N-Channel Dual CoolTM PowerTrench짰 SyncFETTM 30 V, 49 A, 2.6 m廓

Dual Cool™ packaging technology, provides both bottom- and top-side cooling in a PQFN package. Not only is the PQFN footprint an industry standard, it provides the designer with performance flexibility. With enhanced dual path thermal performance and improved parasitics over its wire-bonded predece

DUAL COOL??PACKAGE POWERTRENCH짰 MOSFETs

Dual Cool™ packaging technology, provides both bottom- and top-side cooling in a PQFN package. Not only is the PQFN footprint an industry standard, it provides the designer with performance flexibility. With enhanced dual path thermal performance and improved parasitics over its wire-bonded predece

KK Maxi-3.96mm & 5.08mm Modular Interconnection System

KEY FEATURES ■ Available on 3.96 mm and 5.08 mm center spacings ■ Polarisation via insertable keys and pegs ■ Allows connections anywhere on the board ■ Double cantilever style terminal ■ Selective gold plating options ■ End-to-end stacking capabilities ■ Locking ramp for improved mated ret

1250 MHz Lowpass

文件：48.36 Kbytes Page：3 Pages

SURFACE MOUNT INDUCTORS

文件：34.4 Kbytes Page：2 Pages

Large Dome Plugs

文件：135.79 Kbytes Page：1 Pages

KNOB

文件：84.78 Kbytes Page：1 Pages