Features

• Epitaxial Planar Die Construction

• Complementary NPN Type Available (ZXTN26020DMF)

• Low Collector-Emitter Saturation Voltage, VCE(SAT)

• High Current Gain (hFE) at High IC

• Surface Mount Package Suited for Automated Assembly

• Ultra-Small Surface Mount Package

• Qualified to AEC-Q101 Standards for High Reliability

• Lead, Halogen and Antimony Free, RoHS Compliant (Note 1)

• “Green” Device (Note 2)

• ESD rating: 400V-MM, 8KV-HBM

Applications

• MOSFET and IGBT gate driving

• DC-DC conversion

• Interface between low voltage IC and Load

• Load disconnect switch