Description

The SOP-8 has been modified through a customized

leadframe for enhanced thermal characteristics and

multiple-die capability making it ideal in a variety of

power applications. With these improvements, multiple

devices can be used in an application with dramatically

reduced board space. The package is designed for

vapor phase, infra red, or wave soldering techniques.

Power dissipation of greater than 0.8W is possible in a

typical PCB mount application.

Generation V Technology

Ultra Low On-Resistance

Dual N-Channel Mosfet

Surface Mount

Dynamic dv/dt Rating

Fast Switching

Lead-Free

Features

VDS (V) = 55V

ID= 4.7A (VGS=10V)

RDS(ON) < 30mΩ (VGS = 10V)

RDS(ON) < 45mΩ (VGS = 4.5V)