IdealforMulti-CarrierSystems

FEATURES IdealforMulti-CarrierSystems LowsideorHighsideLO 11.8dBGain Ultralinear+43dBmIP3OusingHSLOor +37.5dBmIP3OusingLSLO 9.7dBNF 200Ωoutputimpedance Wideflat-performanceIFBW DrivesADCdirectlyforDPDapplications LowPowerConsumption 5

IdealforMulti-CarrierSystems

FEATURES IdealforMulti-CarrierSystems LowsideorHighsideLO 11.7dBGain Ultralinear+45dBmIP3OusingHSLOor +42dBmIP3OusingLSLO 9.7dBNF 200Ωoutputimpedance WideflatperformanceIFBW DrivesADCdirectlyforDPDapplications LowPowerConsumption 5x5

IdealforMulti-CarrierSystems

文件：1.16533 Mbytes Page：25 Pages

RFtoIFSingleDownconvertingMixer

文件：1.19467 Mbytes Page：24 Pages

封装/外壳：20-WQFN 裸露焊盘 包装：托盘 描述：IC MIXER 1.4-2.5GHZ 20VFQFPN RF/IF，射频/中频和 RFID 射频混频器

封装/外壳：20-WQFN 裸露焊盘 包装：卷带（TR）带 描述：VFQFPN 5.00X5.00X0.80 MM, 0.65MM RF/IF，射频/中频和 RFID 射频混频器

CustomerSpecifications

Construction Diameters(In) 1)Component13X1COND a)Conductor14(41/30)AWGTinnedCopper0.070 b)Insulation0.020Wall,Nom.PVC0.110 (1)ColorCodeAlphaWireColorCodeD CondColorCondColorCondColor 1BLACK2RED3WHITE 2)CableAssembly3ComponentsCabled a)Twists:3.4

1550nmDWDMDFBLaserModule

1751A1550nmDWDMDFBLaserModule The1751lasermoduleisaDenseWavelength-DivisionMultiplexing(DWDM)laserforanalogapplications.ItfeaturesadistributedfeedbackchipthathasbeendesignedspecificallyforRadioFrequency(RF)applications.The1751lasermodulehasawidetemperatu

3M??Scotch-Weld??EpoxyAdhesive1751B/A

文件：140.65 Kbytes Page：8 Pages

1751A1550nmDWDMDFBLaserModule

文件：658.37 Kbytes Page：6 Pages

3M??Scotch-Weld??EpoxyAdhesive1751B/A

文件：140.64 Kbytes Page：8 Pages