位置:首页 > IC中文资料 > EVAL_PAN1455
| 型号 | 功能描述 | 生产厂家 企业 | LOGO | 操作 |
|---|---|---|---|---|
EVAL_PAN1455 | 包装:盒 描述:EVAL KIT FOR PAN1455 MODULE 开发板,套件,编程器 射频评估和开发套件,开发板 | PANASONIC 松下 | ||
EVAL_PAN1455 | 其他模块 | PANASONIC 松下 | ||
Extruded Aluminum Enclosures Key Features: Designed to house P.C. boards or for equipment interfacing. Sized for standard Eurocards. P.C. boards mount horizontally by sliding into internal slots extruded into the enclosure body. Rugged body constructed from extruded aluminum with a minimum thickness of .06” (1.5 mm). E | HAMMONDHammond Manufacturing Company Limited 哈蒙德哈蒙德制造有限公司 | |||
Extruded Aluminum Enclosures Key Features: Designed to house P.C. boards or for equipment interfacing. Sized for standard Eurocards. P.C. boards mount horizontally by sliding into internal slots extruded into the enclosure body. Rugged body constructed from extruded aluminum with a minimum thickness of .06” (1.5 mm). E | HAMMONDHammond Manufacturing Company Limited 哈蒙德哈蒙德制造有限公司 | |||
Extruded Aluminum Enclosures Key Features: Designed to house P.C. boards or for equipment interfacing. Sized for standard Eurocards. P.C. boards mount horizontally by sliding into internal slots extruded into the enclosure body. Rugged body constructed from extruded aluminum with a minimum thickness of .06” (1.5 mm). E | HAMMONDHammond Manufacturing Company Limited 哈蒙德哈蒙德制造有限公司 | |||
Extruded Aluminum Enclosures Key Features: Designed to house P.C. boards or for equipment interfacing. Sized for standard Eurocards. P.C. boards mount horizontally by sliding into internal slots extruded into the enclosure body. Rugged body constructed from extruded aluminum with a minimum thickness of .06” (1.5 mm). E | HAMMONDHammond Manufacturing Company Limited 哈蒙德哈蒙德制造有限公司 | |||
Extruded Aluminum Enclosures Key Features: Designed to house P.C. boards or for equipment interfacing. Sized for standard Eurocards. P.C. boards mount horizontally by sliding into internal slots extruded into the enclosure body. Rugged body constructed from extruded aluminum with a minimum thickness of .06” (1.5 mm). E | HAMMONDHammond Manufacturing Company Limited 哈蒙德哈蒙德制造有限公司 |
| IC供应商 | 芯片型号 | 品牌 | 批号 | 封装 | 库存 | 备注 | 价格 |
|---|---|---|---|---|---|---|---|
TOPLINE |
25+ |
TSSOP66 |
16 |
百分百原装正品 真实公司现货库存 本公司只做原装 可 |
|||
ADI(亚德诺) |
25+ |
N/A |
11491 |
样件支持,可原厂排单订货! |
|||
Infineon Technologies |
24+ |
原装 |
5000 |
原装正品,提供BOM配单服务 |
|||
ADI(亚德诺) |
25+ |
N/A |
11543 |
正规渠道,免费送样。支持账期,BOM一站式配齐 |
|||
TOPLINE |
2026+ |
TSSOP66 |
180 |
原装正品,假一罚十! |
|||
ADI/亚德诺 |
20+ |
EvaluationBoard |
33680 |
ADI全新原装-可开原型号增税票 |
|||
ADI |
24+ |
SMD |
1680 |
ADI一级代理原装现货假一赔十 |
|||
ADI/亚德诺 |
23+ |
EB/PCB |
3000 |
只做原装正品,假一赔十 |
|||
ADI |
2534+ |
原厂封装 |
25000 |
15年芯片行业经验/只供原装正品:13570885961邹小姐 |
|||
PANASONIC/松下 |
23+ |
KIT |
10000 |
原厂授权一级代理,专业海外优势订货,价格优势、品种 |
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