provides positive retention for wave soldering •Wire form loop for safe, non-sliptesting •Space saving, ultra low

TXRX_982_R1 Evaluation Board

SY88973/SY88982/MIC3001-Based SFP Module General Description This evaluation board is an implementation of the SFP module in a different form factor with on board faults indicators (LEDs) and a DB-25 connector for serial communication. The design uses Micrels MIC3001 controller, SY88982 (pin com

ISO5500EVM

文件：332.01 Kbytes Page：14 Pages

3M??Polyurethane Multi-Purpose Adhesive 5010

文件：201.69 Kbytes Page：5 Pages