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ESP32

32-bit MCU & 2.4 GHz Wi-Fi & BT/BLE SoCs

文件:1.05768 Mbytes Page:60 Pages

ESPRESSIF

乐鑫信息科技

ESP32

32-bit MCU & 2.4 GHz Wi-Fi & BT/BLE SoCs

文件:1.07692 Mbytes Page:64 Pages

ESPRESSIF

乐鑫信息科技

ESP32

集成 2.4 GHz Wi-Fi 和蓝牙双模的单芯片

AI-THINKER

安信可

Wi-Fi+BT+BLE MCU 模组

ESP32-WROOM-32U 和 ESP32-WROOM-32D 是乐鑫通用型 Wi-Fi+BT+BLE MCU 模组,功能强大,用途广泛,可以用于低功耗传感器网络和要求极高的任务,例如语音编码、音频流和 MP3 解码等。与 ESP32-WROOM-32D 不同的是,ESP32-WROOM-32U 集成了一个 U.FL 座子,尺寸图请见章节 10。本文档的内容适用于这两款模组,不同的地方会标示出来。 ESP32-WROOM-32D 和 ESP32-WROOM-32U 两款模组的核心是 ESP32-D0WD 芯片,该款芯片属于 ESP32系列 *,具有可扩展、自适应的特点。两个 CPU

ESPRESSIF

乐鑫信息科技

PDF上传者:深圳市勤思达科技有限公司

搭载 RISC-V 32 位单核处理器的极低功耗 SoC

ESP32-C3 是一款安全稳定、低功耗、低成本的物联网芯片,搭载 RISC-V 32 位单核处理器,支持 2.4 GHz Wi-Fi 和 Bluetooth 5 (LE)。为物联网产品提供行业领先的射频性能、完善的安全机制和丰富的内存资源。ESP32-C3 对 Wi-Fi 和 Bluetooth 5 (LE) 的双重支持降低了设备配网难度,适用于广泛的物联网应用场景。 Core: 32-bit RISC-V single-core processor, frequency up to 160MHz\r\nMemories:\r\n384 KB of ROM\r\n400 KB of SRAM\r\n8 KB of RTCSRAM\r\nWorking Voltage: 3 V to 3.6 V\r\nUp to 22 GPIOs\r\n2*12-bit ADC (up to 6 channels)\r\nCommunication interfaces\r\n1 I2C interface\r\n1 I2S interface\r\n3 SPI interf;

ESPRESSIF

乐鑫信息科技

ESP WIFI MODULE DEVELOPMENT KIT

Features • Complete Wi-Fi 802.11b/g/n,1T1R mode data rate up to 150Mbps • Support BLE5.0, Classic Bluetooth is not supported, rate support: 125Kbps, 500Kbp,1Mbps, 2Mbps • 32-bit RISC-V single-core processor, supports a clock frequency of up to 160 MHz, with 400 KB SRAM, 384 KB ROM, 8KB RTC SRAM

RFSOLUTIONS

Small-sized 2.4 GHz Wi-Fi (802.11b/g/n) and Bluetooth® 5 module

1.1 Features CPU and On-Chip Memory • ESP32-C3FH4 embedded, 32-bit RISC-V single-core processor, up to 160 MHz • 384 KB ROM • 400 KB SRAM (16 KB for cache) • 8 KB SRAM in RTC • 4 MB flash in chip package

ESPRESSIF

乐鑫信息科技

Small-sized 2.4 GHz Wi-Fi (802.11b/g/n) and Bluetooth® 5 module

1.1 Features CPU and On-Chip Memory • ESP32-C3FH4 embedded, 32-bit RISC-V single-core processor, up to 160 MHz • 384 KB ROM • 400 KB SRAM (16 KB for cache) • 8 KB SRAM in RTC • 4 MB flash in chip package

ESPRESSIF

乐鑫信息科技

Small-sized 2.4 GHz Wi-Fi (802.11b/g/n) and Bluetooth® 5 module

1.1 Features CPU and On-Chip Memory • ESP32-C3FH4 embedded, 32-bit RISC-V single-core processor, up to 160 MHz • 384 KB ROM • 400 KB SRAM (16 KB for cache) • 8 KB SRAM in RTC • 4 MB flash in chip package

ESPRESSIF

乐鑫信息科技

Small-sized 2.4 GHz Wi-Fi (802.11b/g/n) and Bluetooth® 5 module

1.1 Features CPU and On-Chip Memory • ESP32-C3FH4 embedded, 32-bit RISC-V single-core processor, up to 160 MHz • 384 KB ROM • 400 KB SRAM (16 KB for cache) • 8 KB SRAM in RTC • 4 MB flash in chip package

ESPRESSIF

乐鑫信息科技

Small-sized 2.4 GHz Wi-Fi (802.11b/g/n) and Bluetooth® 5 module

1.1 Features CPU and On-Chip Memory • ESP32-C3FH4 embedded, 32-bit RISC-V single-core processor, up to 160 MHz • 384 KB ROM • 400 KB SRAM (16 KB for cache) • 8 KB SRAM in RTC • 4 MB flash in chip package

ESPRESSIF

乐鑫信息科技

Small-sized 2.4 GHz Wi-Fi (802.11b/g/n) and Bluetooth® 5 module

1.1 Features CPU and On-Chip Memory • ESP32-C3FH4 embedded, 32-bit RISC-V single-core processor, up to 160 MHz • 384 KB ROM • 400 KB SRAM (16 KB for cache) • 8 KB SRAM in RTC • 4 MB flash in chip package

ESPRESSIF

乐鑫信息科技

Small-sized 2.4 GHz Wi-Fi (802.11b/g/n) and Bluetooth® 5 module

1.1 Features CPU and On-Chip Memory • ESP32-C3FH4 embedded, 32-bit RISC-V single-core processor, up to 160 MHz • 384 KB ROM • 400 KB SRAM (16 KB for cache) • 8 KB SRAM in RTC • 4 MB flash in chip package

ESPRESSIF

乐鑫信息科技

Small-sized 2.4 GHz Wi-Fi (802.11b/g/n) and Bluetooth® 5 module

1.1 Features CPU and On-Chip Memory • ESP32-C3FH4 embedded, 32-bit RISC-V single-core processor, up to 160 MHz • 384 KB ROM • 400 KB SRAM (16 KB for cache) • 8 KB SRAM in RTC • 4 MB flash in chip package

ESPRESSIF

乐鑫信息科技

Small-sized 2.4 GHz Wi-Fi (802.11b/g/n) and Bluetooth® 5 module

1.1 Features CPU and On-Chip Memory • ESP32-C3FH4 embedded, 32-bit RISC-V single-core processor, up to 160 MHz • 384 KB ROM • 400 KB SRAM (16 KB for cache) • 8 KB SRAM in RTC • 4 MB flash in chip package

ESPRESSIF

乐鑫信息科技

Small-sized 2.4 GHz Wi-Fi (802.11b/g/n) and Bluetooth® 5 module

1.1 Features CPU and On-Chip Memory • ESP32-C3FH4 embedded, 32-bit RISC-V single-core processor, up to 160 MHz • 384 KB ROM • 400 KB SRAM (16 KB for cache) • 8 KB SRAM in RTC • 4 MB flash in chip package

ESPRESSIF

乐鑫信息科技

Small-sized 2.4 GHz Wi-Fi (802.11b/g/n) and Bluetooth® 5 module

1.1 Features CPU and On-Chip Memory • ESP32-C3FH4 embedded, 32-bit RISC-V single-core processor, up to 160 MHz • 384 KB ROM • 400 KB SRAM (16 KB for cache) • 8 KB SRAM in RTC • 4 MB flash in chip package

ESPRESSIF

乐鑫信息科技

2.4 GHz Wi-Fi (802.11b/g/n) and Bluetooth® 5 module

1.1 Features CPU and On-Chip Memory • ESP32-C3 embedded, 32-bit RISC-V single-core processor, up to 160 MHz • 384 KB ROM • 400 KB SRAM (16 KB for cache) • 8 KB SRAM in RTC

ESPRESSIF

乐鑫信息科技

2.4 GHz Wi-Fi (802.11b/g/n) and Bluetooth® 5 module

1.1 Features CPU and On-Chip Memory • ESP32-C3 embedded, 32-bit RISC-V single-core processor, up to 160 MHz • 384 KB ROM • 400 KB SRAM (16 KB for cache) • 8 KB SRAM in RTC

ESPRESSIF

乐鑫信息科技

2.4 GHz Wi-Fi (802.11b/g/n) and Bluetooth® 5 module

1.1 Features CPU and On-Chip Memory • ESP32-C3 embedded, 32-bit RISC-V single-core processor, up to 160 MHz • 384 KB ROM • 400 KB SRAM (16 KB for cache) • 8 KB SRAM in RTC

ESPRESSIF

乐鑫信息科技

2.4 GHz Wi-Fi (802.11b/g/n) and Bluetooth® 5 module

1.1 Features CPU and On-Chip Memory • ESP32-C3 embedded, 32-bit RISC-V single-core processor, up to 160 MHz • 384 KB ROM • 400 KB SRAM (16 KB for cache) • 8 KB SRAM in RTC

ESPRESSIF

乐鑫信息科技

2.4 GHz Wi-Fi (802.11b/g/n) and Bluetooth® 5 module

1.1 Features CPU and On-Chip Memory • ESP32-C3 embedded, 32-bit RISC-V single-core processor, up to 160 MHz • 384 KB ROM • 400 KB SRAM (16 KB for cache) • 8 KB SRAM in RTC

ESPRESSIF

乐鑫信息科技

2.4 GHz Wi-Fi (802.11b/g/n) and Bluetooth® 5 module

1.1 Features CPU and On-Chip Memory • ESP32-C3 embedded, 32-bit RISC-V single-core processor, up to 160 MHz • 384 KB ROM • 400 KB SRAM (16 KB for cache) • 8 KB SRAM in RTC

ESPRESSIF

乐鑫信息科技

Ultra-low-power SoC with 32-bit RISC-V single-core microprocessor

Features Wi-Fi • 1T1R in 2.4 and 5 GHz dual band • Operating frequency: 2412 ~ 2484 MHz, 5180 ~ 5885 MHz • IEEE 802.11ax-compliant – 20 MHz-only non-AP mode – Uplink and downlink OFDMA to enhance connectivity and performance in congested environments for IoT applications – Downlink MU-MIMO

ESPRESSIF

乐鑫信息科技

Ultra-low-power SoC with 32-bit RISC-V single-core microprocessor

Features Wi-Fi • 1T1R in 2.4 and 5 GHz dual band • Operating frequency: 2412 ~ 2484 MHz, 5180 ~ 5885 MHz • IEEE 802.11ax-compliant – 20 MHz-only non-AP mode – Uplink and downlink OFDMA to enhance connectivity and performance in congested environments for IoT applications – Downlink MU-MIMO

ESPRESSIF

乐鑫信息科技

Ultra-low-power SoC with 32-bit RISC-V single-core microprocessor

Features Wi-Fi • 1T1R in 2.4 and 5 GHz dual band • Operating frequency: 2412 ~ 2484 MHz, 5180 ~ 5885 MHz • IEEE 802.11ax-compliant – 20 MHz-only non-AP mode – Uplink and downlink OFDMA to enhance connectivity and performance in congested environments for IoT applications – Downlink MU-MIMO

ESPRESSIF

乐鑫信息科技

Module that supports 2.4 and 5 GHz dual-band Wi-Fi 6 (802.11ax), Bluetooth® 5 (LE), Zigbee, and Thread (802.15.4)

1.1 Features CPU and On-Chip Memory • ESP32-C5 embedded, 32-bit RISC-V single-core microprocessor, up to 240 MHz • ROM: 320 KB • HP SRAM: 384 KB • LP SRAM: 16 KB Wi-Fi • 1T1R in 2.4 and 5 GHz dual band • Operating frequency: 2412 ~ 2484 MHz, 5180 ~ 5885 MHz • IEEE 802.11ax-compliant –

ESPRESSIF

乐鑫信息科技

Module that supports 2.4 and 5 GHz dual-band Wi-Fi 6 (802.11ax), Bluetooth® 5 (LE), Zigbee, and Thread (802.15.4)

1.1 Features CPU and On-Chip Memory • ESP32-C5 embedded, 32-bit RISC-V single-core microprocessor, up to 240 MHz • ROM: 320 KB • HP SRAM: 384 KB • LP SRAM: 16 KB Wi-Fi • 1T1R in 2.4 and 5 GHz dual band • Operating frequency: 2412 ~ 2484 MHz, 5180 ~ 5885 MHz • IEEE 802.11ax-compliant –

ESPRESSIF

乐鑫信息科技

Module that supports 2.4 and 5 GHz dual-band Wi-Fi 6 (802.11ax), Bluetooth® 5 (LE), Zigbee, and Thread (802.15.4)

1.1 Features CPU and On-Chip Memory • ESP32-C5 embedded, 32-bit RISC-V single-core microprocessor, up to 240 MHz • ROM: 320 KB • HP SRAM: 384 KB • LP SRAM: 16 KB Wi-Fi • 1T1R in 2.4 and 5 GHz dual band • Operating frequency: 2412 ~ 2484 MHz, 5180 ~ 5885 MHz • IEEE 802.11ax-compliant –

ESPRESSIF

乐鑫信息科技

Module that supports 2.4 and 5 GHz dual-band Wi-Fi 6 (802.11ax), Bluetooth® 5 (LE), Zigbee, and Thread (802.15.4)

1.1 Features CPU and On-Chip Memory • ESP32-C5 embedded, 32-bit RISC-V single-core microprocessor, up to 240 MHz • ROM: 320 KB • HP SRAM: 384 KB • LP SRAM: 16 KB Wi-Fi • 1T1R in 2.4 and 5 GHz dual band • Operating frequency: 2412 ~ 2484 MHz, 5180 ~ 5885 MHz • IEEE 802.11ax-compliant –

ESPRESSIF

乐鑫信息科技

Module that supports 2.4 and 5 GHz dual-band Wi-Fi 6 (802.11ax), Bluetooth® 5 (LE), Zigbee, and Thread (802.15.4)

1.1 Features CPU and On-Chip Memory • ESP32-C5 embedded, 32-bit RISC-V single-core microprocessor, up to 240 MHz • ROM: 320 KB • HP SRAM: 384 KB • LP SRAM: 16 KB Wi-Fi • 1T1R in 2.4 and 5 GHz dual band • Operating frequency: 2412 ~ 2484 MHz, 5180 ~ 5885 MHz • IEEE 802.11ax-compliant –

ESPRESSIF

乐鑫信息科技

Ultra-low-power SoC with RISC-V single-core microprocessor

Features Wi-Fi • 1T1R in 2.4 GHz band • Operating frequency: 2412 ~ 2484 MHz • IEEE 802.11ax-compliant – 20 MHz-only non-AP mode – MCS0 ~MCS9 – Uplink and downlink OFDMA, especially suitable for simultaneous connections in high-density environments – Downlink MU-MIMO (multi-user, multipl

ESPRESSIF

乐鑫信息科技

Ultra-low-power SoC with RISC-V single-core microprocessor

Features Wi-Fi • 1T1R in 2.4 GHz band • Operating frequency: 2412 ~ 2484 MHz • IEEE 802.11ax-compliant – 20 MHz-only non-AP mode – MCS0 ~MCS9 – Uplink and downlink OFDMA, especially suitable for simultaneous connections in high-density environments – Downlink MU-MIMO (multi-user, multipl

ESPRESSIF

乐鑫信息科技

Ultra-low-power SoC with RISC-V single-core microprocessor

Features Wi-Fi • 1T1R in 2.4 GHz band • Operating frequency: 2412 ~ 2484 MHz • IEEE 802.11ax-compliant – 20 MHz-only non-AP mode – MCS0 ~MCS9 – Uplink and downlink OFDMA, especially suitable for simultaneous connections in high-density environments – Downlink MU-MIMO (multi-user, multipl

ESPRESSIF

乐鑫信息科技

Module that supports 2.4 GHz Wi-Fi 6 (802.11ax), Bluetooth® 5 (LE), Zigbee and Thread (802.15.4)

1.1 Features CPU and On-Chip Memory • ESP32-C6FH4/ESP32-C6FH8 embedded, 32-bit RISC-V single-core microprocessor, up to 160 MHz • ROM: 320 KB • HP SRAM: 512 KB • LP SRAM: 16 KB • Flash up to 8 MB in chip package Wi-Fi • 1T1R in 2.4 GHz band • Operating frequency: 2412 ~ 2484 MHz • IEEE

ESPRESSIF

乐鑫信息科技

Module that supports 2.4 GHz Wi-Fi 6 (802.11ax), Bluetooth® 5 (LE), Zigbee and Thread (802.15.4)

1.1 Features CPU and On-Chip Memory • ESP32-C6FH4/ESP32-C6FH8 embedded, 32-bit RISC-V single-core microprocessor, up to 160 MHz • ROM: 320 KB • HP SRAM: 512 KB • LP SRAM: 16 KB • Flash up to 8 MB in chip package Wi-Fi • 1T1R in 2.4 GHz band • Operating frequency: 2412 ~ 2484 MHz • IEEE

ESPRESSIF

乐鑫信息科技

Module that supports 2.4 GHz Wi-Fi 6 (802.11ax), Bluetooth® 5 (LE), Zigbee and Thread (802.15.4)

1.1 Features CPU and On-Chip Memory • ESP32-C6FH4/ESP32-C6FH8 embedded, 32-bit RISC-V single-core microprocessor, up to 160 MHz • ROM: 320 KB • HP SRAM: 512 KB • LP SRAM: 16 KB • Flash up to 8 MB in chip package Wi-Fi • 1T1R in 2.4 GHz band • Operating frequency: 2412 ~ 2484 MHz • IEEE

ESPRESSIF

乐鑫信息科技

Module that supports 2.4 GHz Wi-Fi 6 (802.11ax), Bluetooth® 5 (LE), Zigbee and Thread (802.15.4)

1.1 Features CPU and On-Chip Memory • ESP32-C6FH4/ESP32-C6FH8 embedded, 32-bit RISC-V single-core microprocessor, up to 160 MHz • ROM: 320 KB • HP SRAM: 512 KB • LP SRAM: 16 KB • Flash up to 8 MB in chip package Wi-Fi • 1T1R in 2.4 GHz band • Operating frequency: 2412 ~ 2484 MHz • IEEE

ESPRESSIF

乐鑫信息科技

Module that supports 2.4 GHz Wi-Fi 6 (802.11ax), Bluetooth® 5 (LE), Zigbee and Thread (802.15.4)

1.1 Features CPU and On-Chip Memory • ESP32-C6FH4/ESP32-C6FH8 embedded, 32-bit RISC-V single-core microprocessor, up to 160 MHz • ROM: 320 KB • HP SRAM: 512 KB • LP SRAM: 16 KB • Flash up to 8 MB in chip package Wi-Fi • 1T1R in 2.4 GHz band • Operating frequency: 2412 ~ 2484 MHz • IEEE

ESPRESSIF

乐鑫信息科技

Module that supports 2.4 GHz Wi-Fi 6 (802.11ax), Bluetooth® 5 (LE), Zigbee and Thread (802.15.4)

1.1 Features CPU and On-Chip Memory • ESP32-C6FH4/ESP32-C6FH8 embedded, 32-bit RISC-V single-core microprocessor, up to 160 MHz • ROM: 320 KB • HP SRAM: 512 KB • LP SRAM: 16 KB • Flash up to 8 MB in chip package Wi-Fi • 1T1R in 2.4 GHz band • Operating frequency: 2412 ~ 2484 MHz • IEEE

ESPRESSIF

乐鑫信息科技

Module that supports 2.4 GHz Wi-Fi 6 (802.11ax), Bluetooth® 5 (LE), Zigbee and Thread (802.15.4)

1.1 Features CPU and On-Chip Memory • ESP32-C6FH4/ESP32-C6FH8 embedded, 32-bit RISC-V single-core microprocessor, up to 160 MHz • ROM: 320 KB • HP SRAM: 512 KB • LP SRAM: 16 KB • Flash up to 8 MB in chip package Wi-Fi • 1T1R in 2.4 GHz band • Operating frequency: 2412 ~ 2484 MHz • IEEE

ESPRESSIF

乐鑫信息科技

Module that supports 2.4 GHz Wi-Fi 6 (802.11ax), Bluetooth® 5 (LE), Zigbee and Thread (802.15.4)

1.1 Features CPU and On-Chip Memory • ESP32-C6FH4/ESP32-C6FH8 embedded, 32-bit RISC-V single-core microprocessor, up to 160 MHz • ROM: 320 KB • HP SRAM: 512 KB • LP SRAM: 16 KB • Flash up to 8 MB in chip package Wi-Fi • 1T1R in 2.4 GHz band • Operating frequency: 2412 ~ 2484 MHz • IEEE

ESPRESSIF

乐鑫信息科技

Module that supports 2.4 GHz Wi-Fi 6 (802.11ax), Bluetooth® 5 (LE), Zigbee and Thread (802.15.4)

1.1 Features CPU and On-Chip Memory • ESP32-C6 embedded, 32-bit RISC-V single-core microprocessor, up to 160 MHz • ROM: 320 KB • HP SRAM: 512 KB • LP SRAM: 16 KB Wi-Fi • 1T1R in 2.4 GHz band • Operating frequency: 2412 ~ 2484 MHz • IEEE 802.11ax-compliant – 20 MHz-only non-AP mode – MC

ESPRESSIF

乐鑫信息科技

Module that supports 2.4 GHz Wi-Fi 6 (802.11ax), Bluetooth® 5 (LE), Zigbee and Thread (802.15.4)

1.1 Features CPU and On-Chip Memory • ESP32-C6 embedded, 32-bit RISC-V single-core microprocessor, up to 160 MHz • ROM: 320 KB • HP SRAM: 512 KB • LP SRAM: 16 KB Wi-Fi • 1T1R in 2.4 GHz band • Operating frequency: 2412 ~ 2484 MHz • IEEE 802.11ax-compliant – 20 MHz-only non-AP mode – MC

ESPRESSIF

乐鑫信息科技

Module that supports 2.4 GHz Wi-Fi 6 (802.11ax), Bluetooth® 5 (LE), Zigbee and Thread (802.15.4)

1.1 Features CPU and On-Chip Memory • ESP32-C6 embedded, 32-bit RISC-V single-core microprocessor, up to 160 MHz • ROM: 320 KB • HP SRAM: 512 KB • LP SRAM: 16 KB Wi-Fi • 1T1R in 2.4 GHz band • Operating frequency: 2412 ~ 2484 MHz • IEEE 802.11ax-compliant – 20 MHz-only non-AP mode – MC

ESPRESSIF

乐鑫信息科技

Module that supports 2.4 GHz Wi-Fi 6 (802.11ax), Bluetooth® 5 (LE), Zigbee and Thread (802.15.4)

1.1 Features CPU and On-Chip Memory • ESP32-C6 embedded, 32-bit RISC-V single-core microprocessor, up to 160 MHz • ROM: 320 KB • HP SRAM: 512 KB • LP SRAM: 16 KB Wi-Fi • 1T1R in 2.4 GHz band • Operating frequency: 2412 ~ 2484 MHz • IEEE 802.11ax-compliant – 20 MHz-only non-AP mode – MC

ESPRESSIF

乐鑫信息科技

Module that supports 2.4 GHz Wi-Fi 6 (802.11ax), Bluetooth® 5 (LE), Zigbee and Thread (802.15.4)

1.1 Features CPU and On-Chip Memory • ESP32-C6 embedded, 32-bit RISC-V single-core microprocessor, up to 160 MHz • ROM: 320 KB • HP SRAM: 512 KB • LP SRAM: 16 KB Wi-Fi • 1T1R in 2.4 GHz band • Operating frequency: 2412 ~ 2484 MHz • IEEE 802.11ax-compliant – 20 MHz-only non-AP mode – MC

ESPRESSIF

乐鑫信息科技

Module that supports 2.4 GHz Wi-Fi 6 (802.11ax), Bluetooth® 5 (LE), Zigbee and Thread (802.15.4)

1.1 Features CPU and On-Chip Memory • ESP32-C6 embedded, 32-bit RISC-V single-core microprocessor, up to 160 MHz • ROM: 320 KB • HP SRAM: 512 KB • LP SRAM: 16 KB Wi-Fi • 1T1R in 2.4 GHz band • Operating frequency: 2412 ~ 2484 MHz • IEEE 802.11ax-compliant – 20 MHz-only non-AP mode – MC

ESPRESSIF

乐鑫信息科技

2.4 GHz Wi-Fi Bluetooth® Bluetooth LE module

1.1 Features CPU and On-Chip Memory • ESP32-D0WD-V3 embedded, Xtensa® dual-core 32-bit LX6 microprocessor, up to 240 MHz • 448 KB ROM for booting and core functions • 520 KB SRAM for data and instructions • 16 KB SRAM in RTC Wi-Fi • 802.11b/g/n • Bit rate: 802.11n up to 150 Mbps • A-MPD

ESPRESSIF

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ESP32-D0WD-V3 embedded, Xtensa® dual-core

1.1 Features MCU • ESP32-D0WD-V3 embedded, Xtensa® dual-core 32-bit LX6 microprocessor, up to 240 MHz • 448 KB ROM for booting and core functions • 520 KB SRAM for data and instructions • 16 KB SRAM in RTC WiFi • 802.11b/g/n • Bit rate: 802.11n up to 150 Mbps • A-MPDU and A-MSDU aggregat

ESPRESSIF

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RISC-V 32-bit single-core microprocessor Bluetooth® Low Energy and IEEE 802.15.4

Features Bluetooth® • Bluetooth Low Energy (Bluetooth 5.3 certified) • Bluetooth mesh • Bluetooth Low Energy long range (Coded PHY, 125 Kbps and 500 Kbps) • Bluetooth Low Energy high speed (2 Mbps) • Bluetooth Low Energy advertising extensions and multiple advertising sets • Simultaneous op

ESPRESSIF

乐鑫信息科技

RISC-V 32-bit single-core microprocessor Bluetooth® Low Energy and IEEE 802.15.4

Features Bluetooth® • Bluetooth Low Energy (Bluetooth 5.3 certified) • Bluetooth mesh • Bluetooth Low Energy long range (Coded PHY, 125 Kbps and 500 Kbps) • Bluetooth Low Energy high speed (2 Mbps) • Bluetooth Low Energy advertising extensions and multiple advertising sets • Simultaneous op

ESPRESSIF

乐鑫信息科技

RISC-V 32-bit single-core microprocessor Bluetooth® Low Energy and IEEE 802.15.4

Features Bluetooth® • Bluetooth Low Energy (Bluetooth 5.3 certified) • Bluetooth mesh • Bluetooth Low Energy long range (Coded PHY, 125 Kbps and 500 Kbps) • Bluetooth Low Energy high speed (2 Mbps) • Bluetooth Low Energy advertising extensions and multiple advertising sets • Simultaneous op

ESPRESSIF

乐鑫信息科技

Bluetooth® Low Energy and IEEE 802.15.4 module

1.1 Features CPU and On-Chip Memory • ESP32-H2 embedded, RISC-V single-core 32-bit microprocessor, up to 96 MHz • 128 KB ROM • 320 KB SRAM • 4 KB LP Memory • 2 MB or 4 MB in-package flash Bluetooth® • Bluetooth Low Energy (Bluetooth 5.3 certified) • Bluetooth mesh • Bluetooth Low Energy

ESPRESSIF

乐鑫信息科技

Bluetooth® Low Energy and IEEE 802.15.4 module

1.1 Features CPU and On-Chip Memory • ESP32-H2 embedded, RISC-V single-core 32-bit microprocessor, up to 96 MHz • 128 KB ROM • 320 KB SRAM • 4 KB LP Memory • 2 MB or 4 MB in-package flash Bluetooth® • Bluetooth Low Energy (Bluetooth 5.3 certified) • Bluetooth mesh • Bluetooth Low Energy

ESPRESSIF

乐鑫信息科技

Bluetooth® Low Energy and IEEE 802.15.4 module

1.1 Features CPU and On-Chip Memory • ESP32-H2 embedded, RISC-V single-core 32-bit microprocessor, up to 96 MHz • 128 KB ROM • 320 KB SRAM • 4 KB LP Memory • 2 MB or 4 MB in-package flash Bluetooth® • Bluetooth Low Energy (Bluetooth 5.3 certified) • Bluetooth mesh • Bluetooth Low Energy

ESPRESSIF

乐鑫信息科技

Bluetooth® Low Energy and IEEE 802.15.4 module

1.1 Features CPU and On-Chip Memory • ESP32-H2 embedded, RISC-V single-core 32-bit microprocessor, up to 96 MHz • 128 KB ROM • 320 KB SRAM • 4 KB LP Memory • 2 MB or 4 MB in-package flash Bluetooth® • Bluetooth Low Energy (Bluetooth 5.3 certified) • Bluetooth mesh • Bluetooth Low Energy

ESPRESSIF

乐鑫信息科技

Bluetooth® Low Energy and IEEE 802.15.4 module

1.1 Features CPU and On-Chip Memory • ESP32-H2 embedded, RISC-V single-core 32-bit microprocessor, up to 96 MHz • 128 KB ROM • 320 KB SRAM • 4 KB LP Memory • 2 MB or 4 MB in-package flash Bluetooth® • Bluetooth Low Energy (Bluetooth 5.3 certified) • Bluetooth mesh • Bluetooth Low Energy

ESPRESSIF

乐鑫信息科技

Bluetooth® Low Energy and IEEE 802.15.4 module

1.1 Features CPU and On-Chip Memory • ESP32-H2 embedded, RISC-V single-core 32-bit microprocessor, up to 96 MHz • 128 KB ROM • 320 KB SRAM • 4 KB LP Memory • 2 MB or 4 MB in-package flash Bluetooth • Bluetooth Low Energy (Bluetooth 5.3 certified) • Bluetooth mesh • Bluetooth Low Energy

ESPRESSIF

乐鑫信息科技

Bluetooth® Low Energy and IEEE 802.15.4 module

1.1 Features CPU and On-Chip Memory • ESP32-H2 embedded, RISC-V single-core 32-bit microprocessor, up to 96 MHz • 128 KB ROM • 320 KB SRAM • 4 KB LP Memory • 2 MB or 4 MB in-package flash Bluetooth • Bluetooth Low Energy (Bluetooth 5.3 certified) • Bluetooth mesh • Bluetooth Low Energy

ESPRESSIF

乐鑫信息科技

ESP32产品属性

  • 类型

    描述

  • Wi-Fi:

    IEEE 802.11 b/g/n; 2.4 GHz; HT20/40; up to 150 Mbps

  • Bluetooth:

    Bluetooth LE v5.0

  • Temp():

    -40 ~ 105

  • GPIO:

    22

  • Flash(MB):

    0

  • SRAM(KB):

    400

  • ROM(KB):

    384

  • PSRAM(MB):

    0

  • Freq.(MHz):

    160

  • Size(mm):

    QFN32 (5*5)

  • MPQ/SPQ:

    5000

  • MOQ:

    5000

更新时间:2026-5-22 18:23:00
IC供应商 芯片型号 品牌 批号 封装 库存 备注 价格
ESPRESSIF/乐鑫
2511
QFN32
6000
电子元器件采购降本 30%!公司原厂直采,砍掉中间差价
ESPRESSIF
25+
QFN48
12496
ESPRESSIF原装正品ESP32-D0WDQ6即刻询购立享优惠#长期有货
Espressif/乐鑫
25+
SMD
30000
ESPRESSIF/乐鑫
24+
MODULE
97586
专业代理WIFI蓝牙模组原装现货
乐鑫
25+
SMD
90000
全新原装正品现货
ESPRESSIF
23+
SMD
1280
正规渠道,只有原装!
乐鑫
26+
QFN-56
20000
原装
ESPRESSIF
26+
QFN48
90000
乐鑫
26+
QFN?32
20000
原装
ESPRESSIF(乐鑫)
25+
Module
7589
全新原装现货,支持排单订货,可含税开票

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