XTR111 Demonstration Fixture Users Guide

2 Hardware Features This section describes the hardware features found on the XTR111EVM. 2.1 XTR111EVM The XTR111EVM is used for the basic functional evaluation of the XTR111. The EVM provides the following features: • Easy handling of the small DFN package. The DFN device is already soldered

封装/外壳：0805（2012 公制） 包装：卷带（TR）剪切带（CT）Digi-Reel® 得捷定制卷带 描述：RES SMD 10K OHM 1% 1/8W 0805 电阻器 片式电阻器 - 表面贴装

封装/外壳：0805（2012 公制） 包装：卷带（TR）剪切带（CT）Digi-Reel® 得捷定制卷带 描述：RES SMD 10K OHM 1% 1/8W 0805 电阻器 片式电阻器 - 表面贴装

贴片电阻

Precision Thick Film Chip Resistors

Features High reliability Metal glaze thick film resistive element and three Small size and lightweight layered electrodes. Compatible with placement machines Bulk, taping and magazine packaging available Suitable for both reflow soldering and flow soldering

Precision Thick Film Chip Resistors

Features High reliability Metal glaze thick film resistive element and three Small size and lightweight layered electrodes. Compatible with placement machines Bulk, taping and magazine packaging available Suitable for both reflow soldering and flow soldering

Precision Thick Film Chip Resistors

Features High reliability Metal glaze thick film resistive element and three Small size and lightweight layered electrodes. Compatible with placement machines Bulk, taping and magazine packaging available Suitable for both reflow soldering and flow soldering

Compact Intelligent Power Module Based Motor Evaluation Board with Interleaved Power Factor Correction

文件：2.70362 Mbytes Page：26 Pages

Compact Intelligent Power Module (IPM) Motor Control Development Kit (MDK) 1 kW

文件：2.79432 Mbytes Page：28 Pages