1.1 Features

CPU and On-Chip Memory

• ESP32-S3 SoC embedded, Xtensa® dual-core

32-bit LX7 microprocessor (with single precision

FPU), up to 240 MHz

• 384 KB ROM

• 512 KB SRAM

• 16 KB SRAM in RTC

• Up to 16 MB PSRAM

Wi-Fi

• 802.11b/g/n

• Bit rate: 802.11n up to 150 Mbps

• A-MPDU and A-MSDU aggregation

• 0.4 μs guard interval support

• Center frequency range of operating channel:

2412 ~ 2484 MHz

Bluetooth

• Bluetooth LE: Bluetooth 5, Bluetooth mesh

• Speed: 125 Kbps, 500 Kbps, 1 Mbps, 2 Mbps

• Advertising extensions

• Multiple advertisement sets

• Channel selection algorithm #2

• Internal co-existence mechanism between Wi-Fi

and Bluetooth to share the same antenna

Peripherals

• 33 GPIOs

– 4 strapping GPIOs

• SPI, LCD interface, Camera interface, UART, I2C,

I2S, remote control, pulse counter, LED PWM,

full-speed USB 2.0 OTG, USB Serial/JTAG

controller, MCPWM, SDIO host controller,

GDMA, TWAI® controller (compatible with ISO

11898-1), ADC, touch sensor, temperature

sensor, timers and watchdogs

Integrated Components on Module

• 40 MHz crystal oscillator

• Up to 32 MB Octal SPI flash

Antenna Options

• On-board PCB antenna

Operating Conditions

• Operating voltage/Power supply: 3.0 ~ 3.6 V

• Operating ambient temperature: –40 ~ 65 °C

Certification

• RF certification: See certificates

• Green certification: RoHS/REACH

Test

• HTOL/HTSL/uHAST/TCT/ESD