General Description

Combining Fairchild’s advanced 2.5V specified PowerTrench process with state of the art BGA packaging, the FDZ299P minimizes both PCB space and RDS(ON). This BGA MOSFET embodies a breakthrough in packaging technology which enables the device to combine excellent thermal transfer characteristics, high current handling capability, ultra low profile packaging, low gate charge, and low RDS(ON).

Features

• –4.6 A, –20 V RDS(ON) = 55 mΩ @ VGS = –4.5 V RDS(ON) = 80 mΩ @ VGS = –2.5 V

• Occupies only 2.25 mm2 of PCB area. Less than 50 of the area of a SSOT-6

• Ultra-thin package: less than 0.80 mm height when mounted to PCB

• Outstanding thermal transfer characteristics: 4 times better than SSOT-6

• Ultra-low Qg x RDS(ON) figure-of-merit

• High power and current handling capability.

Applications

• Battery management

• Load switch

• Battery protection