Chip Inductors

Industrial Property: Patents 6 (incl. pending) Non winding (RF, E) and wire wound type chip inductors for automatic mounting and high-density mounting ■Features ●High Q ●Good for mounting ●Wide allowable range (1.0 nH to 1000 µH) ■Recommended Applications ●CTV, VTR, HIC

High Frequency Use (Non Magnetic Core) RF, RE, ND, NC, NA

Features High frequency capability due to its non magnetic core. Capable of being Re-flow or flow soldered Wide line-up from 1005 to 3225 case sizes. Good for mounting. RoHS compliant Recommended Applications RF circuitry for cellular phones and wireless communication equipment

High Frequency Use Non Magnetic Core RF RE ND NC NA

High Frequency Use (Non Magnetic Core) RF, RE, ND, NC, NA ■ Features ● High frequency capability due to its non magnetic core. ● Capable of being Re-fl ow or fl ow soldered. ● Wide line-up from 1005 to 3225 case sizes. ● Good for mounting. ● RoHS compliant ■ Recommended Ap

Fixed Inductors (Chip Inductors)

■ Features ● General use wire wound, resin molded chip inductor. ● Capable of being Re-fl ow or fl ow soldered. ● Wide line-up from 2520 to 4532 case sizes. ● Good for mounting. ● RoHS compliant ■ Recommended Applications ● AV equipment, Wireless communication equipment and various types of

High Frequency Use (Non Magnetic Core) RF, RE, ND, NC, NA

Features High frequency capability due to its non magnetic core. Capable of being Re-flow or flow soldered Wide line-up from 1005 to 3225 case sizes. Good for mounting. RoHS compliant Recommended Applications RF circuitry for cellular phones and wireless communication equipment

High Frequency Use (Non Magnetic Core) RF, RE, ND, NC, NA

Features High frequency capability due to its non magnetic core. Capable of being Re-flow or flow soldered Wide line-up from 1005 to 3225 case sizes. Good for mounting. RoHS compliant Recommended Applications RF circuitry for cellular phones and wireless communication equipment

High Frequency Use (Non Magnetic Core) RF, RE, ND, NC, NA

Features High frequency capability due to its non magnetic core. Capable of being Re-flow or flow soldered Wide line-up from 1005 to 3225 case sizes. Good for mounting. RoHS compliant Recommended Applications RF circuitry for cellular phones and wireless communication equipment

High Frequency Use (Non Magnetic Core) RF, RE, ND, NC, NA

Features High frequency capability due to its non magnetic core. Capable of being Re-flow or flow soldered Wide line-up from 1005 to 3225 case sizes. Good for mounting. RoHS compliant Recommended Applications RF circuitry for cellular phones and wireless communication equipment

High Frequency Use (Non Magnetic Core) RF, RE, ND, NC, NA

Features High frequency capability due to its non magnetic core. Capable of being Re-flow or flow soldered Wide line-up from 1005 to 3225 case sizes. Good for mounting. RoHS compliant Recommended Applications RF circuitry for cellular phones and wireless communication equipment

Chip Inductors

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Fixed Inductors (Chip Inductors)

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Fixed Inductors (Chip Inductors)

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Chip Inductors High Frequency Use (Non Magnetic Core)

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Fixed Inductors (Chip Inductors)

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Fixed Inductors (Chip Inductors)

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Fixed Inductors (Chip Inductors)

文件：203.67 Kbytes Page：8 Pages

Fixed Inductors (Chip Inductors)

文件：203.67 Kbytes Page：8 Pages

Fixed Inductors (Chip Inductors)

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Silicon Power Rectifiers

Edal Series F power rectifiers are stud mounted DO-5 packages. Because the silicon junction is carefully fitted within a glass-to-metal hermetically sealed case, reliable operation is assured, even with extreme humidity and under other severe environmental conditions. The series F power rectifiers

Wirewound Chip Inductors

FEATURES • SIZES K(0402), J (0603), D (0805) AND C (1008) • HIGH Q, HIGH CURRENT AND HIGH SRF CHARACTERISTICS • BOTH FLOW AND REFLOW SOLDERING APPLICABLE* • HIGH INDUCTANCE AVAILABLE IN SMALL SIZE • EMBOSSED PLASTIC TAPE PACKAGE FOR AUTOMATIC PICK-PLACE

Wirewound Chip Inductors

FEATURES • SIZES K(0402), J (0603), D (0805) AND C (1008) • HIGH Q, HIGH CURRENT AND HIGH SRF CHARACTERISTICS • BOTH FLOW AND REFLOW SOLDERING APPLICABLE* • HIGH INDUCTANCE AVAILABLE IN SMALL SIZE • EMBOSSED PLASTIC TAPE PACKAGE FOR AUTOMATIC PICK-PLACE

Photoconductive Cells and Analog Optoisolators (Vactrols)

Custom and Semi-Custom Devices Upon request, and where sufficient quantities are involved, PerkinElmer Optoelectronics will test standard parts to your unique set of specifications. The advantage of testing parts under actual operating conditions is predictable performance in the application. Pe

High Power Type PF, PE, PC, PA, PB

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