型号 功能描述 生产厂家 企业 LOGO 操作
ESP32-S3

2.4 GHz Wi-Fi Bluetooth® LE SoC Supporting IEEE 802.11 b/g/n (2.4 GHz Wi-Fi) and Bluetooth® 5 (LE)

文件:889.28 Kbytes Page:69 Pages

ESPRESSIF

乐鑫信息科技

ESP32-S3

封装/外壳:56-VFQFN 裸露焊盘 包装:卷带(TR)剪切带(CT)Digi-Reel® 得捷定制卷带 描述:SMD IC ESP32-S3, DUAL-CORE MCU, RF/IF,射频/中频和 RFID 射频收发器 IC

ESPRESSIF

乐鑫信息科技

ESP32-S3

集成 2.4 GHz Wi-Fi 和 Bluetooth 5 (LE) 的 MCU 芯片

ESPRESSIF

乐鑫信息科技

Small-sized module supporting 2.4 GHz Wi-Fi (802.11b/g/n) and Bluetooth® 5

1.1 Features CPU and On-Chip Memory • ESP32-S3 embedded, Xtensa® dual-core 32-bit LX7 microprocessor (with single precision FPU), up to 240 MHz • 384 KB ROM • 512 KB SRAM • 16 KB SRAM in RTC • Up to 8 MB Quad SPI flash • 2 MB PSRAM (ESP32-S3FH4R2 only) Wi-Fi • 802.11b/g/n • Bit rate: 8

ESPRESSIF

乐鑫信息科技

Small-sized module supporting 2.4 GHz Wi-Fi (802.11b/g/n) and Bluetooth® 5

1.1 Features CPU and On-Chip Memory • ESP32-S3 embedded, Xtensa® dual-core 32-bit LX7 microprocessor (with single precision FPU), up to 240 MHz • 384 KB ROM • 512 KB SRAM • 16 KB SRAM in RTC • Up to 8 MB Quad SPI flash • 2 MB PSRAM (ESP32-S3FH4R2 only) Wi-Fi • 802.11b/g/n • Bit rate: 8

ESPRESSIF

乐鑫信息科技

Small-sized module supporting 2.4 GHz Wi-Fi (802.11b/g/n) and Bluetooth® 5

1.1 Features CPU and On-Chip Memory • ESP32-S3 embedded, Xtensa® dual-core 32-bit LX7 microprocessor (with single precision FPU), up to 240 MHz • 384 KB ROM • 512 KB SRAM • 16 KB SRAM in RTC • Up to 8 MB Quad SPI flash • 2 MB PSRAM (ESP32-S3FH4R2 only) Wi-Fi • 802.11b/g/n • Bit rate: 8

ESPRESSIF

乐鑫信息科技

Small-sized module supporting 2.4 GHz Wi-Fi (802.11b/g/n) and Bluetooth® 5

1.1 Features CPU and On-Chip Memory • ESP32-S3 embedded, Xtensa® dual-core 32-bit LX7 microprocessor (with single precision FPU), up to 240 MHz • 384 KB ROM • 512 KB SRAM • 16 KB SRAM in RTC • Up to 8 MB Quad SPI flash • 2 MB PSRAM (ESP32-S3FH4R2 only) Wi-Fi • 802.11b/g/n • Bit rate: 8

ESPRESSIF

乐鑫信息科技

Small-sized module supporting 2.4 GHz Wi-Fi (802.11b/g/n) and Bluetooth® 5

1.1 Features CPU and On-Chip Memory • ESP32-S3 embedded, Xtensa® dual-core 32-bit LX7 microprocessor (with single precision FPU), up to 240 MHz • 384 KB ROM • 512 KB SRAM • 16 KB SRAM in RTC • Up to 8 MB Quad SPI flash • 2 MB PSRAM (ESP32-S3FH4R2 only) Wi-Fi • 802.11b/g/n • Bit rate: 8

ESPRESSIF

乐鑫信息科技

Small-sized module supporting 2.4 GHz Wi-Fi (802.11b/g/n) and Bluetooth® 5

1.1 Features CPU and On-Chip Memory • ESP32-S3 embedded, Xtensa® dual-core 32-bit LX7 microprocessor (with single precision FPU), up to 240 MHz • 384 KB ROM • 512 KB SRAM • 16 KB SRAM in RTC • Up to 8 MB Quad SPI flash • 2 MB PSRAM (ESP32-S3FH4R2 only) Wi-Fi • 802.11b/g/n • Bit rate: 8

ESPRESSIF

乐鑫信息科技

2.4 GHz Wi-Fi Bluetooth® LE SiP

Features CPU and Memory • ESP32-S3 SoC embedded, Xtensa® dual-core 32-bit LX7 microprocessor (with single precision FPU), up to 240 MHz • 384 KB ROM • 512 KB SRAM • 16 KB SRAM in RTC Wi-Fi • 802.11b/g/n • Bit rate: 802.11n up to 150 Mbps • TX/RX A-MPDU, TX/RX A-MSDU • 0.4 μs guard inte

ESPRESSIF

乐鑫信息科技

2.4 GHz Wi-Fi Bluetooth® LE SiP

Features CPU and Memory • ESP32-S3 SoC embedded, Xtensa® dual-core 32-bit LX7 microprocessor (with single precision FPU), up to 240 MHz • 384 KB ROM • 512 KB SRAM • 16 KB SRAM in RTC Wi-Fi • 802.11b/g/n • Bit rate: 802.11n up to 150 Mbps • TX/RX A-MPDU, TX/RX A-MSDU • 0.4 μs guard inte

ESPRESSIF

乐鑫信息科技

2.4 GHz Wi-Fi Bluetooth® LE SiP

Features CPU and Memory • ESP32-S3 SoC embedded, Xtensa® dual-core 32-bit LX7 microprocessor (with single precision FPU), up to 240 MHz • 384 KB ROM • 512 KB SRAM • 16 KB SRAM in RTC Wi-Fi • 802.11b/g/n • Bit rate: 802.11n up to 150 Mbps • TX/RX A-MPDU, TX/RX A-MSDU • 0.4 μs guard inte

ESPRESSIF

乐鑫信息科技

2.4 GHz WiFi (802.11 b/g/n) and Bluetooth® 5 (LE) module

2.4 GHz WiFi (802.11 b/g/n) and Bluetooth® 5 (LE) module Built around ESP32S3 series of SoCs, Xtensa® dualcore 32bit LX7 microprocessor Flash up to 16 MB, PSRAM up to 8 MB 36 GPIOs, rich set of peripherals Onboard PCB antenna Features CPU and OnChip Memory • ESP32-S3 series of SoC

ESPRESSIF

乐鑫信息科技

ESP32-S3-DevKitC-1

The document consists of the following major sections: Getting started: Overview of the board and hardware/software setup instructions to get started. Hardware Reference: More detailed information about the board’s hardware. Hardware Revision Details: Revision history, known issues, and links t

ESPRESSIF

乐鑫信息科技

ESP32-S3-DevKitC-1

The document consists of the following major sections: Getting started: Overview of the board and hardware/software setup instructions to get started. Hardware Reference: More detailed information about the board’s hardware. Hardware Revision Details: Revision history, known issues, and links t

ESPRESSIF

乐鑫信息科技

2.4 GHz WiFi (802.11 b/g/n) and Bluetooth® 5 (LE) module

2.4 GHz WiFi (802.11 b/g/n) and Bluetooth® 5 (LE) module Built around ESP32S3 series of SoCs, Xtensa® dualcore 32bit LX7 microprocessor Flash up to 16 MB, PSRAM up to 8 MB 36 GPIOs, rich set of peripherals Onboard PCB antenna Features CPU and OnChip Memory • ESP32-S3 series of SoC

ESPRESSIF

乐鑫信息科技

2.4 GHz Wi-Fi (802.11b/g/n) and Bluetooth® 5 module

1.1 Features CPU and On-Chip Memory • ESP32-S3 SoC embedded, Xtensa® dual-core 32-bit LX7 microprocessor (with single precision FPU), up to 240 MHz • 384 KB ROM • 512 KB SRAM • 16 KB SRAM in RTC • Up to 16 MB PSRAM Wi-Fi • 802.11b/g/n • Bit rate: 802.11n up to 150 Mbps • A-MPDU and A-M

ESPRESSIF

乐鑫信息科技

2.4 GHz Wi-Fi (802.11b/g/n) and Bluetooth® 5 module

1.1 Features CPU and On-Chip Memory • ESP32-S3 SoC embedded, Xtensa® dual-core 32-bit LX7 microprocessor (with single precision FPU), up to 240 MHz • 384 KB ROM • 512 KB SRAM • 16 KB SRAM in RTC • Up to 16 MB PSRAM Wi-Fi • 802.11b/g/n • Bit rate: 802.11n up to 150 Mbps • A-MPDU and A-M

ESPRESSIF

乐鑫信息科技

2.4 GHz Wi-Fi (802.11b/g/n) and Bluetooth® 5 module

1.1 Features CPU and On-Chip Memory • ESP32-S3 SoC embedded, Xtensa® dual-core 32-bit LX7 microprocessor (with single precision FPU), up to 240 MHz • 384 KB ROM • 512 KB SRAM • 16 KB SRAM in RTC • Up to 16 MB PSRAM Wi-Fi • 802.11b/g/n • Bit rate: 802.11n up to 150 Mbps • A-MPDU and A-M

ESPRESSIF

乐鑫信息科技

2.4 GHz Wi-Fi (802.11b/g/n) and Bluetooth® 5 module

1.1 Features CPU and On-Chip Memory • ESP32-S3 SoC embedded, Xtensa® dual-core 32-bit LX7 microprocessor (with single precision FPU), up to 240 MHz • 384 KB ROM • 512 KB SRAM • 16 KB SRAM in RTC • Up to 16 MB PSRAM Wi-Fi • 802.11b/g/n • Bit rate: 802.11n up to 150 Mbps • A-MPDU and A-M

ESPRESSIF

乐鑫信息科技

功能:语音识别 包装:散装 描述:ESP32-S3 AI VOICE DEV KIT 开发板,套件,编程器 评估和演示板及套件

ESPRESSIF

乐鑫信息科技

2.4 GHz Wi-Fi Bluetooth® LE SoC Supporting IEEE 802.11 b/g/n (2.4 GHz Wi-Fi) and Bluetooth® 5 (LE)

文件:889.28 Kbytes Page:69 Pages

ESPRESSIF

乐鑫信息科技

2.4 GHz Wi-Fi Bluetooth® LE SoC Supporting IEEE 802.11 b/g/n (2.4 GHz Wi-Fi) and Bluetooth® 5 (LE)

文件:889.28 Kbytes Page:69 Pages

ESPRESSIF

乐鑫信息科技

2.4 GHz Wi-Fi Bluetooth® LE SoC Supporting IEEE 802.11 b/g/n (2.4 GHz Wi-Fi) and Bluetooth® 5 (LE)

文件:889.28 Kbytes Page:69 Pages

ESPRESSIF

乐鑫信息科技

2.4 GHz Wi-Fi Bluetooth® LE SoC Supporting IEEE 802.11 b/g/n (2.4 GHz Wi-Fi) and Bluetooth® 5 (LE)

文件:889.28 Kbytes Page:69 Pages

ESPRESSIF

乐鑫信息科技

2.4 GHz Wi-Fi Bluetooth® LE SoC Supporting IEEE 802.11 b/g/n (2.4 GHz Wi-Fi) and Bluetooth® 5 (LE)

文件:889.28 Kbytes Page:69 Pages

ESPRESSIF

乐鑫信息科技

2.4 GHz Wi­Fi + 低功耗蓝牙 SoC

ESPRESSIF

乐鑫信息科技

2.4 GHz Wi-Fi Bluetooth® LE SoC Supporting IEEE 802.11 b/g/n (2.4 GHz Wi-Fi) and Bluetooth® 5 (LE)

文件:889.28 Kbytes Page:69 Pages

ESPRESSIF

乐鑫信息科技

32-bit MCU & 2.4 GHz Wi-Fi & Bluetooth 5 (LE)

ESPRESSIF

乐鑫信息科技

更新时间:2025-12-27 23:00:00
IC供应商 芯片型号 品牌 批号 封装 库存 备注 价格
ESPRESSIF(乐鑫)
24+
QFN56EP(7x7)
8215
现货供应,当天可交货!免费送样,原厂技术支持!!!
Espressif/乐鑫
25+
QFN56 (7*7)
12530
Espressif/乐鑫通信芯片和模块在售
N/A
24+
N/A
7851
原厂可订货,技术支持,直接渠道。可签保供合同
ESPRESSIF/乐鑫
24+
MODULE
97586
专业代理WIFI蓝牙模组原装现货
ESPRESSIF 乐鑫
24+
QFN-56(7x7)
32000
全新原厂原装正品现货,低价出售,实单可谈
ESPRESSIF/乐鑫
2450+
QFN56
9850
只做原装正品现货或订货假一赔十!
ESPRESSIF/乐鑫
23+
QFN56 (7*7)
56560
专业配单,原装正品假一罚十,代理渠道价格优
ESPRESSIF/乐鑫
25+
QFN56
80000
全网最低/原装现货
Espressif
23+
开发板
2000
原装正品,假一罚十
ESPRESSIF(乐鑫)
25+
QFN-56-EP(7x7)
500000
源自原厂成本,高价回收工厂呆滞

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