| 型号 | 功能描述 | 生产厂家 企业 | LOGO | 操作 |
|---|---|---|---|---|
ESP32 | 32-bit MCU & 2.4 GHz Wi-Fi & BT/BLE SoCs 文件:1.05768 Mbytes Page:60 Pages | ESPRESSIF 乐鑫信息科技 | ||
ESP32 | 32-bit MCU & 2.4 GHz Wi-Fi & BT/BLE SoCs 文件:1.07692 Mbytes Page:64 Pages | ESPRESSIF 乐鑫信息科技 | ||
ESP32 | 集成 2.4 GHz Wi-Fi 和蓝牙双模的单芯片 | Ai-Thinker 安信可 | ||
Wi-Fi+BT+BLE MCU 模组 ESP32-WROOM-32U 和 ESP32-WROOM-32D 是乐鑫通用型 Wi-Fi+BT+BLE MCU 模组,功能强大,用途广泛,可以用于低功耗传感器网络和要求极高的任务,例如语音编码、音频流和 MP3 解码等。与 ESP32-WROOM-32D 不同的是,ESP32-WROOM-32U 集成了一个 U.FL 座子,尺寸图请见章节 10。本文档的内容适用于这两款模组,不同的地方会标示出来。 ESP32-WROOM-32D 和 ESP32-WROOM-32U 两款模组的核心是 ESP32-D0WD 芯片,该款芯片属于 ESP32系列 *,具有可扩展、自适应的特点。两个 CPU | ||||
ESP WIFI MODULE DEVELOPMENT KIT Features • Complete Wi-Fi 802.11b/g/n,1T1R mode data rate up to 150Mbps • Support BLE5.0, Classic Bluetooth is not supported, rate support: 125Kbps, 500Kbp,1Mbps, 2Mbps • 32-bit RISC-V single-core processor, supports a clock frequency of up to 160 MHz, with 400 KB SRAM, 384 KB ROM, 8KB RTC SRAM | RFSOLUTIONS | |||
Small-sized 2.4 GHz Wi-Fi (802.11b/g/n) and Bluetooth® 5 module 1.1 Features CPU and On-Chip Memory • ESP32-C3FH4 embedded, 32-bit RISC-V single-core processor, up to 160 MHz • 384 KB ROM • 400 KB SRAM (16 KB for cache) • 8 KB SRAM in RTC • 4 MB flash in chip package | ESPRESSIF 乐鑫信息科技 | |||
Small-sized 2.4 GHz Wi-Fi (802.11b/g/n) and Bluetooth® 5 module 1.1 Features CPU and On-Chip Memory • ESP32-C3FH4 embedded, 32-bit RISC-V single-core processor, up to 160 MHz • 384 KB ROM • 400 KB SRAM (16 KB for cache) • 8 KB SRAM in RTC • 4 MB flash in chip package | ESPRESSIF 乐鑫信息科技 | |||
Small-sized 2.4 GHz Wi-Fi (802.11b/g/n) and Bluetooth® 5 module 1.1 Features CPU and On-Chip Memory • ESP32-C3FH4 embedded, 32-bit RISC-V single-core processor, up to 160 MHz • 384 KB ROM • 400 KB SRAM (16 KB for cache) • 8 KB SRAM in RTC • 4 MB flash in chip package | ESPRESSIF 乐鑫信息科技 | |||
Small-sized 2.4 GHz Wi-Fi (802.11b/g/n) and Bluetooth® 5 module 1.1 Features CPU and On-Chip Memory • ESP32-C3FH4 embedded, 32-bit RISC-V single-core processor, up to 160 MHz • 384 KB ROM • 400 KB SRAM (16 KB for cache) • 8 KB SRAM in RTC • 4 MB flash in chip package | ESPRESSIF 乐鑫信息科技 | |||
Small-sized 2.4 GHz Wi-Fi (802.11b/g/n) and Bluetooth® 5 module 1.1 Features CPU and On-Chip Memory • ESP32-C3FH4 embedded, 32-bit RISC-V single-core processor, up to 160 MHz • 384 KB ROM • 400 KB SRAM (16 KB for cache) • 8 KB SRAM in RTC • 4 MB flash in chip package | ESPRESSIF 乐鑫信息科技 | |||
Small-sized 2.4 GHz Wi-Fi (802.11b/g/n) and Bluetooth® 5 module 1.1 Features CPU and On-Chip Memory • ESP32-C3FH4 embedded, 32-bit RISC-V single-core processor, up to 160 MHz • 384 KB ROM • 400 KB SRAM (16 KB for cache) • 8 KB SRAM in RTC • 4 MB flash in chip package | ESPRESSIF 乐鑫信息科技 | |||
Small-sized 2.4 GHz Wi-Fi (802.11b/g/n) and Bluetooth® 5 module 1.1 Features CPU and On-Chip Memory • ESP32-C3FH4 embedded, 32-bit RISC-V single-core processor, up to 160 MHz • 384 KB ROM • 400 KB SRAM (16 KB for cache) • 8 KB SRAM in RTC • 4 MB flash in chip package | ESPRESSIF 乐鑫信息科技 | |||
Small-sized 2.4 GHz Wi-Fi (802.11b/g/n) and Bluetooth® 5 module 1.1 Features CPU and On-Chip Memory • ESP32-C3FH4 embedded, 32-bit RISC-V single-core processor, up to 160 MHz • 384 KB ROM • 400 KB SRAM (16 KB for cache) • 8 KB SRAM in RTC • 4 MB flash in chip package | ESPRESSIF 乐鑫信息科技 | |||
Small-sized 2.4 GHz Wi-Fi (802.11b/g/n) and Bluetooth® 5 module 1.1 Features CPU and On-Chip Memory • ESP32-C3FH4 embedded, 32-bit RISC-V single-core processor, up to 160 MHz • 384 KB ROM • 400 KB SRAM (16 KB for cache) • 8 KB SRAM in RTC • 4 MB flash in chip package | ESPRESSIF 乐鑫信息科技 | |||
Small-sized 2.4 GHz Wi-Fi (802.11b/g/n) and Bluetooth® 5 module 1.1 Features CPU and On-Chip Memory • ESP32-C3FH4 embedded, 32-bit RISC-V single-core processor, up to 160 MHz • 384 KB ROM • 400 KB SRAM (16 KB for cache) • 8 KB SRAM in RTC • 4 MB flash in chip package | ESPRESSIF 乐鑫信息科技 | |||
Small-sized 2.4 GHz Wi-Fi (802.11b/g/n) and Bluetooth® 5 module 1.1 Features CPU and On-Chip Memory • ESP32-C3FH4 embedded, 32-bit RISC-V single-core processor, up to 160 MHz • 384 KB ROM • 400 KB SRAM (16 KB for cache) • 8 KB SRAM in RTC • 4 MB flash in chip package | ESPRESSIF 乐鑫信息科技 | |||
2.4 GHz Wi-Fi (802.11b/g/n) and Bluetooth® 5 module 1.1 Features CPU and On-Chip Memory • ESP32-C3 embedded, 32-bit RISC-V single-core processor, up to 160 MHz • 384 KB ROM • 400 KB SRAM (16 KB for cache) • 8 KB SRAM in RTC | ESPRESSIF 乐鑫信息科技 | |||
2.4 GHz Wi-Fi (802.11b/g/n) and Bluetooth® 5 module 1.1 Features CPU and On-Chip Memory • ESP32-C3 embedded, 32-bit RISC-V single-core processor, up to 160 MHz • 384 KB ROM • 400 KB SRAM (16 KB for cache) • 8 KB SRAM in RTC | ESPRESSIF 乐鑫信息科技 | |||
2.4 GHz Wi-Fi (802.11b/g/n) and Bluetooth® 5 module 1.1 Features CPU and On-Chip Memory • ESP32-C3 embedded, 32-bit RISC-V single-core processor, up to 160 MHz • 384 KB ROM • 400 KB SRAM (16 KB for cache) • 8 KB SRAM in RTC | ESPRESSIF 乐鑫信息科技 | |||
2.4 GHz Wi-Fi (802.11b/g/n) and Bluetooth® 5 module 1.1 Features CPU and On-Chip Memory • ESP32-C3 embedded, 32-bit RISC-V single-core processor, up to 160 MHz • 384 KB ROM • 400 KB SRAM (16 KB for cache) • 8 KB SRAM in RTC | ESPRESSIF 乐鑫信息科技 | |||
2.4 GHz Wi-Fi (802.11b/g/n) and Bluetooth® 5 module 1.1 Features CPU and On-Chip Memory • ESP32-C3 embedded, 32-bit RISC-V single-core processor, up to 160 MHz • 384 KB ROM • 400 KB SRAM (16 KB for cache) • 8 KB SRAM in RTC | ESPRESSIF 乐鑫信息科技 | |||
2.4 GHz Wi-Fi (802.11b/g/n) and Bluetooth® 5 module 1.1 Features CPU and On-Chip Memory • ESP32-C3 embedded, 32-bit RISC-V single-core processor, up to 160 MHz • 384 KB ROM • 400 KB SRAM (16 KB for cache) • 8 KB SRAM in RTC | ESPRESSIF 乐鑫信息科技 | |||
Ultra-low-power SoC with 32-bit RISC-V single-core microprocessor Features Wi-Fi • 1T1R in 2.4 and 5 GHz dual band • Operating frequency: 2412 ~ 2484 MHz, 5180 ~ 5885 MHz • IEEE 802.11ax-compliant – 20 MHz-only non-AP mode – Uplink and downlink OFDMA to enhance connectivity and performance in congested environments for IoT applications – Downlink MU-MIMO | ESPRESSIF 乐鑫信息科技 | |||
Ultra-low-power SoC with 32-bit RISC-V single-core microprocessor Features Wi-Fi • 1T1R in 2.4 and 5 GHz dual band • Operating frequency: 2412 ~ 2484 MHz, 5180 ~ 5885 MHz • IEEE 802.11ax-compliant – 20 MHz-only non-AP mode – Uplink and downlink OFDMA to enhance connectivity and performance in congested environments for IoT applications – Downlink MU-MIMO | ESPRESSIF 乐鑫信息科技 | |||
Ultra-low-power SoC with 32-bit RISC-V single-core microprocessor Features Wi-Fi • 1T1R in 2.4 and 5 GHz dual band • Operating frequency: 2412 ~ 2484 MHz, 5180 ~ 5885 MHz • IEEE 802.11ax-compliant – 20 MHz-only non-AP mode – Uplink and downlink OFDMA to enhance connectivity and performance in congested environments for IoT applications – Downlink MU-MIMO | ESPRESSIF 乐鑫信息科技 | |||
Module that supports 2.4 and 5 GHz dual-band Wi-Fi 6 (802.11ax), Bluetooth® 5 (LE), Zigbee, and Thread (802.15.4) 1.1 Features CPU and On-Chip Memory • ESP32-C5 embedded, 32-bit RISC-V single-core microprocessor, up to 240 MHz • ROM: 320 KB • HP SRAM: 384 KB • LP SRAM: 16 KB Wi-Fi • 1T1R in 2.4 and 5 GHz dual band • Operating frequency: 2412 ~ 2484 MHz, 5180 ~ 5885 MHz • IEEE 802.11ax-compliant – | ESPRESSIF 乐鑫信息科技 | |||
Module that supports 2.4 and 5 GHz dual-band Wi-Fi 6 (802.11ax), Bluetooth® 5 (LE), Zigbee, and Thread (802.15.4) 1.1 Features CPU and On-Chip Memory • ESP32-C5 embedded, 32-bit RISC-V single-core microprocessor, up to 240 MHz • ROM: 320 KB • HP SRAM: 384 KB • LP SRAM: 16 KB Wi-Fi • 1T1R in 2.4 and 5 GHz dual band • Operating frequency: 2412 ~ 2484 MHz, 5180 ~ 5885 MHz • IEEE 802.11ax-compliant – | ESPRESSIF 乐鑫信息科技 | |||
Module that supports 2.4 and 5 GHz dual-band Wi-Fi 6 (802.11ax), Bluetooth® 5 (LE), Zigbee, and Thread (802.15.4) 1.1 Features CPU and On-Chip Memory • ESP32-C5 embedded, 32-bit RISC-V single-core microprocessor, up to 240 MHz • ROM: 320 KB • HP SRAM: 384 KB • LP SRAM: 16 KB Wi-Fi • 1T1R in 2.4 and 5 GHz dual band • Operating frequency: 2412 ~ 2484 MHz, 5180 ~ 5885 MHz • IEEE 802.11ax-compliant – | ESPRESSIF 乐鑫信息科技 | |||
Module that supports 2.4 and 5 GHz dual-band Wi-Fi 6 (802.11ax), Bluetooth® 5 (LE), Zigbee, and Thread (802.15.4) 1.1 Features CPU and On-Chip Memory • ESP32-C5 embedded, 32-bit RISC-V single-core microprocessor, up to 240 MHz • ROM: 320 KB • HP SRAM: 384 KB • LP SRAM: 16 KB Wi-Fi • 1T1R in 2.4 and 5 GHz dual band • Operating frequency: 2412 ~ 2484 MHz, 5180 ~ 5885 MHz • IEEE 802.11ax-compliant – | ESPRESSIF 乐鑫信息科技 | |||
Module that supports 2.4 and 5 GHz dual-band Wi-Fi 6 (802.11ax), Bluetooth® 5 (LE), Zigbee, and Thread (802.15.4) 1.1 Features CPU and On-Chip Memory • ESP32-C5 embedded, 32-bit RISC-V single-core microprocessor, up to 240 MHz • ROM: 320 KB • HP SRAM: 384 KB • LP SRAM: 16 KB Wi-Fi • 1T1R in 2.4 and 5 GHz dual band • Operating frequency: 2412 ~ 2484 MHz, 5180 ~ 5885 MHz • IEEE 802.11ax-compliant – | ESPRESSIF 乐鑫信息科技 | |||
Ultra-low-power SoC with RISC-V single-core microprocessor Features Wi-Fi • 1T1R in 2.4 GHz band • Operating frequency: 2412 ~ 2484 MHz • IEEE 802.11ax-compliant – 20 MHz-only non-AP mode – MCS0 ~MCS9 – Uplink and downlink OFDMA, especially suitable for simultaneous connections in high-density environments – Downlink MU-MIMO (multi-user, multipl | ESPRESSIF 乐鑫信息科技 | |||
Ultra-low-power SoC with RISC-V single-core microprocessor Features Wi-Fi • 1T1R in 2.4 GHz band • Operating frequency: 2412 ~ 2484 MHz • IEEE 802.11ax-compliant – 20 MHz-only non-AP mode – MCS0 ~MCS9 – Uplink and downlink OFDMA, especially suitable for simultaneous connections in high-density environments – Downlink MU-MIMO (multi-user, multipl | ESPRESSIF 乐鑫信息科技 | |||
Ultra-low-power SoC with RISC-V single-core microprocessor Features Wi-Fi • 1T1R in 2.4 GHz band • Operating frequency: 2412 ~ 2484 MHz • IEEE 802.11ax-compliant – 20 MHz-only non-AP mode – MCS0 ~MCS9 – Uplink and downlink OFDMA, especially suitable for simultaneous connections in high-density environments – Downlink MU-MIMO (multi-user, multipl | ESPRESSIF 乐鑫信息科技 | |||
Module that supports 2.4 GHz Wi-Fi 6 (802.11ax), Bluetooth® 5 (LE), Zigbee and Thread (802.15.4) 1.1 Features CPU and On-Chip Memory • ESP32-C6FH4/ESP32-C6FH8 embedded, 32-bit RISC-V single-core microprocessor, up to 160 MHz • ROM: 320 KB • HP SRAM: 512 KB • LP SRAM: 16 KB • Flash up to 8 MB in chip package Wi-Fi • 1T1R in 2.4 GHz band • Operating frequency: 2412 ~ 2484 MHz • IEEE | ESPRESSIF 乐鑫信息科技 | |||
Module that supports 2.4 GHz Wi-Fi 6 (802.11ax), Bluetooth® 5 (LE), Zigbee and Thread (802.15.4) 1.1 Features CPU and On-Chip Memory • ESP32-C6FH4/ESP32-C6FH8 embedded, 32-bit RISC-V single-core microprocessor, up to 160 MHz • ROM: 320 KB • HP SRAM: 512 KB • LP SRAM: 16 KB • Flash up to 8 MB in chip package Wi-Fi • 1T1R in 2.4 GHz band • Operating frequency: 2412 ~ 2484 MHz • IEEE | ESPRESSIF 乐鑫信息科技 | |||
Module that supports 2.4 GHz Wi-Fi 6 (802.11ax), Bluetooth® 5 (LE), Zigbee and Thread (802.15.4) 1.1 Features CPU and On-Chip Memory • ESP32-C6FH4/ESP32-C6FH8 embedded, 32-bit RISC-V single-core microprocessor, up to 160 MHz • ROM: 320 KB • HP SRAM: 512 KB • LP SRAM: 16 KB • Flash up to 8 MB in chip package Wi-Fi • 1T1R in 2.4 GHz band • Operating frequency: 2412 ~ 2484 MHz • IEEE | ESPRESSIF 乐鑫信息科技 | |||
Module that supports 2.4 GHz Wi-Fi 6 (802.11ax), Bluetooth® 5 (LE), Zigbee and Thread (802.15.4) 1.1 Features CPU and On-Chip Memory • ESP32-C6FH4/ESP32-C6FH8 embedded, 32-bit RISC-V single-core microprocessor, up to 160 MHz • ROM: 320 KB • HP SRAM: 512 KB • LP SRAM: 16 KB • Flash up to 8 MB in chip package Wi-Fi • 1T1R in 2.4 GHz band • Operating frequency: 2412 ~ 2484 MHz • IEEE | ESPRESSIF 乐鑫信息科技 | |||
Module that supports 2.4 GHz Wi-Fi 6 (802.11ax), Bluetooth® 5 (LE), Zigbee and Thread (802.15.4) 1.1 Features CPU and On-Chip Memory • ESP32-C6FH4/ESP32-C6FH8 embedded, 32-bit RISC-V single-core microprocessor, up to 160 MHz • ROM: 320 KB • HP SRAM: 512 KB • LP SRAM: 16 KB • Flash up to 8 MB in chip package Wi-Fi • 1T1R in 2.4 GHz band • Operating frequency: 2412 ~ 2484 MHz • IEEE | ESPRESSIF 乐鑫信息科技 | |||
Module that supports 2.4 GHz Wi-Fi 6 (802.11ax), Bluetooth® 5 (LE), Zigbee and Thread (802.15.4) 1.1 Features CPU and On-Chip Memory • ESP32-C6FH4/ESP32-C6FH8 embedded, 32-bit RISC-V single-core microprocessor, up to 160 MHz • ROM: 320 KB • HP SRAM: 512 KB • LP SRAM: 16 KB • Flash up to 8 MB in chip package Wi-Fi • 1T1R in 2.4 GHz band • Operating frequency: 2412 ~ 2484 MHz • IEEE | ESPRESSIF 乐鑫信息科技 | |||
Module that supports 2.4 GHz Wi-Fi 6 (802.11ax), Bluetooth® 5 (LE), Zigbee and Thread (802.15.4) 1.1 Features CPU and On-Chip Memory • ESP32-C6FH4/ESP32-C6FH8 embedded, 32-bit RISC-V single-core microprocessor, up to 160 MHz • ROM: 320 KB • HP SRAM: 512 KB • LP SRAM: 16 KB • Flash up to 8 MB in chip package Wi-Fi • 1T1R in 2.4 GHz band • Operating frequency: 2412 ~ 2484 MHz • IEEE | ESPRESSIF 乐鑫信息科技 | |||
Module that supports 2.4 GHz Wi-Fi 6 (802.11ax), Bluetooth® 5 (LE), Zigbee and Thread (802.15.4) 1.1 Features CPU and On-Chip Memory • ESP32-C6FH4/ESP32-C6FH8 embedded, 32-bit RISC-V single-core microprocessor, up to 160 MHz • ROM: 320 KB • HP SRAM: 512 KB • LP SRAM: 16 KB • Flash up to 8 MB in chip package Wi-Fi • 1T1R in 2.4 GHz band • Operating frequency: 2412 ~ 2484 MHz • IEEE | ESPRESSIF 乐鑫信息科技 | |||
Module that supports 2.4 GHz Wi-Fi 6 (802.11ax), Bluetooth® 5 (LE), Zigbee and Thread (802.15.4) 1.1 Features CPU and On-Chip Memory • ESP32-C6 embedded, 32-bit RISC-V single-core microprocessor, up to 160 MHz • ROM: 320 KB • HP SRAM: 512 KB • LP SRAM: 16 KB Wi-Fi • 1T1R in 2.4 GHz band • Operating frequency: 2412 ~ 2484 MHz • IEEE 802.11ax-compliant – 20 MHz-only non-AP mode – MC | ESPRESSIF 乐鑫信息科技 | |||
Module that supports 2.4 GHz Wi-Fi 6 (802.11ax), Bluetooth® 5 (LE), Zigbee and Thread (802.15.4) 1.1 Features CPU and On-Chip Memory • ESP32-C6 embedded, 32-bit RISC-V single-core microprocessor, up to 160 MHz • ROM: 320 KB • HP SRAM: 512 KB • LP SRAM: 16 KB Wi-Fi • 1T1R in 2.4 GHz band • Operating frequency: 2412 ~ 2484 MHz • IEEE 802.11ax-compliant – 20 MHz-only non-AP mode – MC | ESPRESSIF 乐鑫信息科技 | |||
Module that supports 2.4 GHz Wi-Fi 6 (802.11ax), Bluetooth® 5 (LE), Zigbee and Thread (802.15.4) 1.1 Features CPU and On-Chip Memory • ESP32-C6 embedded, 32-bit RISC-V single-core microprocessor, up to 160 MHz • ROM: 320 KB • HP SRAM: 512 KB • LP SRAM: 16 KB Wi-Fi • 1T1R in 2.4 GHz band • Operating frequency: 2412 ~ 2484 MHz • IEEE 802.11ax-compliant – 20 MHz-only non-AP mode – MC | ESPRESSIF 乐鑫信息科技 | |||
Module that supports 2.4 GHz Wi-Fi 6 (802.11ax), Bluetooth® 5 (LE), Zigbee and Thread (802.15.4) 1.1 Features CPU and On-Chip Memory • ESP32-C6 embedded, 32-bit RISC-V single-core microprocessor, up to 160 MHz • ROM: 320 KB • HP SRAM: 512 KB • LP SRAM: 16 KB Wi-Fi • 1T1R in 2.4 GHz band • Operating frequency: 2412 ~ 2484 MHz • IEEE 802.11ax-compliant – 20 MHz-only non-AP mode – MC | ESPRESSIF 乐鑫信息科技 | |||
Module that supports 2.4 GHz Wi-Fi 6 (802.11ax), Bluetooth® 5 (LE), Zigbee and Thread (802.15.4) 1.1 Features CPU and On-Chip Memory • ESP32-C6 embedded, 32-bit RISC-V single-core microprocessor, up to 160 MHz • ROM: 320 KB • HP SRAM: 512 KB • LP SRAM: 16 KB Wi-Fi • 1T1R in 2.4 GHz band • Operating frequency: 2412 ~ 2484 MHz • IEEE 802.11ax-compliant – 20 MHz-only non-AP mode – MC | ESPRESSIF 乐鑫信息科技 | |||
Module that supports 2.4 GHz Wi-Fi 6 (802.11ax), Bluetooth® 5 (LE), Zigbee and Thread (802.15.4) 1.1 Features CPU and On-Chip Memory • ESP32-C6 embedded, 32-bit RISC-V single-core microprocessor, up to 160 MHz • ROM: 320 KB • HP SRAM: 512 KB • LP SRAM: 16 KB Wi-Fi • 1T1R in 2.4 GHz band • Operating frequency: 2412 ~ 2484 MHz • IEEE 802.11ax-compliant – 20 MHz-only non-AP mode – MC | ESPRESSIF 乐鑫信息科技 | |||
2.4 GHz Wi-Fi Bluetooth® Bluetooth LE module 1.1 Features CPU and On-Chip Memory • ESP32-D0WD-V3 embedded, Xtensa® dual-core 32-bit LX6 microprocessor, up to 240 MHz • 448 KB ROM for booting and core functions • 520 KB SRAM for data and instructions • 16 KB SRAM in RTC Wi-Fi • 802.11b/g/n • Bit rate: 802.11n up to 150 Mbps • A-MPD | ESPRESSIF 乐鑫信息科技 | |||
ESP32-D0WD-V3 embedded, Xtensa® dual-core 1.1 Features MCU • ESP32-D0WD-V3 embedded, Xtensa® dual-core 32-bit LX6 microprocessor, up to 240 MHz • 448 KB ROM for booting and core functions • 520 KB SRAM for data and instructions • 16 KB SRAM in RTC WiFi • 802.11b/g/n • Bit rate: 802.11n up to 150 Mbps • A-MPDU and A-MSDU aggregat | ESPRESSIF 乐鑫信息科技 | |||
RISC-V 32-bit single-core microprocessor Bluetooth® Low Energy and IEEE 802.15.4 Features Bluetooth® • Bluetooth Low Energy (Bluetooth 5.3 certified) • Bluetooth mesh • Bluetooth Low Energy long range (Coded PHY, 125 Kbps and 500 Kbps) • Bluetooth Low Energy high speed (2 Mbps) • Bluetooth Low Energy advertising extensions and multiple advertising sets • Simultaneous op | ESPRESSIF 乐鑫信息科技 | |||
RISC-V 32-bit single-core microprocessor Bluetooth® Low Energy and IEEE 802.15.4 Features Bluetooth® • Bluetooth Low Energy (Bluetooth 5.3 certified) • Bluetooth mesh • Bluetooth Low Energy long range (Coded PHY, 125 Kbps and 500 Kbps) • Bluetooth Low Energy high speed (2 Mbps) • Bluetooth Low Energy advertising extensions and multiple advertising sets • Simultaneous op | ESPRESSIF 乐鑫信息科技 | |||
RISC-V 32-bit single-core microprocessor Bluetooth® Low Energy and IEEE 802.15.4 Features Bluetooth® • Bluetooth Low Energy (Bluetooth 5.3 certified) • Bluetooth mesh • Bluetooth Low Energy long range (Coded PHY, 125 Kbps and 500 Kbps) • Bluetooth Low Energy high speed (2 Mbps) • Bluetooth Low Energy advertising extensions and multiple advertising sets • Simultaneous op | ESPRESSIF 乐鑫信息科技 | |||
Bluetooth® Low Energy and IEEE 802.15.4 module 1.1 Features CPU and On-Chip Memory • ESP32-H2 embedded, RISC-V single-core 32-bit microprocessor, up to 96 MHz • 128 KB ROM • 320 KB SRAM • 4 KB LP Memory • 2 MB or 4 MB in-package flash Bluetooth® • Bluetooth Low Energy (Bluetooth 5.3 certified) • Bluetooth mesh • Bluetooth Low Energy | ESPRESSIF 乐鑫信息科技 | |||
Bluetooth® Low Energy and IEEE 802.15.4 module 1.1 Features CPU and On-Chip Memory • ESP32-H2 embedded, RISC-V single-core 32-bit microprocessor, up to 96 MHz • 128 KB ROM • 320 KB SRAM • 4 KB LP Memory • 2 MB or 4 MB in-package flash Bluetooth® • Bluetooth Low Energy (Bluetooth 5.3 certified) • Bluetooth mesh • Bluetooth Low Energy | ESPRESSIF 乐鑫信息科技 | |||
Bluetooth® Low Energy and IEEE 802.15.4 module 1.1 Features CPU and On-Chip Memory • ESP32-H2 embedded, RISC-V single-core 32-bit microprocessor, up to 96 MHz • 128 KB ROM • 320 KB SRAM • 4 KB LP Memory • 2 MB or 4 MB in-package flash Bluetooth® • Bluetooth Low Energy (Bluetooth 5.3 certified) • Bluetooth mesh • Bluetooth Low Energy | ESPRESSIF 乐鑫信息科技 | |||
Bluetooth® Low Energy and IEEE 802.15.4 module 1.1 Features CPU and On-Chip Memory • ESP32-H2 embedded, RISC-V single-core 32-bit microprocessor, up to 96 MHz • 128 KB ROM • 320 KB SRAM • 4 KB LP Memory • 2 MB or 4 MB in-package flash Bluetooth® • Bluetooth Low Energy (Bluetooth 5.3 certified) • Bluetooth mesh • Bluetooth Low Energy | ESPRESSIF 乐鑫信息科技 | |||
Bluetooth® Low Energy and IEEE 802.15.4 module 1.1 Features CPU and On-Chip Memory • ESP32-H2 embedded, RISC-V single-core 32-bit microprocessor, up to 96 MHz • 128 KB ROM • 320 KB SRAM • 4 KB LP Memory • 2 MB or 4 MB in-package flash Bluetooth® • Bluetooth Low Energy (Bluetooth 5.3 certified) • Bluetooth mesh • Bluetooth Low Energy | ESPRESSIF 乐鑫信息科技 | |||
Bluetooth® Low Energy and IEEE 802.15.4 module 1.1 Features CPU and On-Chip Memory • ESP32-H2 embedded, RISC-V single-core 32-bit microprocessor, up to 96 MHz • 128 KB ROM • 320 KB SRAM • 4 KB LP Memory • 2 MB or 4 MB in-package flash Bluetooth • Bluetooth Low Energy (Bluetooth 5.3 certified) • Bluetooth mesh • Bluetooth Low Energy | ESPRESSIF 乐鑫信息科技 | |||
Bluetooth® Low Energy and IEEE 802.15.4 module 1.1 Features CPU and On-Chip Memory • ESP32-H2 embedded, RISC-V single-core 32-bit microprocessor, up to 96 MHz • 128 KB ROM • 320 KB SRAM • 4 KB LP Memory • 2 MB or 4 MB in-package flash Bluetooth • Bluetooth Low Energy (Bluetooth 5.3 certified) • Bluetooth mesh • Bluetooth Low Energy | ESPRESSIF 乐鑫信息科技 | |||
Bluetooth® Low Energy and IEEE 802.15.4 module 1.1 Features CPU and On-Chip Memory • ESP32-H2 embedded, RISC-V single-core 32-bit microprocessor, up to 96 MHz • 128 KB ROM • 320 KB SRAM • 4 KB LP Memory • 2 MB or 4 MB in-package flash Bluetooth • Bluetooth Low Energy (Bluetooth 5.3 certified) • Bluetooth mesh • Bluetooth Low Energy | ESPRESSIF 乐鑫信息科技 |
| IC供应商 | 芯片型号 | 品牌 | 批号 | 封装 | 库存 | 备注 | 价格 |
|---|---|---|---|---|---|---|---|
Ai-Thinker(安信可) |
24+ |
SMD |
8215 |
现货供应,当天可交货!免费送样,原厂技术支持!!! |
|||
ESPRESSIF/乐鑫 |
23+ |
QFN48(5*5) |
12500 |
ESPRESSIF全系列芯片在售 |
|||
ESPRESSIF/乐鑫 |
24+ |
MODULE |
97586 |
专业代理WIFI蓝牙模组原装现货 |
|||
ESPRESSIF |
25+ |
QFN48 |
12496 |
ESPRESSIF原装正品ESP32-D0WDQ6即刻询购立享优惠#长期有货 |
|||
ESP |
24+ |
SMD |
25836 |
新到现货,只做全新原装正品 |
|||
ESPRESSIF/乐鑫 |
25+ |
QFN32 |
20000 |
全新原装正品现货,假一赔十 |
|||
ESPRESSIF |
23+ |
SMD |
1280 |
正规渠道,只有原装! |
|||
ESPRESSIF/乐鑫 |
23+ |
QFN48 (6*6) |
56560 |
专业配单,原装正品假一罚十,代理渠道价格优 |
|||
乐鑫 |
25+ |
SMD |
90000 |
全新原装正品现货 |
|||
Espressif |
23+ |
开发板 |
2000 |
原装正品,假一罚十 |
ESP32规格书下载地址
ESP32参数引脚图相关
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ESP32数据表相关新闻
ESP32-C3FH4X RISC-V单核 2.4 GHz Wi-F蓝牙芯片
RISC-V单核 2.4 GHz Wi-F蓝牙芯片
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优势渠道
2023-7-20ESP32-C3FH4
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2022-9-5ESE-13H01D
ESE-13H01D
2021-1-27ESE-13H01D
商品屬性 屬性值 搜尋類似項目 製造商: Panasonic 產品類型: 探測器開關 RoHS: 詳細資料 操作力: 300 mN 额定电流: 10 mA 直流電額定電壓: 5 VDC 高度: 1.2 mm 終端類型: Solder Pin 封裝: Cut Tape 封裝: MouseReel 封裝: Reel 觸點形式: SPST 照明色彩: - 系列: ESE13 品牌: Panasonic
2021-1-27ESE-13H01D
ESE-13H01D
2021-1-27
DdatasheetPDF页码索引
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