Description

The SOP-8 has been modified through a customized leadframe for enhanced

thermal characteristics and multiple-die capability making it ideal in a

variety of power applications. With these improvements,multiple devices

can be used in an application with dramatically reduced board space.The

package is designed for vapor phase, infra red,or wave

soldering techniques.Power dissipation of greater than 0.8W is possible in

a typical PCB mount application.

Generation V Technology

Ultra Low On-Resistance

Dual N-Channel Mosfet

Surface Mount

Available in Tape &Reel

Dynamic dv/dt Rating

Fast Switching

Lead-Free

Features

VDS (V) = 20V

RDS(ON) < 40mΩ (VGS = 4.5V)

RDS(ON) < 50mΩ (VGS = 2.7V)