集成 2.4 GHz Wi-Fi 和 Bluetooth 5 (LE) 的 MCU 芯片

ESP32-S3 是一款低功耗的MCU 系统级芯片(SoC)，集成2.4 GHz Wi-Fi 和低功耗蓝牙(Bluetooth® LE) 双模无线通信。\r\n\r\nESP32-S3 有完整的Wi-Fi子系统和低功耗蓝牙子系统，具有行业领先的低功耗性能和射频性能。支持多种低功耗工作状态，能够满足各种应用场景的功耗需求。ESP32-S3 芯片提供丰富的外设接口，并具有多种特有的硬件安全机制。完善的安全机制使芯片能够满足严格的安全要求。 Core: Xtensa® dual-core 32-bit LX7 CPU, frequency up to 240MHz\r\nMemories:\r\n384 KB of ROM\r\n512 KB of SRAM\r\n16 KB of RTCSRAM\r\nWorking Voltage: 3 V to 3.6 V\r\nUp to 45 GPIOs\r\n2*12-bit ADC (up to 20 channels)\r\nCommunication interfaces\r\n2 I2C interfaces\r\n2 I2S interface\r\n4 SPI interf;

封装/外壳：56-VFQFN 裸露焊盘 包装：卷带（TR）剪切带（CT）Digi-Reel® 得捷定制卷带 描述：SMD IC ESP32-S3, DUAL-CORE MCU, RF/IF，射频/中频和 RFID 射频收发器 IC

2.4 GHz Wi-Fi Bluetooth® LE SoC Supporting IEEE 802.11 b/g/n (2.4 GHz Wi-Fi) and Bluetooth® 5 (LE)

文件：889.28 Kbytes Page：69 Pages

2.4 GHz Wi­Fi + 低功耗蓝牙 SoC

ESP32-S3 是一款低功耗的MCU 系统级芯片(SoC)，集成2.4 GHz Wi-Fi 和低功耗蓝牙(Bluetooth® LE) 双模无线通信。\r\n\r\nESP32-S3 有完整的Wi-Fi子系统和低功耗蓝牙子系统，具有行业领先的低功耗性能和射频性能。支持多种低功耗工作状态，能够满足各种应用场景的功耗需求。ESP32-S3 芯片提供丰富的外设接口，并具有多种特有的硬件安全机制。完善的安全机制使芯片能够满足严格的安全要求。 Core: Xtensa® dual-core 32-bit LX7 CPU, frequency up to 240MHz\r\nMemories:\r\n384 KB of ROM\r\n512 KB of SRAM\r\n16 KB of RTCSRAM\r\nWorking Voltage: 3 V to 3.6 V\r\nUp to 45 GPIOs\r\n2*12-bit ADC (up to 20 channels)\r\nCommunication interfaces\r\n2 I2C interfaces\r\n2 I2S interface\r\n4 SPI interf;

Small-sized module supporting 2.4 GHz Wi-Fi (802.11b/g/n) and Bluetooth® 5

1.1 Features CPU and On-Chip Memory • ESP32-S3 embedded, Xtensa® dual-core 32-bit LX7 microprocessor (with single precision FPU), up to 240 MHz • 384 KB ROM • 512 KB SRAM • 16 KB SRAM in RTC • Up to 8 MB Quad SPI flash • 2 MB PSRAM (ESP32-S3FH4R2 only) Wi-Fi • 802.11b/g/n • Bit rate: 8

Small-sized module supporting 2.4 GHz Wi-Fi (802.11b/g/n) and Bluetooth® 5

1.1 Features CPU and On-Chip Memory • ESP32-S3 embedded, Xtensa® dual-core 32-bit LX7 microprocessor (with single precision FPU), up to 240 MHz • 384 KB ROM • 512 KB SRAM • 16 KB SRAM in RTC • Up to 8 MB Quad SPI flash • 2 MB PSRAM (ESP32-S3FH4R2 only) Wi-Fi • 802.11b/g/n • Bit rate: 8

Small-sized module supporting 2.4 GHz Wi-Fi (802.11b/g/n) and Bluetooth® 5

1.1 Features CPU and On-Chip Memory • ESP32-S3 embedded, Xtensa® dual-core 32-bit LX7 microprocessor (with single precision FPU), up to 240 MHz • 384 KB ROM • 512 KB SRAM • 16 KB SRAM in RTC • Up to 8 MB Quad SPI flash • 2 MB PSRAM (ESP32-S3FH4R2 only) Wi-Fi • 802.11b/g/n • Bit rate: 8

Small-sized module supporting 2.4 GHz Wi-Fi (802.11b/g/n) and Bluetooth® 5

1.1 Features CPU and On-Chip Memory • ESP32-S3 embedded, Xtensa® dual-core 32-bit LX7 microprocessor (with single precision FPU), up to 240 MHz • 384 KB ROM • 512 KB SRAM • 16 KB SRAM in RTC • Up to 8 MB Quad SPI flash • 2 MB PSRAM (ESP32-S3FH4R2 only) Wi-Fi • 802.11b/g/n • Bit rate: 8

Small-sized module supporting 2.4 GHz Wi-Fi (802.11b/g/n) and Bluetooth® 5

1.1 Features CPU and On-Chip Memory • ESP32-S3 embedded, Xtensa® dual-core 32-bit LX7 microprocessor (with single precision FPU), up to 240 MHz • 384 KB ROM • 512 KB SRAM • 16 KB SRAM in RTC • Up to 8 MB Quad SPI flash • 2 MB PSRAM (ESP32-S3FH4R2 only) Wi-Fi • 802.11b/g/n • Bit rate: 8

Small-sized module supporting 2.4 GHz Wi-Fi (802.11b/g/n) and Bluetooth® 5

1.1 Features CPU and On-Chip Memory • ESP32-S3 embedded, Xtensa® dual-core 32-bit LX7 microprocessor (with single precision FPU), up to 240 MHz • 384 KB ROM • 512 KB SRAM • 16 KB SRAM in RTC • Up to 8 MB Quad SPI flash • 2 MB PSRAM (ESP32-S3FH4R2 only) Wi-Fi • 802.11b/g/n • Bit rate: 8

2.4 GHz Wi-Fi Bluetooth® LE SiP

Features CPU and Memory • ESP32-S3 SoC embedded, Xtensa® dual-core 32-bit LX7 microprocessor (with single precision FPU), up to 240 MHz • 384 KB ROM • 512 KB SRAM • 16 KB SRAM in RTC Wi-Fi • 802.11b/g/n • Bit rate: 802.11n up to 150 Mbps • TX/RX A-MPDU, TX/RX A-MSDU • 0.4 μs guard inte

2.4 GHz Wi-Fi Bluetooth® LE SiP

Features CPU and Memory • ESP32-S3 SoC embedded, Xtensa® dual-core 32-bit LX7 microprocessor (with single precision FPU), up to 240 MHz • 384 KB ROM • 512 KB SRAM • 16 KB SRAM in RTC Wi-Fi • 802.11b/g/n • Bit rate: 802.11n up to 150 Mbps • TX/RX A-MPDU, TX/RX A-MSDU • 0.4 μs guard inte

2.4 GHz Wi-Fi Bluetooth® LE SiP

Features CPU and Memory • ESP32-S3 SoC embedded, Xtensa® dual-core 32-bit LX7 microprocessor (with single precision FPU), up to 240 MHz • 384 KB ROM • 512 KB SRAM • 16 KB SRAM in RTC Wi-Fi • 802.11b/g/n • Bit rate: 802.11n up to 150 Mbps • TX/RX A-MPDU, TX/RX A-MSDU • 0.4 μs guard inte

2.4 GHz WiFi (802.11 b/g/n) and Bluetooth® 5 (LE) module

2.4 GHz WiFi (802.11 b/g/n) and Bluetooth® 5 (LE) module Built around ESP32S3 series of SoCs, Xtensa® dualcore 32bit LX7 microprocessor Flash up to 16 MB, PSRAM up to 8 MB 36 GPIOs, rich set of peripherals Onboard PCB antenna Features CPU and OnChip Memory • ESP32-S3 series of SoC

ESP32-S3-DevKitC-1

The document consists of the following major sections: Getting started: Overview of the board and hardware/software setup instructions to get started. Hardware Reference: More detailed information about the board’s hardware. Hardware Revision Details: Revision history, known issues, and links t

ESP32-S3-DevKitC-1

The document consists of the following major sections: Getting started: Overview of the board and hardware/software setup instructions to get started. Hardware Reference: More detailed information about the board’s hardware. Hardware Revision Details: Revision history, known issues, and links t

2.4 GHz WiFi (802.11 b/g/n) and Bluetooth® 5 (LE) module

2.4 GHz WiFi (802.11 b/g/n) and Bluetooth® 5 (LE) module Built around ESP32S3 series of SoCs, Xtensa® dualcore 32bit LX7 microprocessor Flash up to 16 MB, PSRAM up to 8 MB 36 GPIOs, rich set of peripherals Onboard PCB antenna Features CPU and OnChip Memory • ESP32-S3 series of SoC

2.4 GHz Wi-Fi (802.11b/g/n) and Bluetooth® 5 module

1.1 Features CPU and On-Chip Memory • ESP32-S3 SoC embedded, Xtensa® dual-core 32-bit LX7 microprocessor (with single precision FPU), up to 240 MHz • 384 KB ROM • 512 KB SRAM • 16 KB SRAM in RTC • Up to 16 MB PSRAM Wi-Fi • 802.11b/g/n • Bit rate: 802.11n up to 150 Mbps • A-MPDU and A-M

2.4 GHz Wi-Fi (802.11b/g/n) and Bluetooth® 5 module

1.1 Features CPU and On-Chip Memory • ESP32-S3 SoC embedded, Xtensa® dual-core 32-bit LX7 microprocessor (with single precision FPU), up to 240 MHz • 384 KB ROM • 512 KB SRAM • 16 KB SRAM in RTC • Up to 16 MB PSRAM Wi-Fi • 802.11b/g/n • Bit rate: 802.11n up to 150 Mbps • A-MPDU and A-M

2.4 GHz Wi-Fi (802.11b/g/n) and Bluetooth® 5 module

1.1 Features CPU and On-Chip Memory • ESP32-S3 SoC embedded, Xtensa® dual-core 32-bit LX7 microprocessor (with single precision FPU), up to 240 MHz • 384 KB ROM • 512 KB SRAM • 16 KB SRAM in RTC • Up to 16 MB PSRAM Wi-Fi • 802.11b/g/n • Bit rate: 802.11n up to 150 Mbps • A-MPDU and A-M

2.4 GHz Wi-Fi (802.11b/g/n) and Bluetooth® 5 module

1.1 Features CPU and On-Chip Memory • ESP32-S3 SoC embedded, Xtensa® dual-core 32-bit LX7 microprocessor (with single precision FPU), up to 240 MHz • 384 KB ROM • 512 KB SRAM • 16 KB SRAM in RTC • Up to 16 MB PSRAM Wi-Fi • 802.11b/g/n • Bit rate: 802.11n up to 150 Mbps • A-MPDU and A-M

功能：语音识别 包装：散装 描述：ESP32-S3 AI VOICE DEV KIT 开发板，套件，编程器 评估和演示板及套件

2.4 GHz Wi-Fi Bluetooth® LE SoC Supporting IEEE 802.11 b/g/n (2.4 GHz Wi-Fi) and Bluetooth® 5 (LE)

文件：889.28 Kbytes Page：69 Pages

2.4 GHz Wi-Fi Bluetooth® LE SoC Supporting IEEE 802.11 b/g/n (2.4 GHz Wi-Fi) and Bluetooth® 5 (LE)

文件：889.28 Kbytes Page：69 Pages

2.4 GHz Wi-Fi Bluetooth® LE SoC Supporting IEEE 802.11 b/g/n (2.4 GHz Wi-Fi) and Bluetooth® 5 (LE)

文件：889.28 Kbytes Page：69 Pages

模组

2.4 GHz Wi-Fi Bluetooth® LE SoC Supporting IEEE 802.11 b/g/n (2.4 GHz Wi-Fi) and Bluetooth® 5 (LE)

文件：889.28 Kbytes Page：69 Pages

2.4 GHz Wi-Fi Bluetooth® LE SoC Supporting IEEE 802.11 b/g/n (2.4 GHz Wi-Fi) and Bluetooth® 5 (LE)

文件：889.28 Kbytes Page：69 Pages

2.4 GHz Wi-Fi Bluetooth® LE SoC Supporting IEEE 802.11 b/g/n (2.4 GHz Wi-Fi) and Bluetooth® 5 (LE)

文件：889.28 Kbytes Page：69 Pages