2.4 GHz Wi-Fi Bluetooth® Bluetooth LE SiP

Features CPU and On-Chip Memory • Xtensa® dual-core 32-bit LX6 microprocessor, up to 240 MHz • 448 KB ROM • 520 KB SRAM • 16 KB SRAM in RTC Wi-Fi • Complies with 802.11b/g/n • 1T1R mode with data rate up to 150 Mbps • TX/RX A-MPDU and RX A-MSDU aggregation • 0.4 μs guard interval suppor

封装/外壳：48-TFQFN 裸露焊盘 包装：卷带（TR）剪切带（CT）Digi-Reel® 得捷定制卷带 描述：RX TXRX MOD WIFI SURFACE MOUNT RF/IF，射频/中频和 RFID 射频收发器模块和调制解调器

基于 ESP32 的系统级封装 (SiP) 模组

2.4 GHz WiFi Bluetooth® Bluetooth LE module Built around ESP32 series of SoCs, Xtensa® dualcore Flash up to 8 MB, PSRAM up to 2 MB 27 GPIOs, rich set of peripherals On-board PCB antenna or external antenna connector

1.1 Features CPU and OnChip Memory • ESP32-PICO-V3-02 embedded, Xtensa dual-core 32-bit LX6 microprocessor, up to 240 MHz • 448 KB ROM for booting and core functions • 520 KB SRAM for data and instructions • 16 KB SRAM in RTC • 8 MB SPI flash • 2 MB PSRAM WiFi • 802.11b/g/n • Bit rate

2.4 GHz Wi-Fi Bluetooth® Bluetooth LE SiP

Features CPU and On-Chip Memory • Xtensa® dual-core 32-bit LX6 microprocessor, up to 240 MHz • 448 KB ROM • 520 KB SRAM • 16 KB SRAM in RTC Wi-Fi • Complies with 802.11b/g/n • 1T1R mode with data rate up to 150 Mbps • TX/RX A-MPDU and RX A-MSDU aggregation • 0.4 μs guard interval suppor

Alexa Connect Kit (ACK) module with an Espressif chipset

1.1 Features CPU and On-Chip Memory • ESP32 embedded, Xtensa dual-core 32-bit LX6 microprocessor, up to 240 MHz • 448 KB ROM • 520 KB SRAM • 16 KB SRAM in RTC Wi-Fi • 802.11b/g/n • Bit rate: 802.11n up to 150 Mbps • A-MPDU and A-MSDU aggregation • 0.4 μs guard interval support • Center

封装/外壳：48-LFQFN 裸露焊盘 包装：卷带（TR）剪切带（CT）Digi-Reel® 得捷定制卷带 描述：SIP MODULE WIFI BLE COMBO RF/IF，射频/中频和 RFID 射频收发器模块和调制解调器

基于 ESP32 (ECO V3) 的系统级封装 (SiP) 产品

通用型 Wi-Fi + Bluetooth® + Bluetooth® LE MCU 模组