Chip Inductors

Industrial Property: Patents 6 (incl. pending) Non winding (RF, E) and wire wound type chip inductors for automatic mounting and high-density mounting ■Features ●High Q ●Good for mounting ●Wide allowable range (1.0 nH to 1000 µH) ■Recommended Applications ●CTV, VTR, HIC

High Frequency Use (Non Magnetic Core) RF, RE, ND, NC, NA RoHS compliant

High Frequency Use (Non Magnetic Core) RF, RE, ND, NC, NA ■ Features ● High frequency capability due to its non magnetic core. ● Capable of being Re-fl ow or fl ow soldered. ● Wide line-up from 1005 to 3225 case sizes. ● Good for mounting. ● RoHS compliant ■ Recommended Ap

High Frequency Use (Non Magnetic Core) RF, RE, ND, NC, NA

Features High frequency capability due to its non magnetic core. Capable of being Re-flow or flow soldered Wide line-up from 1005 to 3225 case sizes. Good for mounting. RoHS compliant Recommended Applications RF circuitry for cellular phones and wireless communication equipment

on-chip resistor NPN silicon epitaxial transistor For mid-speed switching

The CE1N2R is a transistor of on-chip high hFE resistor incorporating dumper diode in collector to emitter and zener diode in collector to base as protect elements. This transistor is ideal for actuator drives of OA equipments and electric equipments. FEATURES • On-chip zener diode for surge vol

on-chip resistor NPN silicon epitaxial transistor For mid-speed switching

FEATURES • On-chip zener diode for surge voltage absorption • On-chip bias resistor: R1 = 680 Ω, R2 = 10 kΩ • Low power consumption during driving: VOL = 0.3 V MAX.@V1 = 5.0 V, IC = 0.5 A • On-chip dumper diode for reverse cable

High Frequency Use High-Q (Non Magnetic Core) QF, QE

■ Features Capable of being Re-fl ow or fl ow soldered. Unique Ceramic Core/Laser-cut Technology. Non polarity product. High self resonance frequency. Good for mounting. RoHS compliant ■ Recommended Applications RF circuitry for cellular phones and wireless communication equipment

chip fuse

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Fixed Inductors (Chip Inductors)

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