1.1 Features

MCU

• ESP32-D0WD-V3 embedded, Xtensa® dual-core

32-bit LX6 microprocessor, up to 240 MHz

• 448 KB ROM for booting and core functions

• 520 KB SRAM for data and instructions

• 16 KB SRAM in RTC

WiFi

• 802.11b/g/n

• Bit rate: 802.11n up to 150 Mbps

• A-MPDU and A-MSDU aggregation

• 0.4 μs guard interval support

• Center frequency range of operating channel:

2412 ~ 2484 MHz

Bluetooth®

• Bluetooth V4.2 BR/EDR and Bluetooth LE

specification

• Class-1, class-2 and class-3 transmitter

• AFH

• CVSD and SBC

Hardware

• Interfaces: SD card, UART, SPI, SDIO, I2C, LED

PWM, Motor PWM, I2S, IR, pulse counter, GPIO,

capacitive touch sensor, ADC, DAC, Two-Wire

Automotive Interface (TWAI®, compatible with

ISO11898-1)

• 40 MHz crystal oscillator

• 4 MB SPI flash

• Operating voltage/Power supply: 3.0 ~ 3.6 V

• Operating temperature range: –40 ~ 85 °C

• Dimensions: See Table 1

Certification

• Bluetooth certification: BQB

• RF certification: FCC/CE-RED/SRRC

• Green certification: REACH/RoHS