Wi-Fi 4 & BLE 5.2 模块DIP 封装工作温度：-40 °C ~ +85 °C

FLM142D 是移远通信推出的高性能MCU Wi-Fi 和蓝牙Combo 模块，采用ARM968 处理器，主频高达160 MHz，支持IEEE 802.11b/g/n 协议和BLE 5.2，内置288 KB RAM 和2 MB Flash。\n\n 模块采用DIP 封装，超紧凑的尺寸仅为17.9 mm × 15.0 mm × 2.8 mm，能最大限度地满足终端产品对小尺寸模块产品的需求，兼容多样化的结构设计。\n\n 模块符合WPA-PSK、WPA2-PSK 及WPA3-SAE 安全协议标准，支持真随机数生成器（TRNG, True Random Number Gener

ZenBlockTM; zener with integrated blocking diode

DESCRIPTION Cavity free cylindrical glass package through ImplotecTM(1) technology. This package is hermetically sealed and fatigue free as coefficients of expansion of all used parts are matched. FEATURES • Zener and blocking function in one package • Glass passivated • Low leakage current

POWER TRANSISTORS(10A,60-100V,125W)

10 AMPERE DARLINGTON COMPLEMENTARY SILICON POWER TRANSISTORS

TIP140,TIP141,TIP142 -->NPN TIP145,TIP146,TIP147 ---> PNP . . . designed for general–purpose amplifier and low frequency switching applications. • High DC Current Gain — Min hFE = 1000 @ IC = 5 A, VCE = 4 V • Collector–Emitter Sustaining Voltage — @ 30 mA VCEO(sus) = 60 Vdc (Min) — TIP140,

POWER TRANSISTORS(10A,60-100V,80W)

DARLINGTON COMPLEMENTARY SILICON POWER TRANSISTORS . . . designed for general-purpose amplifier and low speed switching applications. 10 AMPERE DARLINGTIOON COM:EMEMTARY SILICON POWER TRANSISTORS 60 - 100 VOLTS 80 WATTS TIP140T,TIP141T,TIP142T -->NPN TIP145T,TIP146T,TIP147T ---> PNP

Silicon epitaxial planar type

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